Category Archives: Metrology

November 3, 2011 — The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, elected Freescale Semiconductor CEO Rich Beyer as its 2012 chairman. This will be the SIA’s 35th year.

Rich Beyer joined Freescale Semiconductor in March 2008, and has led at Intersil Corporation, Elantec Semiconductor, VLSI Technology and National Semiconductor Corporation. He holds bachelors and master’s degrees from Georgetown University and an MBA from Columbia University Graduate School of Business, and served 3 years in the United States Marine Corps. He currently serves as a member of the Partnership for a New American Economy and on the US Department of Commerce

November 2, 2011 — A new Recommended Practice (RP), IEST-RP-CC042.1: Sizing and Counting of Submicrometer Liquid-Borne Particles Using Optical Discrete-Particle Counters, is now available from the Institute of Environmental Sciences and Technology (IEST). Liquid-borne particle measurement involves many technical challenges that can substantially affect results in both sizing and counting of particles. This first-edition RP, published by the IEST Contamination Control Division, is intended as a single source covering those challenges and solutions, and provides a handy reference for professionals in this field.

Also read: ISO Cleanroom standards update

A liquid-borne particle counter (LPC) uses light to detect particles suspended in a liquid medium. This RP focuses on LPCs that use a light-scattering technology to directly measure the amount of light scattered by particles to obtain information on the concentration and the size distribution of those particles. This technology is predominantly used to detect low concentrations of particles ranging in diameter from 0.05 to 20

November 1, 2011 — Scanning probe/atomic force microscopy company Asylum Research introduced the Variable Field Module2 (VFM2) for the MFP-3D Atomic Force Microscopes (AFM). It allows researchers to apply magnetic fields in conductive AFM experiments, magnetic force microscopy, and other applications.

Rare-earth magnets produce the field without heat, thermal drift, or mechanical vibration. The magnetic fields are continuously adjustable, applied parallel to the sample plane approaching one Tesla with one Gauss resolution. An integrated Gaussmeter provides a quantitative measure of the applied magnetic field.

Five frames showing a piece of Perpendicular Media Recording (PMR) hard disk degaussed with an in-plane ~0.5 Tesla magnetic field using the VFM2.

VFM2 attaches to the MFP-3D AFM with adjustable pole tips to accommodate maximum required field, sample placement, and minimum field gradients. Research on piezoelectrics and ferroelectrics can be conducted with an attachable VFM2 High Voltage Kit, for tip biases up to ±220V.

Also read: Global market for piezoelectric-operated actuators and motors and Ferroelectric/ferromagnetic nano-structured film discovery

The VFM2 replaces “complicated” superconducting or water-cooled magnets, said Roger Proksch, president of Asylum Research, “neither of which were particularly friendly to low-noise, high precision AFM measurements.”

Asylum Research makes atomic force and scanning probe microscopy (AFM/SPM) for both materials and bioscience applications. Internet: www.AsylumResearch.com.

October 20, 2011 – GLOBE NEWSWIRE — Entegris, Inc. (Nasdaq:ENTG), contamination control company, opened a manufacturing and research facility in Hsinchu City, Taiwan, for design and manufacturing of advanced filtration and materials handling components for the semiconductor industry and other high-tech industries. The facility will also provide lab services to customers in Taiwan and across Asia.

Entegris was honored to host several of its key customers and important local officials at the opening ceremony. Once the new facility is fully operational, it should employ as many as 160 manufacturing, sales, service and engineering staffers in Taiwan.

"Taiwan is an important market for Entegris, representing 16 percent, or nearly $110 million, of our sales in fiscal 2010. This expansion adds to our existing presence in this region and extends our ability to address growth opportunities in the semiconductor, solar, energy storage, and other emerging markets across Asia," said Gideon Argov, president and CEO of Entegris.

Entegris provides a wide range of products for purifying, protecting and transporting critical materials used in processing and manufacturing in semiconductor and other high-tech industries. Additional information can be found at www.entegris.com.

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October 17, 2011 — ERS uncrated the ERS AirCool 3 wafer thermal test system at last week’s SEMICON Europa in Germany.

ERS designs air-cooled thermal chucks for wafer test because of increased in-field reliability. The Aircool 3 is ERS’s third-generation thermal chuck system that exclusively uses air for cooling.

Features from the AirCool and AirCool plus systems are integrated into a modular system designed to be quickly  upgradeable on site. All major wafer prober systems can be fitted with the AirCool 3.

Modular options include zero footprint applications and semi-remote touch-panel control.

ERS makes thermal chucks for wafer test. Learn more at http://www.ers-gmbh.de/ers-gmbh/index.php.

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October 13, 2011 — SEMI honored Dr. Tibor Pavelka (Semilab) with the European SEMI Award; Heinz Kundert (SEMI Europe) with the IC Industry Award for Excellence; and Christian Prischmann (UIbrich) with the SEMI Europe Standards Leadership Award. The ceremony took place during SEMICON Europa, which wraps up today in Dresden, Germany.

Also read: SEMICON Europa 2011: Hopes for 2012 growth, no room for gloom

Dr. Tibor Pavelka, CEO of Semilab Co. Ltd., received the European SEMI Award 2011 for proving that a European metrology company could compete with US and Asian makers. Pavelka co-founded Semilab, became CEO in 1995, and led R&D activities until recently. He helped expand the metrology lines to 32, adding optical and other new electrical material characterization techniques alongside DLTS and

October 10, 2011 – Imec and tool vendor ASML have signed a new 5-year deal to continue collaboration on lithography technologies, both immersion and EUV, through 2015. In November Imec is slated to install ASML’s NXT 1950i 193nm immersion litho tool, and eventually will upgrade its current ASML NXE:3100 preproduction tool to a "production-ready" NXE:3300B system. (Imec, along with Albany CNSE, were the first two public recipients of ASML’s alpha EUV tools). The deal also includes ASML’s computational lithography tools and the company’s Yieldstar S200 metrology platform.

ASML preproduction scanner NXE:3100 for extreme UV lithography, installed at imec

October 6, 2011 — Light source supplier Cymer Inc. (Nasdaq:CYMI) launched SmartPulse, a next-generation data management tool following on the company’s OnPulse Plus product. SmartPulse monitors lithography light source parameters at the wafer, collecting data for a suite of reporting and analysis tools.

The beam metrology module in SmartPulse conveys real-time beam performance data from the light source. It supports Fault Detection Classification (FDC) requirements, enabling excursion detection and management in real time. The system’s beam parameter metrology supports multi patterning lithography illumination schemes for advanced nodes.

SmartPulse is available on argon fluoride (ArF) light sources.

Cymer Inc. (Nasdaq: CYMI) develops light sources used in semiconductor lithography. Please visit www.cymer.com.

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October 4, 2011 — Tamar Technology, precision metrology tool supplier, shipped its first fully automated WaferScan system to a major semiconductor fab. The system performs through silicon via (TSV) etch depth, deep trench depth, wafer thickness, photo-resist thickness, and hole diameter metrology.

The system includes Tamar Technology’s proprietary Wafer Thickness Sensor (WTS) to measure TSV depth and deep narrow trenches on single or bonded wafers. WaferScan uses a proprietary Visible Thickness Sensor (VTS) to measure photo resist, thick film, and various polymers’ thickness. It can measure at the surface and bottom of etched features, monitoring thickness variation and material presence. An integrated video microscope enables automated alignment and vision-based measurements, such as hole diameter.

The metrology tool uses optical and non-destructive methods, measuring "any TSV or trench regardless of the diameter or depth," noted David Grant, president of Tamar Technology.

The system can be configured with multiple sensors depending on measurement requirements. Programmed recipes and factory host integration via SECS/GEM allow fully automated operation. Process excursions are monitored in near real time.

For more information, contact Russ Dudley, Tamar

October 4, 2011 – Bryan Rice, SEMATECH’s newly appointed director of strategic initiatives, tells SST what his new job entails: what he sees as his biggest challenges, which areas will keep SEMATECH’s main attention (hint: the "once and future king" of resources), and what new areas are being explored.

Prior to his litho directorship (replacing Michael Lercel who returned to his assignor IBM), Rice was SEMATECH’s immersion program manager, leading research into high-refractive index lens and immersion fluid materials, and also helped form the group’s double-exposure program (focusing on novel materials for litho-litho-etch patterning). He’s been at SEMATECH since 2006 as an Intel assignee.

Looking back on his tenure as SEMATECH’s litho director, Rice agreed that EUV’s slow progress was "obvious," with the biggest problem being high-power scanner sources. "We as an industry, including SEMATECH, didn’t get the job done; source power still isn’t where it needs to be," he said. The industry is now pouring resources into that problem. For SEMATECH itself, he noted that their competency is in masks, not sources, so they’ve focused on reducing mask defects. (Should SEMATECH have pushed harder to develop its own expertise and leadership in source development? "I grappled with that," he said, but "in the end, there have been multiple companies and maybe hundreds of millions of dollars spent and it’s still not solved. It’s an extremely difficult problem.")

In his new role as director of strategic initiatives, Rice will be tasked with putting together plans to extend SEMATECH’s core missions through the next 5-7 years — work that had been encroaching into the jobs of the individual SEMATECH program directors, to a point where it needed to be centralized into a standalone role. (It was simply "good timing," Rice said, that his tenure as litho director was simultaneously ending.) "Every so often we have to refresh the ideas, problems we have, that have reached their tipping point and ready to change direction," he told SST. "My job is to make certain that the direction changes we make are compatible with what the industry needs." ("The industry" means both SEMATECH members and potential future members, since SEMATECH is looking out several years into some emerging areas, he added.)

Though he only hinted at possible areas of special focus under his new leadership — "some ideas are in a very sensitive point, I can’t discuss publicly" — Rice noted that SEMATECH’s structure has changed, and it needs a "refresh" every couple of years to align with what the industry and member companies require. "Look at what we’re capable of doing and what we’d like to be capable of doing — those two, combined with problems that exist in the industry, I have to mesh them together," he said. That applies not only to SEMATECH’s four core areas (frontend processing/transistors, lithography, metrology, 3D integration) but other branches too, including possibly creating new programs that exploit synergies between those existing divisions. "Nothing is off the table," he said.

The biggest challenge Rice sees is personal: known as a litho expert, he’s now trying to come up to speed on the details in other technology areas. "I felt that I understood that subject matter extremely well — but I can’t say the same for the other areas I’m working on now," he said. As a result, he’s having to rely more heavily on expert advice from other team members at SEMATECH, "more than I had to in litho […] accepting the technical inputs at face-value without having the core experience." A similar challenge will be making sure those deeply involved in the SEMATECH technology programs are advancing them in the right direction: "they don’t work *for* me, but I have to convince them what work is going to be most effective. That’s going to be challenging," he said.

What’s the next big thrust for SEMATECH, to be pursued with the same zeal as its EUV efforts? Will it be III-V materials, 3D TSVs, or other next-generation structures? "The next EUV is …EUV," Rice declared. "Until that’s in production, it’s the once and future king of resources." Assuming EUV is "the workhorse technology" that will "take us through critical layer patterning through the end of the decade," there’s plenty of work to be done in the next 5-7 years to keep it at the top of SEMATECH’s priorities. Once that goal is reached, though, he sees "plenty of challenges coming" in the future: "Other litho areas are on the way," he added, declining to offer specifics. (New SEMATECH litho director Stefan Wurm also hinted at new litho work to be pursued, also declining to offer details.)