August 3, 2011 – BUSINESS WIRE — Handset technology provider Nujira opened an IC Design Centre in Edinburgh, Scotland, with the help of
Category Archives: Materials and Equipment
August 2, 2011 — IC maker Samsung Electronics Co. Ltd. acquired Grandis Inc., a Silicon Valley maker of spin transfer torque random access memory (STT-RAM). Effective late July 2011, the acquisition includes the full scope of technology, assets and human resources under Grandis, Inc.
Samsung will integrate Grandis into its next-generation memory chip R&D operations, investigating new semiconductor materials and structures.
Grandis offers expertise in next-generation memory technologies and strong technical capabilities. Its proprietary STT-RAM technology has all the characteristics of a universal memory: non-volatility, low power consumption, ultra-fast read and write speed, unlimited endurance, and scalability beyond the 32 nm semiconductor node.
Visit the Grandis website at www.grandisinc.com
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August 2, 2011 – Marketwire — Data I/O Corporation (NASDAQ:DAIO), manual and automated device programming product provider, debuted the RoadRunner3 in-line programming system, a just-prior-to-placement programming tool. Its Factory Integration Software (FIS) helps RoadRunner3 streamline production and eliminate operator errors by interfacing with the user’s manufacturing execution system (MES) or other shop-floor control software.
The programming system’s feeder mounts directly onto an SMT placement machine, removing unprogrammed Flash memory devices from tape, programming four devices in parallel, and then delivering the programmed parts to the pick-up point of the placement machine. Interface kits match major SMT equipment: SIPLACE, Fuji, Panasonic, and MYDATA. A configurable Tape-In module adjusts for tape widths from 16 to 44mm.
FIS Remote and FIS Track modules allow customers to manage and monitor the programming process. The FIS Remote software module automates job selection and job downloads to RoadRunner3. FIS Track enables data-driven decision making through automated collection and export of programming results. The modules send e-mail alerts when RoadRunner3 needs maintenance or when yields drop below a set threshold.
RoadRunner3 features a FlashCORE III Flash programming architecture for memories such as e.MMC, SD and NAND Flash.
Data I/O Corporation manufactures, distributes, and services products for programmable devices in any package, whether programmed in a socket or on a circuit board. For further information, visit www.dataio.com.
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August 2, 2011 — The University of Louisville (UofL, Kentucky) worked with IBM (NYSE:IBM) to double the school’s high-performance computing power as part of a $1.8 million investment in its supercomputing system. U of L needed the additional capacity to power advanced research projects on treating pediatric cancer and developing better materials for solar power, both of which are at critical development stages.
The Cardinal Research Cluster (CRC) supercomputing system, an IBM iDataPlex high performance computing cluster, was first installed in 2009, and had reached 100% capacity. The UofL CRC added a new iDataPlex systems to the original cluster and now has a peak speed of more than 40 teraflops (trillion calculations per second), roughly 10,000 to 20,000 times faster than today’s average desktop computer. The Health Resources and Services Administration, a unit of the U.S. Department of Health and Human Services provided a $1.8 million grant to fund the upgrade.
Researchers at the UofL James Graham Brown Cancer Center working on cancer treatments for the last 3 years have screened over 200 cancer targets in the maxed-out system. The enhanced computer will enable an additional focus on pediatric cancers, such as Neuroblastoma and Ewing’s Sarcoma.
The supercomputer is also in use by researchers at UofL’s Conn Center for Renewable Energy Research to explore new semiconductor materials to improve solar energy capture technologies.
IBM also awarded UofL a Shared University Research (SUR) award to help further the school’s efforts: extra computing systems and access to IBM engineers who will work closely with the University’s information technology staff to get maximum performance from the supercomputer.
For more information on IBM High Performance Computing Systems please visit: http://www-03.ibm.com/systems/deepcomputing/
July 29, 2011 – Marketwire — Sapphire Materials Company (SMC), a subsidiary of Silicon Chemical Corporation (SCC), completed Phase I of its sapphire manufacturing business. The manufacturing green-light follows less than a year of research and design, retrofitting, and renovation at the former Saint Gobain/Union Carbide sapphire crystal growing facility in Washougal, WA.
Manufacturing equipment was sourced from suppliers and some methodologies were developed in-house by SMC.
All process utility and infrastructure requirements are in place for installation of crystal growing equipment to meet SMC plans to ramp capacity to over 100,000 KG by the 4th quarter of 2012. Phase II should be complete in September 2011. Initial shipments of sapphire product will begin this November.
The sapphire produced in Washougal will primarily serve LED manufacturing markets. The aim is lowest-cost production with high reliability and consistent product quality.
Sapphire Materials Company (SMC) is a subsidiary of Silicon Chemical Corporation (SCC), which provides silicon process technology, equipment, and professional services for the electronic and solar industries. Visit SMC at www.sapphirematerials.com
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July 28, 2011 — Purdue University researchers have created an ultrapure gallium arsenide (GaAs) semiconductor crystals that capture new states of matter, with potential applications in future high-speed quantum computing.
In the ultrapure semiconductor GaAs, electrons do not follow single-particle physics laws, and are governed by mutual interactions. This provides insights into fundamental physics, said Michael Manfra, the William F. and Patty J. Miller Associate Professor of Physics who leads the group at Purdue, noting that the exotic states are "beyond" standard solid-state physics models, and are non-existant in standard materials.
Manfra and his research team designed and built a high-mobility gallium-arsenide molecular beam epitaxy (MBE) system at Purdue’s Birck Nanotechnology Center. The MBE tool makes ultrapure semiconductor materials with atomic-layer precision, creating a perfectly aligned lattice of gallium and arsenic atoms that can capture electrons on a two-dimensional plane, preventing vertical motion and limiting planar movement.
When the electrons are captured in these "microscopic wells," they can interact only with each other," he said. Purity is important; impurities scatter electrons.
Once the desired material is fabricated, electrons must be cooled to extremely low temperatures. Gabor Csathy, an assistant professor of physics, cooled the material and electrons to 5millikelvin (close to absolute zero). Cooled electrons become "aware" of neighboring electrons, enabling "collective motion," explained Csathy.A magnetic field is applied, creating conditions that lead to the "correlated state."
The work, which is in very early stages, could eventually lead to viable quantum computing materials, Manfra added. As the electrons interact, they rearrange to acheive minimum energy level and eventually form new ground states, he said.
Csathy, who specializes in quantum transport in semiconductors, takes the electron measurements. Semiconductor quality is measured in electron mobility (centimeters squared per volt-second). The group achieved an electron mobility measurement of 22 million centimeters squared per volt-second, among the top in the world, he said.
Manfra and Csathy presented their work at Microsoft’s Station Q summer meeting on June 17 at the University of California at Santa Barbara (UC Santa Barbara). This meeting, sponsored by Microsoft Research, brings together leading researchers to discuss novel approaches to quantum computing. They also received a $700,000 grant from the Department of Energy based on their preliminary results.
In addition to Manfra and Csathy, the research team includes associate professors of physics Leonid Rokhinson and Yuli Lyanda-Geller; professor of physics Gabriele Giuliani; graduate students John Watson, Nodar Samkharadze, Nianpei Deng and Sumit Mondal; and research engineer Geoff Gardner.
July 28, 2011 — According to the US Department of Labor, productivity in the nonfarm business sector in the United States is currently growing at the fastest rate (2.8% 2007-2010) since World War II (see figure, Source: United States Department of Labor)
How can we become more productive? Provide more of our goods or services for the same or less cost? The typical answer is automation. However, automation — whether a new shop floor control system or enterprise resource planning (ERP) system integration in the back office — is not the panacea today’s businesses need to cure lack of competitive products or services.
Especially in technology companies, decision makers can be drawn to the next whiz-bang automation improvement opportunity. But increased productivity is not a guaranteed result.
So how can we systematically improve productivity? What does automation automate? In processes. If we can fundamentally optimize our processes — with or without automation — we can systematically improve productivity.
Methodologies abound for improving processes:
- Lean, popularized from the Toyota Production System (TPS);
- Six Sigma of Motorola and GE fame;
- Business Process Management (BPM); etc.
Most of these systems utilize similar pillars to drive process improvement: document the current state; define customer requirements; create a standard; document the desired future state; implement change (and measure results) to drive the process from the current state to a desired future. If these steps are performed to improve the processes we try to automate, desired productivity gains are possible without investing in new automation.
Document the current process
One of the primary challenges with automating our processes is understanding exactly what needs to be automated. Many times, automation solutions are selected without full knowledge of the process requirements and customer desires. Sub-optimal solutions are then implemented to "make the automation system work." Automating non-value-add activities that manufacturers don’t care about does not improve productivity.
In a recent electronics client engagement, we encountered an "automated" inventory management system that had grown bloated over years of new product additions, creating many exceptions for each new design. We spent multiple weeks "at the Gemba" (Japanese for "where the work gets done") documenting the actual steps personnel were required to complete. There were many exceptions to the original standard, and the folks doing the work had created numerous fixes and work-arounds to enable the "automated system" to function correctly. Unfortunately, it created thousands of dollars annually in lost material, and material variance costs. It was highly automated — but not productive. The process issues were resolved to gain the company $950,000 of annual reductions in inventory costs.
Set the standard; improve the standard
Planning for future needs is often difficult when implementing automation. System requirements continually evolved in the above example due to the firm’s expansion of multiple product lines over time. Optimization activities that set a standard and then systematically approach improving the standard over time can be much more fruitful, with or without the capital expense of an automated system.
Over a 5-year engagement with another client, we worked with a 500-employee team to develop and implement a phased plan to systematically improve operations by constantly defining, improving, and redesigning standards across workspace designs, personnel training, production equipment operation and maintenance — and the corresponding business processes for each function. These activities yielded $26.5 million in labor savings and a $21.1 million reduction in inventory costs by the end of the project.
Continuous improvement indefinitely
The last drawback with automating processes I’d like to discuss in this blog is the presumed finality of automated solutions. We’ve seen time and again where companies have invested in an automated solution to some problem, and over time conditions changed that eroded the productivity improvements initially provided by the automation system(s), as described in the first client engagement above. It cannot be overemphasized that business conditions will change, and that a culture of sustained continuous improvement of processes is necessary to achieve true, not fleeting, productivity improvements.
Greg Harr is a manufacturing integration engineer with CH2M HILL with more than 15 years of experience providing consulting services for diverse manufacturing industries internationally. His most recent projects include Lean analysis and optimization of assembly operations and labor utilization for two photovoltaic manufacturing firms in the U.S., and supply chain development and analysis for a semiconductor manufacturer in the Middle East. He specializes in business process improvement, production and material handling systems, cost reduction and productivity. He has developed world-class sustaining solutions and manufacturing efficiencies for retrofit and greenfield projects yielding millions of dollars in capital expense and cost of operations savings. Contact Greg at [email protected].
More blogs from CH2M HILL:
- Start thinking in 450mm by Terry Behrens
- Solar cell makers should consider another (potentially) renewable resource: Water use by Ralph Williams
- Scaling-up PV fabs? Make tagging your friend by Steve Blaine
July 27, 2011 – PRNewswire — EV Group (EVG), wafer bonding and lithography equipment supplier, began a manufacturing capacity expansion at its Austrian headquarters. The company cites a 40% increase in order intake in fiscal year 2011 compared with fiscal 2010. As part of the expansion, EVG will recruit about 100 additional employees.
The new building is adjacent to EVG’s existing manufacturing facility, doubling the company’s production floor space. It should come on-line in 2011.
EVG will also invest in additional machining capacity and new manufacturing technologies and facility upgrades, such as new filter fan units for particle-free manufacturing areas. Full air conditioning, additional hydraulic ramps, and a large overhead crane will improve workers’ capabilities and comfort.
A new visitor area will be built, allowing customers to observe manufacturing. Test rooms will enable customer-specific process development and customization, including a smooth source inspection process even at busy times.
EVG will need about 100 manufacturing and technical service and support hires to staff the expanded area. More information about current job vacancies can be found in the "careers section" on EV Group’s website (see below).
EV Group (EVG) makes wafer processing equipment for semiconductor, MEMS and nanotechnology applications. More information is available at www.EVGroup.com.
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July 27, 2011 — North America-based manufacturers of semiconductor equipment posted $1.55 billion in orders in June 2011 (three-month average basis) and a book-to-bill ratio of 0.94, according to the June Book-to-Bill Report published by SEMI. June 2010’s North American semiconductor equipment book-to-bill was 1.18.
The three-month average of worldwide bookings in June 2011 was $1.55 billion. The bookings figure is 4.4 percent less than the final May 2011 level of $1.62 billion, and is 10.3 percent below the $1.73 billion in orders posted in June 2010.
The three-month average of worldwide billings in June 2011 was $1.65 billion. The billings figure is 1.1 percent less than the final May 2011 level of $1.67 billion, and is 12.5 percent more than the June 2010 billings level of $1.47 billion.
July 22, 2011 — Materials supplier Nippon Steel Material Co. Ltd. (NSMAT) and its semiconductor packaging materials subsidiary Nippon Micrometal Corporation (NMC) licensed their single-layer-palladium (Pd) coated copper (Cu) bonding wire to Tanaka Denshi Kogyo K.K., bonding wire manufacturer and traditionally a competitor.
The copper bonding wire, EX1, was developed by Nippon Steel Corporation as an alternative to gold in high-density large-scale integrated (LSI) circuits. The companies report that the wire bonds offer high reliability at one-fifth the cost of gold packaging, thanks to a unique structural design. It also offers high electrical conductivity, more than 20% higher than gold wire.
EX1 went into mass production in 2009 and claims more than 80% of the copper bonding wire market share. It has been adopted by packaging companies globally, with a large presence in Taiwan.
Nippon Steel has filed more than 80 patents on copper wire for semiconductor packaging. Several of the EX1 patents are now being licensed to Tanaka, a competitor, to ensure consistent global supply of the material, says Nippon Steel. NMC additionally increased production of the wire in its Japan and Phillipines facilities, upping output from 150k to 250k km/month.
The company also released an improved Pd monolayer Cu wire, EX1p, that enhances bonding to the die and leadframe, and allows increased wire-bonding speed. EX1p is not included in the license agreement with Tanaka Denshi Kogyo.
Learn more at http://www.nsc.co.jp/nsmat/english/index.html
More on copper wire bonding:
- STATS ChipPAC invests in Cu wire bonding
- K&S pushes Cu wire transition
- MagnaChip Semiconductor adds Cu wire bonding
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