Category Archives: Materials and Equipment

North American-based manufacturers of semiconductor equipment posted $1.12 billion in orders in January 2008 (three-month average basis) and a book-to-bill ratio of 0.89. A book-to-bill of 0.89 means that $89 worth of orders were received for every $100 of product billed for the month.

(February 26, 2008) NEWPORT, WALES and ATLANTA, GA &#151 Surface Technology Systems (STS)announced that Georgia Institute of Technology (Georgia Tech) ordered a Pegasus Deep Reactive Ion Etch (DRIE) tool for their new Nanotechnology Research Center Building (NRCB), which is due for completion in fall 2008. Georgia Tech is the first university to acquire the latest generation of STS’ advanced silicon etch (ASE) systems.

Feb. 26, 2008 – Rohm and Haas Electronic Materials and IBM have agreed to jointly develop patterning materials and processes to enable implant at and below the 32nm node.

Implant technology will play an increasingly critical role at the 32nm node and below — the companies claim in a statement that ~40% of photo levels in advanced logic will be implant — but controlling implants in junction formation also is becoming increasingly challenging as designs shrink. “Finding the right solutions to difficult technical challenges for the next-generation nodes depends not only on strong engineering and design but also close collaboration with leaders in the semiconductor industry,” stated James Fahey, president of microelectronic technologies for Rohm and Haas Electronic Materials. “Partnering with IBM will accelerate the development of new materials and ensure that we are on track to meet the needs for 32nm and 22 nm nodes.”

Work will take place at IBM’s facilities in East Fishkill, Yorktown, and Albany, NY, as well as Rohm and Haas Electronic Materials’ Advanced Technology Center in Marlborough, MA, where a new ultrahigh-NA 193nm immersion cluster is expected to be ready by June 2008.

Under the membership agreement, Rudolph and SEMATECH will jointly establish an International Process Characterization (IPC) program, aimed at the development of process, analysis, and characterization technology to address critical challenges in nanoelectronics research.

(February 21, 2008) — MEPTEC, the MicroElectronics Packaging and Test Engineering Council, has finalized the program for its 4th Annual Thermal Management symposium titled “The Heat Is On: Thermal Technology Solutions for Advanced Products.” This one-day technical event will be held on February 28, 2008, at the Wyndham Hotel, San Jose, CA.

The one-day technical symposium will begin with a keynote presentation given by Joseph Fjelstad, President, Verdant Electronics. Fjelstad will review some of the innovative ways that thermal management engineers have responded to thermal challenges over time, in his presentation, “Beating the Heat

Feb. 20, 2008 – New data from SEMI and the Semiconductor Equipment Association of Japan (SEAJ) fuels continued concerns of a soft investment climate among global chipmakers.

Orders for Japan-made semiconductor manufacturing equipment (a three-month moving average) were ¥139.7B (US $) in January, a 4.4% dip from December but down 35% from a year ago. Sales were ¥138.2B ($), up 3% M-M and down ~7% Y-Y.

The book-to-bill ratio (B:B) dropped to 0.91, from 0.99 in December, meaning ¥91 worth of new orders was received for every ¥100 of product billed in the month, remaining below the 1.0 parity mark for the seventh straight month, noted Dow Jones.

Many emerging technologies used for both the wiring and dielectric passivation layers in IC devices may only last a few generations, resulting in continued revenue growth of new materials. For many process steps, materials that are used for the 90nm and 65nm generations will continue to be used at the 45nm and 32nm generations. But as devices reach smaller geometries, many processes and materials have been pushed to the physical limits of their performance and will need to be replaced with more robust materials, or those that allow larger process windows.

(February 20, 2008) Research Triangle Park, NC — Semiconductor Research Corp. (SRC), a university-research consortium for semiconductors and related technologies, has announced that the College of Nanoscale Science and Engineering (CNSE) of the U. at Albany will serve as headquarters for a comprehensive research effort aimed at enabling nanoelectronics advances that are critical for the development of smaller, faster and cheaper computer nanochips amid the approaching limits of interconnect scaling.

The $7.5 million, three-year program, which is funded jointly by SRC and New York State, begins this month, with the UAlbany NanoCollege serving as home for the New York Center for Advanced Interconnect Science and Technology (NY CAIST). In addition to CNSE, universities contributing to the research results will be Columbia University, Cornell University, Lehigh University, Massachusetts Institute of Technology (MIT), Penn State, Rensselaer Polytechnic Institute (RPI), Stanford, SUNY Binghamton, University of Florida, University of Maryland, University of North Texas, University of Texas at Arlington, and the University of Texas at Austin.

(February 21, 2008) Flanders, NJ and Albany, NY — Rudolph Technologies Inc. and SEMATECH, have announced that Rudolph has become the first semiconductor equipment supplier company to join SEMATECH’s Metrology Program headquartered at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.


Nanocomp’s scalable processes can produce sheets of tens of square feet. (Photo: Nanocomp Technologies)

February 20, 2008 — Nanocomp Technologies Inc., a developer of next-generation performance materials, announced that it has successfully produced 3-foot by 6-foot sheets of carbon nanotube material.

At the core of Nanocomp’s process is a technology for continuous, high-volume output of millimeter-long, highly pure carbon nanotubes that efficiently conduct both heat and electricity. By bringing this technology to practice using proven, scalable industrial processes, Nanocomp can now produce sheets of material at contiguous sizes of tens of square feet.

In contrast to Nanocomp’s millimeter-long nanotubes, other carbon nanotubes are short — tens of microns long — and are usually delivered in powder form. Short nanotubes have limited industrial use because they are difficult to incorporate into existing manufacturing processes and do not possess the high performance properties of long carbon nanotubes.

by Katherine Derbyshire, Contributing Editor, Solid State Technology

Though the vast majority of solar cells depend on p-n junctions in inorganic semiconductors, the limitations of those cells have inspired researchers to investigate a variety of alternate means for harnessing the sun’s energy. Thermophotovoltaic systems drive turbines with heat that would otherwise be lost. Organic semiconductors raise the intriguing possibility of liquid photovoltaics, as easy to apply as house paint. And dye-sensitized solar cells (DSSCs), one of the most successful alternative designs, depend on a mechanism that, according to inventor Michael Grätzel, is more akin to photosynthesis than to conventional photovoltaics.

Light absorption is a substantial challenge for any solar cell. Junction-based cells are most efficient when incoming light matches the material’s band gap. Light with less energy fails to excite free carriers; when light has more energy, the excess dissipates as heat. The DSSC, in contrast, separates light absorption from charge generation and transport. A dye layer, usually based on ruthenium-polypyridine compounds, absorbs light across a broad section of the solar spectrum. Excited electrons are then injected into a semiconductor. Grätzel’s innovation was the use of a semiconducting nanoporous TiO2 layer. This structure’s large surface area accommodates more dye-infiltration than a dense film, and thus more carrier injection. The electrons make their way through the TiO2 to one of the terminals of the cell.

As researchers at the U. of California/Berkeley, pointed out, electron transport through nanoparticle clusters is slow. One proposed scheme substitutes an array of crystalline ZnO nanowires, allowing much faster electron transport. 1 Though interesting, the Berkeley structures achieved about one-fifth the surface area of nanoparticle films, and only 1.5% efficiency.

Another approach, investigated by Athanassios Kontos and colleagues at the Athens Institute of Physical Chemistry, combines titania powder with a titanium alkoxide sol in an attempt to produce a more homogenous mixture. Their cells achieved 1.9% efficiency, a substantial improvement over cells prepared with titania powder alone. 2

Injecting electrons into the semiconductor leaves the dye with a surplus of holes, and a net positive charge. An electrolyte solution, usually based on the iodide/tri-iodide (I-/I3) redox pair, replenishes the dye with electrons, becoming positively charged. The electrolyte transports the excess holes from the dye to the counter electrode, returning itself to the electron rich state.

Dye-sensitized cells have achieved efficiencies as high as 11%, comparable to many thin-film inorganic technologies. However, the best cell designs are poorly suited to the rigors of long-term outdoor installations. For example, the iodine-based electrolyte is a volatile liquid. Without adequate sealing, it leaks, decomposes, and evaporates.

Yet achieving high efficiency in commercially interesting cell designs has been challenging. Other materials struggle to match the performance of liquid electrolyte. The ionic conductivity of the electrolyte defines the rate at which the dye can replenish its supply of carriers — if the ionic conductivity is too low, current generation is transport-limited and the thickness of the cell must be reduced to compensate. Yet thinner cells absorb less light and yield less photocurrent. Similarly, the interface conductivity between the dye-impregnated TiO2 structure and the electrolyte limits the performance of the cell. Liquid electrolytes can conform to the complex nanostructure.

Several groups have attempted to solidify the liquid electrolyte. For example, researchers at the Chinese Academy of Sciences (Beijing) mixed imidazole polymers with iodine and lithium iodide to form a freestanding gel. Clamping the material between the dye-sensitized TiO2 electrode and a counter electrode allowed the gel to conform to the pore structure. Unfortunately, the diffusion constant of tri-iodide decreased rapidly as gel viscosity increased. Ions move by diffusion, so this behavior degraded the ionic conductivity as well. Still, the group’s results were promising, with reported efficiencies as high as 7.6%. 3

To summarize, DSSCs that deliver high efficiency in a practical, manufacturable package remain elusive. Still, optimized semiconductor structures and gel electrolytes suggest promising directions for further study. If these challenges can be met, these cells may offer a cost-effective alternative to traditional junction-based photovoltaics. K.D.


1 Matt Law, et al., “Nanowire dye-sensitized solar cells,” Nature Materials, vol. 4 pp 455-459 (2005).

2 Athanassios I. Kontos, et al., “Nanostructured TiO2 films for DSSCS prepared by combining doctor-blade and sol