Category Archives: Metrology

January 16, 2012 — Taiwan became the region with the largest share of installed wafer capacity in 2011, according to IC Insights’ Global Wafer Capacity 2011-12 report. This is the first time Taiwan has led the global wafer capacity rankings, with 21% of total in mid-2011.

Each regional number is the total installed monthly capacity of semiconductor fabs in that region, regardless of the headquarters location for the companies that own the fabs.

Top 5 regions, installed wafer processing capacity:

  1. Taiwan: 21%
  2. Japan: 19.7%
  3. Korea: 16.8%
  4. The Americas: 14.7%
  5. China: 8.9%

Figure. Installed wafer fab capacity (K w/m) in global regions (based on where the capacity is installed, not where the parent company is headquartered), July 2011.

Note: Rest of world (ROW) is primarily Singapore, Israel, Malaysia, also including Russia, Belarus, India, South Africa, and Australia.

Taiwan is not only the largest wafer processing region, but it also has the largest share of 300mm capacity.  In 2011, Taiwan held 25.4% share of worldwide 300mm wafer capacity, 18.7% of 200mm wafer capacity, and 11.4% of 150mm wafer capacity. 300mm wafers represent 64.6% of the country’s installed capacity; 200mm wafers are 29.2%; 150mm wafers accounted for 6.1%.

Taiwan also leads the industry with capacity dedicated to "not so leading-edge" 40nm-60nm process geometries. Taiwan focuses on providing foundry services to various fabless IC suppliers, fab-lite IDMs, and electronic system producers.

Taiwan re-elected its leader Ma Ying-jeou of the Kuomintang (KMT) for a second term this week. Ma is not expected to make any major economic and regulatory reforms, according to the US-Taiwan Business Council.

IC Insights also notes in the research that China accounts for more wafer capacity than all of Europe. Nearly all of the installed wafer fab capacity (80%+) is in the top 5 regions.

Also read: Semiconductor fab capex forecast for 2012

Detailed analysis and a forecast of the IC industry’s wafer fab capacity through 2016 is provided in the 2011-12 edition of IC Insights’ Global Wafer Capacity report.

Published in November 2011, the Global Wafer Capacity 2011-2012 report features IC wafer capacity analyses and forecasts through 2016. View http://www.icinsights.com/services/global-wafer-capacity/ for more information. IC Insights Inc. provides high-quality, cost-effective market research for the semiconductor industry.

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January 12, 2012 — Semiconductor buyers have reduced orders under combined forces of moderately high inventory in the electronics supply chain and deteriorating macroeconomic sentiment. Gartner Inc. expects this inventory correction to work out in early 2012, with production and sell-through returning roughly to balance.

Semiconductor sales were weaker than expected in Q3 2011, and Q4 shows weak guidance. Chip makers are taking action to reduce production based on the weaker sales numbers. Near-term sequential growth prospects for the semiconductor industry are relatively poor, Gartner notes.

Relative inventory levels (expressed by days of inventory [DOI]) are starting to fall, indicates the Gartner Index of Inventory Semiconductor Supply-chain Tracking (GIISST). Relative inventory went from 1.13 in Q3 2011 to 1.11 in Q4. DOI declined quarter-to-quarter in all supply chain segments except electronics manufacturing service (EMS) providers/contract electronics manufacturers (CEM). Absolute inventory in dollar-value terms is still rising.

Another analyst firm, IHS iSuppli, also noted that chip inventories contracted in Q3 2011, reversing a 7 quarter trend. Sharon Stiefel, semiconductor analyst at IHS, said "With the global economy all but stalled, and in the face of declining orders as well as decreased visibility, many semiconductor manufacturers opted to reduce capacity utilization," adding that lead times have also lowered to normal. Read the IHS iSuppli take on the chip inventory correction here.

Figure. Gartner’s inventory index 2000 to present.

The proportion of total semiconductor inventory held by OEMs continues to rise, Gartner reports; OEMs will likely seek to reduce this from levels reached at the start of Q4 2011.

Gartner found that distributor lead times were affected by flooding in Thailand, but were returning to pre-flood levels as of late November. Read more about Thai floods & the semiconductor industry:

Learn more about the inventory correction in Market Trends: Semiconductor Inventory Correction Continues in 4Q11 at http://www.gartner.com/DisplayDocument?doc_cd=222590&ref=nl. Gartner Inc. (NYSE:IT) is a leading information technology research and advisory company.

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January 11, 2012 — Former SEMI president and CEO Stanley T. Myers was named a director emeritus of the industry association by the SEMI International Board of Directors. Myers led SEMI for 15 years, was a board member for 24, and has been part of the semiconductor industry for more than 50.

Myers retired as the head of SEMI in 2011, leaving the post to Dennis P. McGuirk. McGuirk was president and CEO of  IPC —  Association Connecting Electronics Industries for 12 years.

Video:  Historic semiconductor industry, SEMI moments from Stanley Myers

Emeritus director positions are awarded in recognition of outstanding achievements on behalf of the association and the industry. Included among the SEMI emeritus directors are distinguished industry luminaries Ed Braun, Joel Elftmann, Ken Levy, James Morgan, Ed Segal, Kenichi Sekiya, Tetsuro Higashi, Shoichiro Yoshida and Arthur Zafiropoulo.

The SEMI Board of Directors is composed of executives from equipment and materials companies serving the global semiconductor, photovoltaic and related industries. The board governs the policies and activities of the association on behalf of its international membership. Directors may serve on the SEMI Board up to eight years as voting members and an additional three years as ex-officio members in accordance with the association bylaws.

SEMI is a global industry association serving the nano- and microelectronics manufacturing supply chains. For more information, visit www.semi.org.

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January 10, 2012 — Semiconductor fab equipment spending is expected to decline by approximately 11% in 2012 to $35 billion, according to preliminary data from the SEMI World Fab Forecast report. Spending on fab equipment will drop in the H1 2012, but will sharply increase in H2, bringing capital expenditure near to $10 billion by the fourth quarter.

Fab spending will remain higher than 2010 levels, despite the dip from last year’s $39 billion. Worldwide, Korea is the only region expected to show growth in fab equipment spending in 2012, mainly due to expected spending by Samsung. The forecast relies heavily on capex plans at industry heavyweights. Samsung, Hynix, Intel, and TSMC, among others, could spend more than anticipated. A best-case scenario would be -4% capex from 2011.

SEMI expects 2007, 2011, and 2012 to be the three highest fab spending years on record.   

Figure. Fab equipment spending. SOURCE: SEMI World Fab Forecast November 2011 edition.

The SEMI World Fab Forecast tracks installed capacity by fab, showing changes when fabs close and when product type or wafer size change. Despite the economic situation, 300mm installed capacity is expected to grow at a steady pace in 2012. In 2011, the installed capacity for 300mm grew by about 13% (YoY). The forecast anticipates a small slow down to about 11% in 2012 and increasing to about 12-14% in 2013.

Table. Fab spending by semiconductor companies, by region. SOURCE: SEMI World Fab Forecast November 2011 edition.

The SEMI World Fab Forecast uses a bottom-up approach methodology, providing high-level summaries and graphs; and in-depth analyses of capital expenditures, capacities, technology and products by fab. Additionally, the database provides forecasts for the next 18 months by quarter. Learn more about the SEMI fab databases at: http://www.semi.org/MarketInfo/FabDatabase.

SEMI’s Worldwide Semiconductor Equipment Market Subscription (WWSEMS) data tracks only new equipment for fabs and test and assembly and packaging houses. The SEMI World Fab Forecast and its related Fab Database reports track any equipment needed to ramp fabs, upgrade technology nodes, and expand or change wafer size, including new equipment, used equipment, or in-house equipment. SEMI is the global industry association serving the nano- and microelectronics manufacturing supply chains. For more information, visit www.semi.org.

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January 9, 2012 — Camtek Ltd. (NASDAQ and TASE: CAMT) launched Xact200, its second generation transmission electron microscope (TEM) sample preparation system for the semiconductor industry. Camtek calls the system an alternative to traditional focused ion beam (FIB) analysis.

Camtek has received its first purchase order for the tool, from a leading semiconductor company in Asia.

TEM enables analysis of small semiconductor feature dimensions and complex materials. The Xact200 enables sample preparation for 2X and 1X nodes, combining Adaptive Ion Milling (AIM) technology with an integrated FE SEM column and in-process STEM imaging capability. AIM can reduce lamella thickness <20nm over a large area with high precision, artifact-free quality, and higher throughput, Camtek reports.

Camtek Ltd. provides intelligent imaging, image processing, adaptive ion milling (AIM) and digital material deposition (DMD) for semiconductor and PCB and IC substrate production. Website: www.camtek.co.il.

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January 3, 2012 — Solid State Technology asked top analysts and technologists to provide insights on the transition to 22nm semiconductor devices. Read through all the forecasts, or click by topic, from chip design to lithography, CMP, and materials, to the packaging side of the equation.

Check out the first article, from Dean Freeman of Gartner Inc:
Semiconductor process technology challenges at 22nm

And a design perspective, from Gary Smith of Gary Smith EDA:
At 22nm, leave chip layout to the experts

Defect discussion, with Howard Ko of Synopsys:
First order effects at 22nm

The lithography point of view, with Aki Fujimura, D2S:
Mask-wafer double simulation: A new lithography requirement at 22nm

What 22nm means for the packaging providers, from E. Jan Vardaman, TechSearch International:
22nm requires foundry-to-packaging-house cooperation

An in-depth look at gate stacks and materials, with Mohith Verghese, ASM America:
Strained silicon and HKMG take the stage at 22nm

The role of a mid-node, TSVs, and 450mm at 22nm, with Art Zafiropoulo, Ultratech:
Will 22nm need a mid-node?

The CMP point of view, from Michael A. Fury, Techcet Group:
Startups pave the way to CMP at 22nm

Driving technologies for 22nm lithography, from Franklin Kalk, Toppan Photomasks:
20nm mask technology relies on SMO and DPT

How 3D IC fits into the 22nm equation, with Paul Lindner, EV Group:
3D integration key to 22nm semiconductor devices

December 29, 2011 — The updated IEST "Garment System Considerations for Cleanrooms and Other Controlled Environments" recommended practice document includes new sections on measuring cleanroom footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.

A new edition of IEST-RP-CC003.4, Garment System Considerations for Cleanrooms and Other Controlled Environments, includes a 20-page supplement on recommended garment measurement specifications. The supplement, Guide to Measuring Cleanroom Garments, provides illustrated instructions for measuring coveralls, frocks, hoods, and footwear.

The revised Recommended Practice (RP) is published by the Institute of Environmental Sciences and Technology (IEST).

Also read: ISO Cleanroom standards update

IEST-RP-CC003.4 addresses the gowning of personnel as a critical aspect of cleanroom contamination control. Specification and use of an appropriate gowning system is essential in preventing human-generated contamination from reaching and affecting product or processes in the cleanroom. The RP provides non-mandatory guidance for the selection, specification, maintenance, and testing of garments or apparel and accessories appropriate for use in non-aseptic and aseptic environments.

The RP defines required performance criteria, test methods, and procedures for gowning system use and maintenance. It also features guidelines for developing a quality control (QC) plan for the apparel and accessories that may be part of the system. This edition includes a new subsection on the use of advanced tracking systems, such as barcodes and radio-frequency identification (RFID) chips, to monitor garment service life. Also provided is a section describing types of fabrics and relevant properties and methods of testing of the materials used in cleanroom garments, as well as the design and construction of appropriate configurations and special features of such garments.

Appendix B explains the Helmke drum test method, introduced in an earlier edition of the RP and based on round-robin testing performed by the IEST Working Group. This method is used to quantify particles dislodged through the application of mechanical energy under dry conditions as a means of simulating particle shedding from the surface of the garment during use. Garments being tested are tumbled in a rotating drum to release particles from the fabric in a controlled manner, while a discrete-particle counter is used to sample the air within the drum.

Ordering information for IEST-RP-CC003.4 and other IEST publications is available at www.iest.org.

IEST is an international not-for-profit technical society of engineers, scientists, and educators that serves its members and the industries they represent (simulating, testing, controlling, and teaching the environments of earth and space) through education and the development of recommended practices and standards. IEST is an ANSI-accredited standards-developing organization; Secretariat of ISO/TC 209 Cleanrooms and associated controlled environments; Administrator of the ANSI-accredited US TAG to ISO/TC 209; and a founding member of the ANSI-accredited US TAG to ISO/TC 229 Nanotechnologies.

December 16, 2011 — North America-based manufacturers of semiconductor equipment posted $973.3 million in orders in November 2011, $1.17 billion in billings, and a book-to-bill ratio of 0.83, according to the November Book-to-Bill Report from SEMI.

See October’s N.A. semiconductor manufacturing equipment numbers here.

The three-month average of worldwide bookings in November 2011 was $973.3 million. The bookings figure is 5.0% above October’s level, though 35.7% below November 2010.

The three-month average of worldwide billings in November 2011 was $1.17 billion. The billings figure is 6.7% below October 2011, and 25.1% less than November 2010 billings.

"We see improvement in the book-to-bill ratio due to a slight increase in bookings as we approach the end of 2011," said Denny McGuirk, president and CEO of SEMI. "The industry waits for definitive signs of stability in the worldwide economy, which will improve end market demand and help solidify investment plans for 2012."

 

Billings (3-mo. avg)

Bookings 3-mo. avg)

Book-to-Bill

Billings and bookings figures are in millions of U.S. dollars.
June 2011

1,640.2

1,540.4

0.94
July 2011

1,521.2

1,298.2

0.85
Aug 2011

1,457.7

1,162.4

0.80
Sept 2011

1,313.5

926.5

0.71
Oct 2011 (final)

1,258.3

926.8

0.74
Nov 2011 (prelim)

1,174.4

973.3

0.83

Source: SEMI December 2011

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. A book-to-bill of 0.83 means that $83 worth of orders were received for every $100 of product billed for the month.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

The data are contained in a monthly Book-to-Bill Report published by SEMI. The report tracks billings and bookings worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves. The Book-to-Bill report is one of three reports included with the Equipment Market Data Subscription (EMDS).

SEMI is a global industry association serving the nano- and micro-electronic manufacturing supply chains. For more information, visit www.semi.org.

December 14, 2011 — Altatech Semiconductor S.A. launched its first LED inspection system, the non-contact AltaSight LEDMax, for detecting, classifying and characterizing defects on wafers used in manufacturing light emitting diodes (LEDs).

Also read: Fraunhofer IZM’s packaging center installs Altatech CVD

AltaSight LEDMax is designed to detect process-induced defects (PIDs) from metal-organic chemical vapor deposition (MOCVD) of epitaxial layers, patterning processes, and final inspection. A proprietary sensor technology filters out all background noise. Surface imperfections can be imaged with 1

December 13, 2011 — SEMI reports worldwide semiconductor manufacturing equipment bookings fell 38% year-over-year in Q3 2011; billings dropped 5% for the same quarter.

Worldwide semiconductor equipment bookings came in at $7.6 billion in Q3, a 29% plunge from Q2 2011, and 38% below Q3 2010.

Billings reached $10.6 billion: 11% less than the previous quarter and 5% below Q3 2010.

Table. Quarterly billings data by region in millions of US dollars, year-over-year and quarter-over-quarter growth rates by region. Source: SEMI/SEAJ December 2011 . Note: Figures may not add due to rounding.


Region


3Q2011


2Q 2011


3Q2010

3Q11/2Q11
(Q-o-Q)

3Q11/3Q10
(Y-o-Y)
Korea

2.27

2.17

2.62

4%

-13%
North America

2.11

2.21

1.53

-4%

38%
Japan

1.74

1.48

1.24

18%

40%
Taiwan

1.49

2.76

3.03

-46%

-51%
ROW

1.04

0.99

1.02

5%

2%
Europe

1.02

1.18

0.62

-13%

66%
China

0.94

1.13

1.13

-17%

-17%
Total

10.61

11.92

11.19

-11%

-5%

The data is gathered by SEMI and the Semiconductor Equipment Association of Japan (SEAJ) from over 100 global equipment companies that provide data on a monthly basis.

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market, including the monthly SEMI Book-to-Bill Report, the monthly Worldwide Semiconductor Equipment Market Statistics (SEMS) report, and the SEMI Semiconductor Equipment Consensus Forecast. For more information or to subscribe, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.) or 1.408.943.6901 (International Callers).

SEMI is a global industry association serving the nano- and micro-electronics manufacturing supply chains. For more information, visit www.semi.org.