Category Archives: Materials and Equipment

September 22, 2011 — X-RAY WorX GmbH introduced electronically controlled venting valves for open X-ray tubes. This avoids the manual venting typically performed during X-ray tool maintenance. The new venting method considers the turbo pump’s rotation speed and automatically optimizes tube venting.

X-RAY Worx asserts that the automatic venting process protects the turbo pump from damage and reduces downtime for X-ray system maintenance.

The company is also introducing 240kV microfocus X-ray tubes, the XWT-series with 240kV acceleration voltage, for computed tomography (CT) systems and penetration of higher wall-thicknesses in two- and three-dimensional X-ray analysis.

The high voltage technology used for the new 240kV X-ray tubes has been certified by the original supplier. The acceleration voltage of 240kV is available for almost all types of microfocus X-ray tubes of the XWT-series offered by X-RAY WorX.

X-RAY WorX makes microfocus X-ray tubes for high-resolution X-ray analysis of electronics, aerospace and automotive products. X-RAY WorX supports users of microfocus X-ray systems with a broad range of services ranging from preventive maintenance and repair to the supply of spare parts and trainings. Go to www.x-ray-worx.com

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September 16, 2011 — Whether it’s lead-free solder for package assembly or graphene for new transistors, semiconductor materials research was a dominant topic at Semiconductor Research Corporation’s TECHCON 2011, held September 12-13 in Austin, TX. In video blogs from the conference, students share their current research projects, and members of industry giants like IBM share how SRC-supported research benefits the industry.

Albert Liao, University of Illinois, Urbana-Champaign, graduate student

Liao describes his research on graphene nanoribbons. Specifically, how thermal dissipation impacts graphene nanoribbons’ current carrying capacity. As nanoribbon width is decreases, thermal dissipation becomes more efficient, meaning that the nanoribbons beat graphene sheets in terms of current density. His team also discovered that the thermal conductivity of these graphene structures was 78 watts per meter Kelvin.

Students (from L to R): Emily Walker, Carnegie Mellon Univ.; Justin Jiang, Georgia Institute of Technology; Ian Dryg, Purdue Univ.

 

Walker, Carnegie Mellon University, a materials science researcher with an electronics materials focus, is working on lead-free solder recipes that withstands repeated stresses better than today’s formulas.

Adam Beece, Rensselaer Polytechnic Institute, graduate student.

Beece discusses his work on using computer-based simulation to discover the limits on system architectures. He also notes that a bug in the simulator affected the research results, and how they will tweak the system for more accuracy.

Points of view on TECHCON from Texas Instruments (TI) and IBM. These experienced industry leaders speak about their time at TECHCON, and how research benefits the semiconductor industry, right now and in the next generation of devices.

Ken Butler, Texas Instruments Fellow and former SRC-sponsored student.

David Onsongo, IBM, analog designer and former SRC-sponsored student.

See the full host of videos from SRC TECHCON 2011 here: http://www.electroiq.com/articles/sst/2011/09/live-from-src-techcon.html

Watch video interviews with the winners of SRC’s Aristotle and Technical Excellence Awards here: http://www.electroiq.com/articles/sst/2011/08/stanford-uc-berkeley-professors-win-src-awards.html

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September 14, 2011 — Infrared materials and systems supplier IRphotonics added a high-resolution FLIR thermal imaging camera to its application engineering lab. The camera will be used to analyze heat distribution during iCure use.

IRphotonics engineers hope to optimize energy, wavelength and irradiance for particular processes, developing customized curing profiles with better control and manufacturing productivity, said Ruben Burga, VP of sales for IRphotonics.

The iCure AS200 inline fiber optic spot cure system uses infrared radiation to heat-cure thermal epoxies, bond plastic and glass components such as lenses, affix miniature components, assemble and bond semiconductor components, microsolder, and perform other precise welding operations. The system suits use with temperature-sensitive substrates and complex devices.

IRphotonics will be demonstrating the iCure AS200 at booth 765 at the MD&M Midwest in Chicago, September 20-23, 2011.

IRphotonics designs and manufactures infrared fibers and systems for the transmission of infrared light, and for assembly operations requiring high intensity infrared heat. For more information, visit www.icure-irphotonics.com.

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September 7, 2011 – PRNewswire — Wafer bonding tool maker EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20 wafers per hour (WPH) with enhanced automation capabilities, suiting wafer bond tasks in backside illuminated (BSI) CMOS image sensors, 3D integration of CMOS image sensors, and monolithic 3D integration of memory devices.

The upgrade is part of EVG’s plans to implement 300mm Prime standards across its equipment platforms. A local material buffer more than doubles the number of front opening unified pods (FOUPs) on the system — 10 FOUPs enable continuous-mode operation. A faster wafer handling system in the GEMINI FB platform uses double-end effectors on the robotic system rather than single-end effectors.

Low-temperature plasma activation enables wafer bonding and stress/damage free annealing below 400

September 7, 2011 – 3M and IBM say they are jointly developing a new class of material adhesives specifically for stacking and packaging semiconductors in layers of up to 100 separate chips. The resulting silicon "brick" could make chips 1000

September 6, 2011 — Alchimer’s AquiVia film-deposition technology promises to cut fill deposition times and cost even with complex through-silicon via (TSV) 3D packaging structures. The product targets TSV ramp-up at production levels, according to the company.

The AquiVia TSV barrier-layer process provides uniform, 100% step coverage over complex silicon topography, including high-aspect-ratio vias with scalloped walls. Existing TSV etch technologies tend to create scalloping, steps, and other surface features that challenge subsequent film deposition coverage, said Claudio Truzzi, Alchimer chief technical officer (CTO), noting that vacuum-based deposition processes have failed to create high-quality barrier layers, "especially in deep, small-diameter vias with aspect ratios of 10:1 and beyond." The AquiVia barrier films demonstrate 100% coverage on sides and bottom of vias, even with stair-step patterns and scalloping.

The improved barrier layer, one of the bottom-most elements in the TSV film stack, enables subsequent depositions to be completed in less time and at lower cost, according to Alchimer. The coverage also eliminates certain performance and reliability problems that can occur during subsequent seed-layer and fill deposition, such as "electromigration, poor fill results, and high-resistance pathways in interconnect circuits," said Truzzi.

AquiVia Barrier and Alchimer wet deposition products offer conformality, step coverage and purity that reduce costs and improve performance over PVD, CVD, or other dry processes, according to the company.

Alchimer will be exhibiting with their Taiwanese partner, Kromax, at SEMICON Taiwan Booth 672, Sept. 7-9, 2011. Alchimer will present at a DigiTimes workshop on optimum 3D TSV structures and processes, on the afternoon of Sept. 7th at the Grand Hyatt, Taipei.

Alchimer makes chemical formulations, processes and IP for the deposition of nanometric films used in a variety of microelectronic and MEMS applications, including wafer-level interconnects and TSVs for 3D packaging. Visit alchimer.com.

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September 1, 2011 — Test system maker Multitest reports improved tested-device placement with MT2168 at a high-volume semiconductor production site in Asia. The customer experienced a significant improvement in the placement rate of tested devices in the output tray.

The MT2168’s position detection and control (PDC) prevents misplacement into trays and plates due to mechanical tolerances or thermal expansions, including with small packages and tray variations.

The PDC concept on the MT2168 uses sensor-based alignment in the standard pick-and-place processes. The MT2168

September 1, 2011 – PRWEB — Laser direct structuring (LDS) technology provider SelectConnect Technologies introduced 3D design capabilities to create electromechanical functionality on molded interconnect devices (MID).

LDS allows more complex geometric 3D designs. Electromechanical circuits are produced on molded thermoplastic components for antenna used for cellular, GPS, Wi-Fi, Bluetooth and ISM band applications, automotive sensors, medical devices, RFID, and security housings.

SelectConnect acquired an LPKF Microline 160 3D laser system, which transfers the electromechanical design from a CAD data file directly onto a molded thermoplastic component or into a device structure. The circuit traces are embedded onto the thermoplastic component by the laser. Then electrical pathways and landings are electroless plated using the patented SelectConnect process for metallizing circuits on molded components. Surface mount components can then be attached using reflow soldering or wire bonding.

The LDS capability shortens time-to-market and easily incorporates design changes during prototyping. Changes are quickly made to the CAD file and uploaded to the laser. Parts are then etched and metalized. In many instances, new parts are ready for testing the next day.

SelectConnect Technologies, a division of Arlington Plating Company, provides LPKF’s LDS process. SelectConnect Technologies is ISO 9001 and ITAR registered. Visit http://www.selectconnecttech.com.

August 31, 2011 – Everyone’s saying PC demand is soft, right up through the back-to-school period. Earlier this year Intel pooh-poohed such pessimism, saying it had a better ear to the end-market ground. But now it seems even the chip giant might be fessing up to market softness, and retrenching accordingly.

Intel’s Fab 24 in Leixlip, Ireland is now removed from the company’s 22nm roadmap (the ‘1270’ line), says Barclays’ CJ Muse, citing "industry checks." If true, it’s as yet unclear if Intel would reallocate resources to its Israel facilities or whether this signals a broader lowering of leading-edge support — i.e. a pending capex reduction. The decision to "reallocate or mothball" the 1270 line will be made by mid-September, he writes.

Citi’s Tim Arcuri further clarifies with his own "checks," determining that INTC’s plan for Fab 24 is merely to put "on hold" its planned 22nm migration (from 90/65nm output), with a deeper strategic decision over Fab 24’s fate coming at 14nm or 10nm.

Meanwhile, Intel told a local paper that there is no delay to its Leixlip Fab 14 plans, where at the start of 2011 it pledged $500M in upgrades — but this would be separate from the Fab 24/22nm upgrades.

What’s sparking Intel’s possible 22nm rethink? PC demand indicators continue to pancake. FBR’s Craig Berger says PC builds "have deteriorated" with 3Q11 builds now in the red Q/Q, "worse than expected and well below seasonal" due to weak demand across the board from Europe to the US to China, and major OEMs (HP, Acer, Dell) are "clearing inventories." Lazard’s Daniel Amir knits together weak outlooks from Micron and Omnivision, along with weak consumer PC spending, and drags down INTC’s 3Q-4Q projections. Susquehanna’s Chris Caso cites his own checks for "incrementally negative" PC demand, which he says has spawned cancellations from smaller customers and is a harbinger of larger ones. AMAT’s Mike Splinter said in the company’s 3Q11 results call that the traditional back-to-school PC push has been "disappointing." HP further threw a dash of cold water on the sector by announcing intentions to slough off its PC business. Muse notes that there’s already "talk of a hiring freeze at Intel" as well.

The ramifications of Fab 24 delays or shutdowns won’t really impact Intel’s planned 2011 capex (seen around $6B), with already-ordered tools or shipments. But this could be a big damper on 2012 capex plans. Fully upgrading Leixlip Fab 24’s 41K WSPM to 22nm could require $2B in total capex (~$1.5B in wafer fab tools) budgeted within INTC’s 2012 spending plans, and erasing that would create a sizeable hole — Muse thinks it could be $300M-$600M "if it’s just a cancel" and the 22nm work isn’t reallocated, which would push INTC’s 2012 capex as low as $5B. (That figure would also include initial 16nm investments for fabs D1D and newest D1X in Oregon.) Arcuri, meanwhile, puts INTC’s possibly 2012 capex quite a bit higher at $7B-$8B.

From a larger industry picture, any Fab 24 cancellation would take a ~5% slice out of what is already expected to be a "flattish" (=10%) 2012 industrywide WFE spend. But with 3Q11 numbers in the bag, Arcuri maps current WFE order run-rate at a paltry $20B-$22B, which is "not a sustainable level by any stretch," he writes. Look for some help on the horizon thanks to new NAND capacity (Samsung and Hynix), foundries, and even Intel (Fab 28). Arcuri sticks with his position that 3Q11 "is the trough for orders" and a "noticeable bounce" is coming in 4Q11 and we are likely to see a notable bounce back in CQ4 that should "be as quick as the drop-off in CQ3." Still, he notes, "orders have got to get better fairly soon to get anywhere close to any reasonable 2012 capex picture."