Category Archives: Wafer Level Packaging

February 28, 2012 – BUSINESS WIRE — Wafer-level camera maker Nemotek Technologie uncrated a two-element wafer-level camera, Exiguus H12-A2. The two-element lense gives Exiguus H12-A2 high resolution and low (<0.5%) distortion in an ultra-small wafer-level package.

The camera is designed for mobile, laptop, and gaming applications.

Also read: Nemotek wafer-level camera integrates CMOS image sensors

The Exiguus H12-A2 is reflowable, and offers sophisticated camera functions, such as auto exposure control, auto white balance, black level calibration, noise reduction, flicker detection and avoidance. As a high end VGA CMOS wafer-level camera, the solution features an active pixel array of 640H x 480V and measures 1/10-inch. Moreover, the camera features color correction, color saturation, lens shading correction, software reset as well as chrominance control and maintains the ability to withstand extreme temperatures.

In addition, Nemotek marks its debut into the high-end (HE) VGA market with another new camera based on a 720P High End sensor.

Samples of Nemotek’s Exiguus H12-A2 and its High End VGA camera are currently available.

Nemotek Technologie designs, develops and manufactures customized Wafer-Level Cameras for portable applications. For more information, visit http://www.nemotektechnologies.com/.

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February 23, 2012 — coolingZONE LED 2012 Conference, May 29-31 in Berlin, Germany, is soliciting technical presentations on light-emitting diode (LED) energy consumption, LED packaging, heat and air-flow simulations of LED products, and related topics. The coolingZONE LED Conference combines the technical and manufacturer presentations on LED thermal management, and includes technical short courses on the proper cooling and characterization of LEDs.

Papers and speakers are requested on:

  • smartCOOLING of LEDs
  • Thermal transport in LED-based lighting
  • Thermal characterization of LEDs
  • Heat flow and air flow simulations in LED lighting applications
  • Thermal coupling in LED-based lighting systems
  • Cooling solutions for LED-based lighting – from residential to industrial applications
  • Advances in LED packaging
  • Thermal characterization of LED cooling solutions
  • How LED packaging affects its thermal management
  • Temperature and its role in LED reliability and life expectancy predictions
  • LED energy consumption and its comparison with other lighting methods
  • LED cooling – from natural convection to liquid cooling

Abstracts must be submitted by April 1, 2012 at www.coolingZONE.com.

Selected presenters will be notified on April 16, and will have until April 27 to submit their final drafts.

coolingZONE is a global community for information and education on thermal management and heat transfer. These services are provided online and through conferences & short courses.

InnovationFab is a trade mark of Key Management Consult BV, to lead new technology to commercialization. It is an enabler and facilitator at the intersection of photonics, electronics, materials, and processing technology.

Visit the new LEDs Manufacturing Channel on ElectroIQ.com!

February 21, 2012 — Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more. ESTC takes place September 17-20 in Amsterdam, the Netherlands. Organized by IEEE-CPMT since 2006, in association with IMAPS-Europe, the ESTC conference series focuses on interconnect and packaging technologies for electronic system integration. Submit your abstract by April 1.
 
Paper abstracts may be submitted to the following tracks and application areas:

  • Assembly and Manufacturing Technology
  • Materials for Interconnect and Packaging
  • Reliability
  • Embedded Die and Wafer Level Packaging
  • 3D Integration Technology
  • Microsystem Packaging
  • Flexible and Stretchable electronics
  • Advanced and Emerging Technologies
  • Power Electronic Packaging
  • Optoelectronic Packaging
  • Thermal and Mechanical Modeling
  • Electrical Design & Modeling
  • Consumer Electronics
  • Automotive and Industrial Electronics
  • Avionics and Space Electronics
  • Medical Electronics
  • Solid State Lighting
  • Telecom System Electronics
  • Wireless Electronics
  • RF-ID and Smartcards
  • Display and Imager Electronics
  • Energy System Electronics

Submit a 300-500 word abstract that describes the scope, content and key points of your proposed paper. Abstracts must include results and graphics. Please visit www.estc2012.eu to upload your abstract. Submissions for poster presentations are also welcome. Submission deadline for abstracts is April 1, 2012.

ESTC will select the best paper and best poster presentations. For each, the author(s) will receive a personalized ESTC award and a monetary prize from the IEEE-CPMT Region 8 Director.

The official language of all presentations is English. All oral and poster presentation authors are invited to prepare a paper for the conference proceeding which will also be included in the IEEE XPLORE database after the conference.
 
Your submission must include the mailing address, business telephone number and email address of the presenting author and affiliations of all authors. All submitted abstracts will be reviewed by the committee to ensure a high-quality conference. At the discretion of the program committee, paper abstracts submitted may be considered for poster presentation. The work should be original and not previously published, and avoid inclusion of commercial content. Additional instructions about formatting the paper will be published on www.estc2012.eu.

Selected presenters will be notified on June 1, 2012. Final paper manuscript will then be due August 15, 2012.

Related story: Advanced packaging at the 2010 ESTC

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February 21, 2012 — The 2012 IMAPS Device Packaging Conference will take place March 6-8 in Fountain Hills, AZ, with sessions on 2.5/3D packaging, flip chip and wafer level packaging (WLP), micro electro mechanical systems (MEMS), high-brightness light-emitting diodes (HB-LEDs), and passive integration.

Dr. Robert Darveaux, SVP of Technology & Platform Development, Amkor Technology Inc., will keynote Flip Chip & Wafer Level Packaging with "Escalating Challenges in Developing Complex Solutions for Next Generation Package and Interconnect Technologies."

Amkor is also presenting in the technical sessions. IMAPS Device Packaging includes sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase.

To register or get more information on the show, visit WWW.IMAPS.ORG/DEVICEPACKAGING

Visit Amkor Technology at BOOTH #37.

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February 13, 2012 — Complementary metal-oxide semiconductor (CMOS) image sensors in 2011 continued to push charge coupled device (CCD) sensors into a smaller, isolated section of the market. CMOS image sensors are growing on use in mobile electronics and emerging applications, shows analyst firm IHS.

2011 CMOS sensor shipments accounted for 92% of all area image sensors, equaling 2.1 billion units, up 31% from 1.6 billion units in 2010, according to an IHS iSuppli Consumer Platforms topical report. CCD sensor shipments, the remaining 8% of the market, hit 180.3 million units shipped in 2011, dropping 2 percentage points from 2010.

By 2015, CMOS shipments will amount to 3.6 billion units or 97% market share, leaving just 95.2 million CCD shipments to make up the remaining 3% of the market (figure). The move to CMOS image sensors is prompted by cheaper manufacturing costs, greater efficiency, and faster data-throughput speeds, said Pamela Tufegdzic, analyst for consumer electronics at IHS.

Figure. Worldwide image sensor market share forecast. SOURCE: IHS.

Mobile handsets remain the dominant application for CMOS sensors, representing 79% of total CMOS shipments in 2011. Video conferencing is the second-biggest application market by shipments, due to the inclusion of cameras in notebook computers. CMOS sensors also found increasing use in the growing sectors of security through network video surveillance systems and automotive through the use of back-up cameras and lane-departure warnings, blind-spot detection, and infrared night vision.

Also read: CMOS image sensors see growth beyond cellphones

CCDs still find acceptance in the industrial markets and in digital still cameras. However, among high-end digital single lens reflex (DSLR) cameras, CCD use will shrink from 12% in 2011 to just 1% by 2014, and there are other areas of decline as well. With still camera purchases waning, and smartphone adoption growing, overall CCD use will decline further.

The introduction of backside illumination (BSI) technology was the break in camera technology that gave CMOS the edge over CCD, IHS asserts. Found in high-end compact cameras as well as the iPhone 4S from Apple Inc. and various Android phones, BSI helps to eliminate noise issues found in earlier frontside illumination (FSI) CMOS sensors, and also enables better picture quality in low-light conditions.

The higher cost of BSI technology (approximately 20% more than FSI in 2011) makes it comfortable in higher-end products, such as Apple’s iPhone 4 and many Android phones. BSI is projected to be in 56% of smartphones and higher-end feature handset camera phones during 2012, and in 92% of the same class of handsets by 2015. Controlling the cost of BSI is critical to mass adoption.

Among companies competing in the space, Sony Corp. was the top player for overall image sensors during the fourth quarter, followed by OmniVision Technologies, Aptina Imaging Corp., Sharp Corp. and Samsung Electronics Co. Ltd.

Sony’s next-generation BSI sensor in a stacked structure could pave the way for faster speeds and lower power consumption. Read about the technology: Sony stacks CMOS image sensor pixel structures and chips

Samsung announced a 16-megapixel CMOS sensor that will be making its way into smartphones and tablets later this year. The S5K2P1 sensor, Samsung says, will be good enough for use even in dedicated digital still cameras and camcorders where superior image quality is a prime consideration, due to the sensor’s excellent sensitivity and low-noise performance.

Access iSuppli’s report, BSI Success Drives the CMOS Image Sensor Segment, at http://www.isuppli.com/Home-and-Consumer-Electronics/Pages/BSI-Success-Drives-the-CMOS-Image-Sensor-Segment.aspx?PRX

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February 13, 2012 — Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.

The database details fab locations, products, technologies, manufacturing facilities, and financial information. Fab data includes employee counts, sales figures, capacity info, and more.

The database covers 50 countries, extending throughout Europe and the Middle East area (EMEA), and Russia. There are 300+ fabs in Europe, Yole reports. It includes major changes that have taken place since 2007, such as fab closures and new investments.


 
The European Microelectronic Fabs Database & Report 2012 includes:

The database can be used to understand the European fab environment, and assess business opportunities in the European and Middle-East market.

Companies described in the database: ABB Semiconductor, Acreo AB, Altis/GIS Semiconductor, Analog Devices, austriamicrosystems, Autopribor, Avago Technologies, Boehringer Ingelheim microParts, Robert Bosch, Colibrys, Dynex Semiconductor, e2v technologies, ELMOS, EM Microelectronic Marin, EPCOS, Estel, First Sensor Technology, FLIR Systems, Freescale Semiconductor, GE Measurement & Control Solutions, GLOBALFOUNDRIES, HL-Planartechnik, IBM Microelectronics, IMEC, Infineon Technologies, Intel, International Rectifier, IPDIA, Leister Process Technologies, LETI, Lionix, LITE F, MHS Electronics, Micran, Microfab Bremen, Micron Technology, Micronas, Nemotek Technologies, Norstel, Nortel Technology, NXP, Oclaro Inc., Olivetti I-Jet, OMMIC, On Semiconductor, OptoGaN, OSRAM, Philips, Photonix, Prema Semiconductor, Pulsar (Scientific Research Institute), Raytheon Company, Retina Implant, RF Micro Devices, Scottish Microelectronics Centre, SE MEFAB, SENSIRION, SenSonor Technologies, Sigm Plus, Silex Microsystems, Siliconix, Silway Semiconductor, SINTEF, STMicroelectronics, Telefunken Semiconductors, Texas Instruments, Texet, Three-Five Epitaxial Services, TowerJazz Semiconductors Ltd., Tronic’s Microsystems, ULIS , United Monolithic Semiconductors, Vishay Intertechnology, VTI Technologies, VTT, XFAB semiconductor.

Access the report at http://www.i-micronews.com/reports/European-Microelectronic-Fab-Database-Report-2012/226/

February 10, 2012 — In its 2011 recap and Q4 financial results, semiconductor packaging company Amkor (NASDAQ:AMKR) shared that it cut costs through workforce reductions in Q4 2012, and announced a voluntary retirement program in Japan to continue this initiative.

Amkor incurred a $4 million charge in Q4 associated with the workforce reduction in Q4.

"As part of our continuing efforts to rationalize our cost structure, we have initiated a voluntary retirement program in Japan. While the ultimate amount of the charge for this restructuring initiative will depend on the level of employee participation, we currently anticipate incurring a charge of around $6 million in the first quarter 2012," said Joanne Solomon, Amkor’s executive vice president and chief financial officer.

Amkor’s Q4 results and 2011 review, as well as Q1 2012 forecast, are available here.

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February 8, 2012 — The Semiconductor Industry Association (SIA), representing US semiconductor manufacturing and design, released the 2011 International Technology Roadmap for Semiconductors (ITRS), a roadmap of near-term and long-term challenges and innovations for the semiconductor design and manufacturing industry through 2026.

Also read: ITRS 2010: What happened during this off-year?

The ITRS is sponsored by five regions of the world; Europe, Japan, Korea, Taiwan, and the United States and is overseen by SIA. The 2011 ITRS was first presented at a public forum in Incheon, Korea on December 14, 2011. Through the cooperative efforts of the global chip manufacturers and equipment suppliers, research communities and consortia, the Roadmap teams identify critical challenges, technical needs and potential solutions.

2011 edition. Several key areas of advancement have been highlighted in the 2011 ITRS, specifically: DRAM and Flash memory, and micro-electro-mechanical systems (MEMS).

Dynamic random access memory (DRAM) technology development will be accelerated, allowing for new higher-performance servers and sophisticated graphics for game consoles. Flash technology, used as memory in mobile computing devices such as digital cameras, tablet PCs and cell phones, will experience accelerated development over the next 2 years. The introduction of three-dimensional (3D) flash technology, beginning in 2016, will bring greater memory capabilities to a range of popular consumer electronics.

The 2011 ITRS also explores the newest possibilities for innovative interconnects, switches, devices, and materials to advance nanotechnology. While the continued scaling down to the nanometer level occurs, innovative designs and models for new applications and products have expanded research and development of MEMS, increasingly included in smartphones, tablets, digital cameras, and numerous other consumer electronic products. Researchers are also increasing attention on RF and analog mixed-signal technologies.

Also read: NIST collaborates on MEMS roadmaps: ITRS, iNEMI

One of the primary challenges that the industry has identified is how to decrease the size of semiconductors while increasing performance standards to meet consumer demands. In addition to addressing scale and performance challenges, the ITRS presents models for enhancing the highly complex manufacturing and measurement processes required to achieve smaller, higher performance and more energy efficient semiconductors. The ITRS also focuses on cost-effective manufacturing and resource conservation to meet the rapidly changing needs of semiconductor design innovations.

Also read: Packaging, assembly changes coming in next ITRS

Each ITRS working group coordinates with related teams across disciplines to write reports indicating the state of the current technology, technology challenges, critical needs, potential solutions, and areas of innovation. When incorporated into the ITRS, the reports provide guidelines for the global industry that are intended for technology assessment only, without regard to any commercial considerations. The roadmap can serve as a guide for corporate strategic plans and business unit programs; help to assess lead times for equipment development plans, process and materials; and assess key metrics for industry productivity/profitability such as progress on Moore’s law, productivity trends, industry cycles and economic models.

Access the ITRS at www.itrs.net. 

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February 7, 2012 — Kyocera America, Inc. doubled its flip chip assembly capacity for microelectronic devices with a $3.5 million Class-10,000 cleanroom, offering lead-free processes in San Diego. Kyocera America is a Qualified Manufacturer’s List (QML)-certified flip-chip assembly provider.

The cleanroom can fabricate fine-pitch flip-chip multiple components within one operation, and performs vacuum die-attach and vacuum-assembly sealings for flip-chip and multi-chip module (MCM) assembly. The expansion also reduces overall cycle times for all levels of manufacturing at Kyocera America.

Kyocera America can provide prototype to high-volume microelectronics package production in San Diego rather than sending it offshore, said Tim Roth, GM, Kyocera’s Assembly Technology Division. "Along with higher volume production, Kyocera now offers lead-free flipchip assembly, ahead of federal RoHS regulations, which take effect in 2014."

Kyocera provides assembly services for diverse microelectronics markets, including high-speed digital communications, high-reliability applications, high-count I/O devices, high-end servers, multi-core processors and data transport infrastructure. The company recently increased its engineering staff to provide additional customer service, design and development expertise.

Kyocera has performed US microelectronic package manufacturing for more than 40 years; it has performed assembly services in San Diego since 1991.

Kyocera America Inc. provides high-reliability ceramic packages, complex modules, and contract assembly services. It is a wholly-owned subsidiary of Kyocera International, Inc., the North American holding company for Kyocera Corporation. Internet: http://americas.kyocera.com/kai/semiparts

Kyocera Corporation (NYSE:KYO) (TOKYO:6971), the parent and global headquarters of the Kyocera Group, can be found at http://global.kyocera.com/.

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January 31, 2012 — STATS ChipPAC Ltd. (SGX-ST:STATSChP), semiconductor test and advanced packaging service provider, decided not to resume semiconductor assembly operations in its Thailand plant, owing to extensive equipment and facility damages sustained during the disastrous floods in Q4 2011.

The plant was located in the Navanakorn Industrial Estate, Pathum Thani, Thailand. Approximately 1,250 employees, about 12% of STATS ChipPAC’s global workforce, will be affected by the plan, and will receive fair severance benefits and other support. STATS ChipPAC found the initial flood restoration effort taking longer than expected, and said in early December that it would try to be on-line in January.  

Partial wafer-level chip-scale packaging (WLCSP) and test operations will continue until Q3 2012. STATS ChipPAC is shifting production to its other manufacturing locations in Singapore, Korea, and China. The packaging company recently held the groundbreaking ceremony for a new factory in Singapore.

The "significant damage" to STATS ChipPAC’s Thailand operations made the decision "painful but unavoidable," said Tan Lay Koon, president and CEO, STATS ChipPAC. "The facility restoration period and the extensive requirements of resuming full production in the Thailand Plant make it uneconomical … to return to full manufacturing operation."

STATS ChipPAC incurred flood-related charges totalling $55.5 million comprising goodwill impairment ($24.5 million), plant and equipment impairment ($16.3 million), and other related charges ($14.7 million) in Q4 2011. The Company expects to file a property damage and business interruption claim with its insurers during Q1 2012.

The suspension of operations at the Thailand Plant due to flood accounted for a 7.6% reduction in revenue for Q4 2011 compared to Q3 2011. "Despite a revenue reduction of 7.6% for the fourth quarter of 2011 compared to the prior quarter resulting from the suspension of our Thailand operation due to flood, our revenue for the fourth quarter of 2011 only decreased by 3.8% over prior quarter as we benefited from strong demand for our services in the communications market," said Koon.

STATS ChipPAC Ltd. provides semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com.

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