Category Archives: Materials and Equipment

Mar. 15, 2007 — A new study by London, England-based Cientifica, the first in the Nanotech:Cleantech series, identifies six key ways in which nanotechnology is contributing to the reduction of carbon emissions. The technologies discussed in this report&#8212available for free on Cientifica’s site&#8212are all available now or within the next two years, and some have been making stealthy inroads into global industry for as long as a decade.

Growing concern over climate change driven by man-made carbon emissions is prompting governments worldwide to look at ways of stabilizing or reducing their carbon footprint. The United Kingdom unveiled plans to set a “legally binding” target to cut carbon emissions by 60% by 2050 and the European Union has agreed to cut emissions by 20% between now and 2020.

Cientifica CEO Tim Harper commented, “All of the key applications are related to our enhanced control of materials at the nanoscale, whether lighter stronger materials for transportation, better thermal insulators or more efficient ways of storing energy. The key players read like a Who’s Who of global industry. “

Cientifica research director Hailing Yu added “combining Cientifica’s technology diffusion and impact models with global emissions data allows the quantification and comparison of the impact of nanotechnologies on a country by country or industry basis.”

March 14, 2007 – Packaging equipment developer NEXX Systems has entered into an ongoing joint development program (JDP) with Taiwan Semiconductor Manufacturing Company Ltd. (TSMC).

The JDP represents a collaborative effort to assess, develop, optimize, manufacture, and/or market electrodeposition processes using NEXX’s Stratus system, including through silicon vias (TSV), wafer-level chip-scale packaging, and redistribution layers. In support of this effort, NEXX will both deliver a Stratus 300 automated electrodeposition system to TSMC’s Fab 7 in Hsinchu and provide process development experts to carry out the development work in conjunction with TSMC’s local experts.

“The Stratus will provide TSMC a proven means of filling TSVs that is both cost-effective and high yielding,” states Arthur Keigler, vice president of technology at NEXX Systems. “NEXX is pleased to participate in TSMC’s program for creating chip-stacking technologies that enable high-performance compact devices.”

The managers of the bumping department at TSMC add, “We are pleased to be working with NEXX Systems to build our capabilities for TSVs, wafer-level chip-scale packaging, especially in low-cost solutions. We recognize the unique low cost benefits with high performance the Stratus system offers for these applications.”

By Tom Cheyney
Small Times Contributing Editor


Flexible large area printed semiconductor device (Photo: Nanoident)

Mar. 13, 2007 — Nanoident has opened “the world’s first dedicated manufacturing facility for printed organic semiconductors” in Linz, Austria. In conjunction with the plant opening, the company has also launched its Semiconductor 2.0 platform, the “core technology foundation for a wide array of application-specific printed semiconductor products,” including photodetectors, biometric and chemical sensors, OLEDs, and photovoltaic cells.

The company started building its organic fab, or OFAB, in late 2005. The facility, located on Nanoident’s headquarters campus, measures 850 sq meters (9150 sq ft) and includes 250 sq meters (2700 sq ft) of Class 100 cleanroom. Equipment purchases accounted for most of the 10 million Euro spent on the OFAB, according to Wasiq Bokhari, CEO of Nanoident’s U.S. subsidiary, Bioident.

Rather than using traditional chipmaking techniques, the company employs an advanced inkjet-printing process, which can deposit specialized inks onto flexible and rigid substrates, including various polymers, glass, and silicon. The current process can print feature sizes down to the tens of microns on 30 x 30-cm-square substrates as thin as 20 microns, with film thickness of about 300 nm for a typical four-layer device, according to Bokhari.

“We work with different kinds of inks, to get different properties and sensitivities,” he explains. “We can add carbon nanotubes or other nanomaterials, mix and match to create more complex structures to make highly customized, highly specific semiconductors. You can design a new application and have it volume manufactured in a very short time, in a matter of hours or days. It opens the whole idea of just-in-time production. These things are not possible for a traditional semiconductor fab.”

With output volumes for the initial production line in the thousands of sq meters per year, the company’s goal is to hit 100,000 sq meters within a year. Ultimate capacity could reach 100,000 sq meters per hour, once OFAB transitions from sheet-fed or batch processing to roll-to-roll (R2R) manufacturing, says Bokhari.

“One of the beauties of printed electronics is scalability.” Although the fab has one printer line, it “could have three to four lines, and could be scalable by adding different lines or by changing the printer system. We have the flexibility to do both, depending on market demand.”

Gartner Dataquest’s Dean Freeman believes there is a “latent need in the marketplace” for “a flexible or printable detector” and that fabricating such devices is easier than “trying to build an integrated circuit on plastic.” But he does see manufacturing issues ahead for Nanoident.

“Probably the biggest is ramping from the R&D/pilot-line phase into the production phase. Pilot-line Q&A is much easier,” Freeman notes. “The biggest issue [with the transition from batch to R2R] will most likely be the drying and curing times needed before the next level can be deposited.”

The company has been working diligently on process development and yields for the past three years, says Bokhari. Yields are “very device dependent,” and are also a function of the “complexity of the whole system, not just the devices you’re printing but everything you’re printing around it, as well as the materials details—substrates, inks, the whole stack you’re building.”

“For each of the specific components—substrate, materials, specific devices—we’ve been working on all of these different combinations to get a good handle on what the yields are, and how to improve them. One of the main things about this fab will be that as we ramp up into higher production levels, then it will help us improve on yields because we will be tuning and optimizing the process.”

Bokhari says the company will deliver the products manufactured at OFAB to its internal family of subsidiaries. For example, Bioident will offer what he calls a “radically simplified” lab-on-a-chip solution: low-cost devices for mobile analyses and in-vitro diagnostics, fabricated with the company’s Semiconductor 2.0-based PhotonicLab platform for printed photodetectors.

NanoMarkets forecasts explosive growth in the overall global printable electronics market, which includes sensors, displays, signage, RFIDs, smart cards, and other products. Total sales could reach nearly $1.7 billion in 2008 and approach $21 billion in 2012, with most of the devices printed on plastic substrates, according to the industry analyst firm.


The JSM-7001F characterizes nanostructures with a resolution of 1.2nm at 30kV. (Photo: JEOL)

Mar 13, 2007 — A new thermal field emission analytical SEM from JEOL, the JSM-7001F, promises high resolution micrographs at up to 1,000,000X for applications ranging from semiconductor, metals, minerals, materials, and ceramics, to non-conductive biological samples.

The JSM-7001F features an in-lens field emission gun that delivers more than 200 nA of beam current to the sample. An extremely small probe diameter at low kV and high current is optimal for characterization of nanostructures with a resolution of 1.2nm at 30kV. The JSM-7001F targets low accelerating voltage X-ray spectroscopy and crystallography at and below the 100nm scale.

The large specimen chamber&#8212designed for samples up to 200mm in diameter&#8212accommodates a wide variety of detectors simultaneously. These include multiple EDS, WDS, EBSD, STEM, BSE, CL, EBIC, and IR camera. The SEM can also be equipped as a dual column FIB or an e-beam lithography tool.

The SEM comes with a choice of three stage sizes and exchange chambers, and a new 5-axis automated stage. It can be configured for both high vacuum and low vacuum operation.

The system’s Windows XP interface was designed for ease of operation and image analysis. Users can choose to display up to four live images on the screen, as well as live signal mixing.

March 12, 2007 – Qimonda AG, the former memory unit of Infineon, has announced the planned expansion of its existing facility for the assembly and testing of memory ICs (backend) in China’s Suzhou Industrial Park, located 80 km west of Shanghai. Qimonda says it will construct a second building, doubling the factory’s capacity, beginning this month. Investment in construction of new facility, including infrastructure, production equipment, and IT, amounts to around €250 million over the next three years. The expansion adds to the ongoing investment in the existing manufacturing facilities in Suzhou Industrial Park.

The backend facility in Suzhou is a joint venture of Qimonda AG and China-Singapore Suzhou Industrial Park Venture Co (CSVC) Ltd., set up in 2003, and operates under the name of Qimonda Technologies (Suzhou) Co. Ltd.

The new site is expected to be ready for equipment installation by late 2007. A new cleanroom of 10,000 sq. meters will be added to the existing cleanroom of the same size. The expansion will also increase headcount to more than 3,000 employees (current staff numbers about 1,700).

“Growth in our frontend capacities, with more than two-thirds of our DRAM bits shipped now produced on 300mm manufacturing lines, clearly requires an increase in our backend capacities. With the expansion in Suzhou we are now excellently set up to further leverage our competitive advantage in 300mm manufacturing,” says Kin Wah Loh, president and CEO of Qimonda.

Qimonda has access to five 300mm manufacturing sites on three continents and currently uses four sites for backend manufacturing (located in Suzhou, Malaysia, Portugal, and Germany).

March 12, 2007 – Private equity firm CCMP Capital has reached agreement with The Linde Group, the global gases company, to acquire BOC Edwards, a leading manufacturer of vacuum equipment. The deal is valued at just over US$900M.

BOC Edwards was put up for sale after the Linde Group acquired The BOC Group about a year ago. (See “BOC agrees to Linde takeover, creating gas giant,” WaferNews, March 7, 2006.) Linde announced in September that it intended to focus on its global gases operations and would review strategic options for the divestment of BOC Edwards.

The sale was reached through afilliates of CCMP Capital Advisors and CCMP Capital Asia, international private equity firms. CCMP Capital is only acquiring the main vacuum and semiconductor equipment business of BOC Edwards. The pharmaceutical division will remain a subsidiary of The Linde Group.

Nigel Hunton, chief executive of BOC Edwards, said: “We are delighted to welcome CCMP as our new partners. We feel they have a real understanding for our business and its potential and that their financial strength and scale will support the company as we develop our operations worldwide and capitalise on our strong market position.”

Stephen Welton from CCMP Capital Advisors added: “We believe that under CCMP’s ownership BOC Edwards can move to a new level as an independent company and develop its technology in new markets whilst retaining leadership in its core areas.”

The companies expect to close the transaction between the beginning of May and the end of June, subject to regulatory review and customary closing conditions. Financing for the transaction will be provided by Deutsche Bank, Lehman Brothers, Barclays Bank, and The Royal Bank of Scotland. Lehman Brothers is serving as the exclusive mergers and acquisitions advisor to CCMP Capital.

For other related stories from the past year about BOC Edwards, go to:

Commentary on how consolidation has struck in another segment of suppliers to the chipmaking industry. WaferNews, March 13, 2006

“Report: AMAT, Unaxis eyeing BOC unit sale,” WaferNews, July 24, 2006.

For more on the role private equity is playing in the semiconductor industry, go to:

“Reverse IDM” reintegration: The semiconductor industry’s next paradigm shift?” WaferNews, February 13, 2007.

Mar. 8, 2007 — Nanosys, Inc. has entered into a collaboration agreement with Rockwell Collins Display Systems (“RCDS”), a division of Rockwell Collins Aerospace and Electronics Inc., to incorporate Nanosys’ nanostructure device technology for use in avionics display systems. RCDS will fund joint development at RCDS and Nanosys, and Nanosys will manufacture and supply a proprietary nano-enabled optical subsystem to RCDS.

March 2, 2007 – Varian Semiconductor Equipment Associates Inc. says it has increased the amount of funds to expend in its stock repurchase program from $300 million to $400 million, about half of which remains available for purchases.

Timing and quantity of any repurchases will be determined by management based on market conditions and other factors, or under a Rule 10b5-1 plan. To date the company has spent about $200 million on the program.

With a current stock price of 47.10, the repurchase would represent reabsorption of ~4.2 million shares, or an extra ~7.6% ownership based on about 54.9 million outstanding shares at the start of February, according to SEC filings.


Nano-piezotronics uses piezoelectric and semiconducting properties to produce novel components. (Photo: Georgia Tech)

Mar. 1, 2007&#8212Researchers at the Georgia Institute of Technology have taken advantage of the unique coupled semiconducting and piezoelectric properties of zinc oxide nanowires to create a new class of electronic components and devices that could provide the foundation for a broad range of new applications.

So far, the researchers have demonstrated field-effect transistors, diodes, sensors, and current-producing nanogenerators¿that operate by bending zinc oxide nanowires and nanobelts. The new components take advantage of the relationship between the mechanical and electronic coupled behavior of piezoelectric nanomaterials, a mechanism the researchers call “nano-piezotronics.”

“Nano-piezotronics utilizes the coupling of piezoelectric and semiconducting properties to fabricate novel electronic components,” said Zhong Lin Wang, a Regents Professor in the School of Materials Science and Engineering. “These devices could provide the fundamental building blocks that would allow us to create a new area of electronics.”

For example, in a nano-piezotronic transistor, bending a one-dimensional zinc oxide nanostructure alters the distribution of electrical charges, providing control over the current flowing through it. By measuring changes in current flow through them, piezotronic sensors can detect forces in the nano- or even pico-Newton range. Other piezotronic sensors can determine blood pressure within the body by measuring the current flowing through the nanostructures. And, an electrical connection made to one side of a bent zinc oxide nanostructure creates a piezotronic diode that limits current flow to one direction.

The nano-piezotronic mechanism takes advantage of the fundamental property of nanowires or nanobelts made from piezoelectric materials: bending the structures creates a charge separation – positive on one side and negative on the other. The connection between bending and charge creation has also been used to create nanogenerators that produce measurable electrical currents when an array of zinc oxide nanowires is bent and then released.

Development of a piezotronic gated diode based on zinc oxide nanowires was reported February 13 in the online advance issue of the journal Advanced Materials. Other nano-piezotronic components have been reported in the journals Nano Letters and Science. The research has been sponsored by the National Science Foundation (NSF), Defense Advanced Research Projects Agency (DARPA), the National Institutes of Health (NHI) and NASA.

“The future of nanotechnology research is in building integrated nanosystems from individual components,” said Wang. “Piezotronic components based on zinc oxide nanowires and nanobelts have several important advantages that will help make such integrated nanosystems possible.”

These advantages include:

* Zinc oxide nanostructures can tolerate large amounts of deformation without damage, allowing their use in flexible electronics such folding power sources.
* The large amount or deformation permits a large volume density of power output.
* Zinc oxide materials are biocompatible, allowing their use in the body without toxic effects.
* The flexible polymer substrate used in nanogenerators would allow implanted devices to conform to internal structures in the body.
* Nanogenerators based on the structures could directly produce power for use in implantable systems.

In comparison to conventional electronic components, the nano-piezotronic devices operate much differently and exhibit unique characteristics. In conventional field-effect transistors, for instance, an electrical potential – called the gate voltage – is applied to create an electrical field that controls the flow of current between the device’s source and its drain. In the piezotronic transistors developed by Wang and his research team, the current flow is controlled by changing the conductance of the nanostructure by bending it between the source and drain electrodes. The bending produces a “gate” potential across the nanowire, and the resulting conductance is directly related to the degree of bending applied.

“The effect is to reduce the width of the channel to carry the current, so you can have a 10-fold difference in the conductivity before and after the bending,” Wang explained.

Diodes, which restrict the flow of current to one direction, have also been created through nano-piezotronic mechanisms to take advantage of a potential barrier created at the interface between the electrode and the tensile (stretched) side of the nanowire by mechanical bending. The potential barrier created by the piezoelectric effect limits the follow of current to one direction.

Nanogenerators, which were announced in the April 14, 2006 issue of the journal Science, harvest energy from the environment around them, converting mechanical energy from body movement, muscle stretching, fluid flow or other sources into electricity. By producing current from the bending and releasing of zinc oxide nanowires, these devices could eliminate the need for batteries or other bulky sources for powering nanometer-scale systems.

Piezotronic nanosensors can measure nano-Newton (10 -9) forces by examining the shape of the structure under pressure. Implantable sensors based on the principle could continuously measure blood pressure inside the body and relay the information wirelessly to an external device similar to a watch, Wang said. The device could be powered by a nanogenerator harvesting energy from blood flow.

Other nanosensors can detect very low levels of specific compounds by measuring the current change created when molecules of the target are adsorbed to the nanostructure’s surface. “Utilizing this kind of device, you could potentially sense a single molecule because the surface area-to-volume ratio is so high,” Wang said.

As micro- and nanotechnologies begin to mature, industry salaries increase

By Elizabeth Gardner

Want to know where you stand, in salary, benefits, and bonuses, compared to your small-tech colleagues worldwide? The results of the second-annual Small Times compensation survey shows average small-tech salaries up about 12 percent worldwide.

The survey data was gathered from visitors to Small Times’ Website (www.smalltimes.com) from late December 2006 to early January 2007. The survey attracted 849 responses from 44 countries (up from 37 in 2006), and 41 U.S. states plus the District of Columbia.

Overall, compensation has risen. The average reported salary globally is $96,000, up from nearly $85,000 last year, and the average U.S. salary is $106,000, up from $98,000 last year.

More than half the respondents-56 percent-report that their jobs involve both micro- and nanotechnology. The remainder of the respondents are evenly split between micro-only and nano-only.

Changes in hiring

The technologies as well as hiring practices are starting to mature, even in the smallest of companies. Those who follow the field say that although plenty of person-to-person networking is still going on, it’s more likely that companies are finding new people through newspaper ads, Web job boards, and executive recruiters-and less likely that a newly minted Ph.D. will be exactly what they’re looking for.

Pam Bailey, president of tinytechjobs.com, a job board for the small-tech fields, says there’s been a noticeable increase in postings from companies looking for mid-level technical workers. “In 2005, we saw many more senior-level positions,” she says. “Companies were hiring their thought leaders. In 2006, after those companies obtained funding, they started to build out.” Almost 70 percent of postings on tinytechjobs.com are for scientific or engineering openings. The balance of postings are in product development and manufacturing (a growing area, Bailey says), sales or business development, and academic or government lab research.

Click here to enlarge image

Neil Kane, president of Advanced Diamond Technologies, Romeoville, Ill., has recently ramped up to 11 employees for his young company, which was born out of work in ultrananocrystalline diamond coatings at Argonne National Laboratory. The company recently received a $500,000 National Science Foundation small-business grant to develop UNCD-enhanced seals for pumping applications, and it expects to introduce a diamond-based MEMS product sometime this year.

Kane has advertised for employees in a variety of venues, including Craigslist, tiny techjobs.com, and the Chicago Tribune.

“There are a lot of qualified people with academic backgrounds,” he says. “The overwhelming majority of responses are either recent grads or people coming out of post-doc positions. But we’ve evolved to the point where that’s less interesting and a demonstrated track record is much more important. The company is making the transition from development to shipping products, and we need people who have expertise in managing projects and working in a deadline-oriented environment.”

Kane plans to level off ADT at about 15 employees by year-end and then add employees only as business growth demands them.

Steve Johns, head of corporate and business development at venture capital firm Ardesta, in Ann Arbor, Mich., has helped grow more than a dozen portfolio companies out of infancy and into adolescence, including Sensicore, Discera Inc., and Sensicast. He, too, is looking for people with more experience. “In an early stage technology start-up, [hiring] a Ph.D. student out of a university is almost preferable, because the first work he’ll do is basically an extension of their research,” he says. “But now all of our companies are focused on commercializing that technology and dealing with issues like repeatability and scalability, so we’re looking for people from a commercial environment who have experience taking something all the way to a product. These aren’t research projects anymore.”

For its top managers, Ardesta has had good luck with both large and smaller recruiting firms and favors those who specialize regionally as well as by industry. Johns says many positions are still filled by tapping into personal networks.

Carbon nanotubes have made significant strides toward commercial viability in the past couple of years. This trend has benefited companies such as Nantero, Woburn, Mass., which has grown beyond the point where it can rely on the employees’ personal networks to fill all vacancies. Now at about 40 employees, Nantero is using carbon nanotubes to develop next-generation semiconductor devices and recently patented a technique to position them reliably on silicon wafers-a major step in developing industrial-scale production techniques.

Chief executive Greg Schmergel, who gained his start-up experience in the dot-com boom, hopes to hire at least half a dozen more employees by year-end. “We have employees from all over the world-Asia, Europe, and the U.S.-which is testament to the fact that we have to cast our net very wide to find the people we need,” he says. Schmergel favors both boutique recruiters who specialize in small tech and, perhaps counterintuitively, the large Web job boards like Monster and Hotjobs.

“Maybe we have better success because if someone goes on one of those sites and types in ‘nanotechnology,’ they don’t get very many hits,” Schmergel says.

Analysis overview

The Small Times compensation survey asked 24 questions covering job title, company size, location, level of education, experience, hours worked, salary, bonuses, and benefits. Seventy-two percent of respondents are from the U.S. (almost identical to last year), with the balance from 44 other countries, from Australia to Zimbabwe. The respondents are highly educated: 31 percent hold master’s degrees, and 42 percent hold doctoral degrees-up from 36.7% last year. “This may help explain the overall salary increase from 2006,” says Small Times publisher Patti Glaza.

The group is weighted toward executives and researchers. Forty-four percent are in management: 17 percent are C-level executives (CEOs, CFOs, CTOs, etc.), while 8 percent are at the vice-president level and another 20 percent are managers. About 33 percent of respondents report their title as scientist, engineer, or researcher. These breakdowns are consistent with the 2006 data.

The respondent group is 86 percent male. The female respondents are on the young side; about half earned their bachelor’s degree during the 1990s or 2000s. Fewer of the male respondents, 37 percent, earned their bachelor’s degree in those same decades; 46 percent completed theirs in the 1970s or 1980s.

The majority of survey respondents’ employers are either very small or very large firms. Thirty-seven percent work for companies with 50 or fewer employees, and 31 percent work for employers with more than 2,500 employees.

Private-sector workers predominate. Sixty-five percent of respondents report being employed by manufacturers (13 percent), engineering or design firms (12 percent), corporate research and development (12 percent), materials or instrument suppliers (10 percent), micro/nano component integrators (4 percent), or a service firm such as law, consulting, or marketing (10 percent). In the public sector, 20 percent of respondents work in education or university research, and 6 percent worked in government labs.

Executive compensation-global and U.S.

Just as last year, the title of “Partner” is associated with the highest average compensation this time around. The partner respondents are generally involved with either law firms or consulting firms.

Among C-level executives globally, two categories-chief technical/science officers and CFO/COO/chief marketing officers-report higher average salaries than the president/CEO/managing director category (see chart on page 29). However, there were relatively few respondents in the CFO/COO/chief marketing officer and CTO/CSO categories, and the small numbers may skew the reported average salaries.

Only 42 percent of chief executives report receiving a bonus in 2006; among those who did, the average was $50,000.

Click here to enlarge image

A few chief executives report receiving bonuses in seven figures-happy news for them, but bad news for survey number-crunchers who compute average compensation. To keep the averages from being misleadingly large, and causing unwarranted bitterness in the small-tech community over the size of its bonuses, Small Times dropped these “outliers” when it was computing the bonus averages. In fact, bonuses worldwide range from less than $100 to a robust $3 million. The median bonus reported by respondents for 2006, both globally and in the U.S., is $7,000, for all categories of companies and job titles.

Further down the management ladder, vice presidents of technology and related functions out-earn vice presidents of marketing, sales, operations, and business development, reflecting again the industry’s overall valuation of technical expertise. Technical managers were also a couple of rungs above operational managers.

For respondents from the U.S. only, salaries are significantly higher for CTO/CSOs, at an average of $157,000. U.S. CEOs make slightly more than the global average, at $132,000. Chief operating officers, marketing officers, and financial offers make slightly less on average compared with the global group, at about $137,500.

Engineer/researcher compensation-global and U.S.

Among the employees who make up the technological backbone of small-tech employers worldwide-the engineers, the scientists, and the researchers-engineers report both the highest 2006 salaries, with an average of $83,000, and the largest 2006 bonuses, at an average of 16 percent of salary. Scientists worldwide make an average of $77,000, with a bonus of seven percent of salary, and researchers make $70,000, with a bonus of 11 percent.

Corporate research and development operations pay the highest average salary to this category of workers, at just over $97,000, followed by materials and tools suppliers, industry or government organizations, and component manufacturers, all in the low $90,000s. University researchers aren’t starving, at an average salary of almost $80,000, but their pay still isn’t up to that in the private-sector level.

Click here to enlarge image

U.S. respondents report higher salaries than the global average, but the overall pattern is the same. Engineers report $94,000 in salary with an average bonus of 17 percent. Scientists report average salaries of $90,000 with a seven percent bonus, and researchers report average salaries of $80,000 with a nine percent bonus.

Education and age – global and U.S.

Both worldwide and in the U.S., salaries and bonuses generally increase with education.

Those who hold a bachelor degree in science report an average salary of $86,000. Holders of M.S. degrees reported an average salary of $91,000. Holders of Ph.D., J.D., and M.D. degrees report an average salary of $102,500. Average bonuses follow a similar pattern.

Click here to enlarge image

Survey respondents with an associate degree and master of arts degree report compensation that appears unusually large compared with that of other degree holders (for example, the average salary for those with an associate degree was only a few hundred dollars less than the average for those with a bachelor of science degree). However, both those figures are probably anomalous, stemming from the low number of respondents holding those degrees (only three percent of respondents hold an associate degree).

Those with associate degrees and M.A. degrees are disproportionately represented among sales and marketing job titles. And M.A.s account for 13 percent of those who hold the title of president, CEO, or managing director-but less than five percent of survey respondents overall.

Click here to enlarge image

The bulk of respondents received their degrees in the 1990s (27 percent), the 1980s (28 percent), or the 1970s (20 percent). More-recent graduates account for 15 percent of the respondents.

For the most part, age equates to earning power. Employees who earned their bachelor’s degree in the 1960s have the highest salaries of any age group, with an average of $135,000. New graduates earn less than half that, at $65,000, and average salaries climb steadily with each decade.

Hours worked-U.S. and global

Small-tech workers work hard. Globally, 75 percent of respondents work more than 40 hours a week, and 31 percent report working more than 50 hours weekly. Nine percent work more than 65 hours. Perhaps the most industrious group is in India, where a full 20 percent of respondents report working more than 65 hours a week.

Click here to enlarge image

In the U.S., 77 percent of respondents report working more than 40 hours a week, and 30 percent work more than 50 hours. Eight percent work more than 65 hours a week.

Those putting in the longest hours are more likely to be at a lab bench than a desk: 14 percent of university researchers fall into the more-than-65-hours category, as do 10 percent of those who work for component manufacturers.

Not surprisingly, the people at the top put in the most grueling hours on average: One-third of presidents and CEOs work more than 50 hours a week. Other C-level employees report similar schedules. Engineers and scientists are more likely to make it home for dinner: less than 10 percent work more than 50 hours a week, and about 75 percent work between 36 and 50 hours.

Regional variations-U.S.

Respondents from the U.S. are scattered throughout the country. While the West Coast is home for 29 percent of those who specified a state, other regions aren’t far behind: 23 percent are from the South, 22 percent from the Northeast, and 18 percent from the Midwest. Eight percent are from the Mountain States.

Small-tech geographic salary patterns mirror those in the larger economy, according to the U.S. Bureau of Labor Statistics. Respondents in the Pacific region report the highest average salary, at $115,000. The Northeast was slightly less, at $112,000, followed by the South, at $97,000, the Midwest, at $95,000, and the Mountain States, at $93,000.

Click here to enlarge image

On the other hand, the Northeast reports the highest 2006 bonuses, with an average of almost $30,000, followed by the Pacific and the South at $25,000 each, the Midwest at $12,000, and the Mountain States at $8,600.

Time in organization-U.S.

For U.S. employers, longevity means more money, but only up to a point. The sweet spot for compensation among survey respondents is 11 to 20 years with an organization, which nets an average salary of $125,500. For tenures of 21 to 30 years, the average salary drops to $110,000, and for more than 30 years, it pops back up to $116,000.

Respondents who have been with their companies from one to five years report an average salary of about $97,000, and from six to ten years, $105,000.

Benefits-U.S.

Down slightly from 2006, 86 percent of U.S. respondents report that their employers offer health insurance. Manufacturing companies and educational institutions are slightly more likely to offer health insurance, while consulting and sales companies are somewhat less likely to do so. Seventy-seven percent of respondents say their employers offer dental insurance.

Click here to enlarge image

Only 29 percent of respondents report receiving stock options as an employee benefit, down from last year’s survey in which 33 percent of participants said they received stock options. Of those who report receiving them this year, 22 percent work for a component manufacturer or fabricator, 22 percent work for a supplier of materials or tools, and 19 percent work in a corporate research and development laboratory.

Ardesta’s Johns says the jury is still out on stock options for small companies. “They’re a great way to share ownership in a company and get everyone pursuing the common goal of making sure that the options are worth something someday,” he says. “But it’s not like the old days. We have to spend more time explaining stock options and the notion of wealth than we did five or ten years ago, when everyone knew the impact that options could have. People are [now] just as likely to want to skip the options in favor of a higher salary.”

Click here to enlarge image

Three-quarters of respondents say their employer offers a 401(k) account or the equivalent. Employers most likely to offer the accounts are manufacturers, corporate research and development laboratories, government laboratories, and suppliers of materials and tools. These are also the employers most likely to offer a matching contribution to the employee’s account. Overall, 61 percent of U.S. employers offer a matching contribution.

The same types of employers are also more likely to offer traditional defined-benefit pension plans, though in keeping with national trends, only 21 percent of survey respondents say their employers offer such plans.

Changes in compensation-U.S.

Compensation in the small-tech industries is more than keeping pace with inflation, for the most part. A quarter of respondents say their salaries increased five percent or more in 2006, and 29 percent are expecting such increases in 2007. Forty-three percent say their salaries went up less than five percent in 2006, and 44 percent are expecting the same for 2007. Twenty-nine percent of respondents say their salaries had stayed the same in 2006, although only 25 percent are expecting 2007 to be similarly static. Only three percent report pay cuts in 2006, and only one percent expect the same for 2007.