Category Archives: LEDs

ROHM has recently announced the availability of an ultra-compact reflector-type LED optimized for consumer devices such as matrix light sources for gaming and wearables that demand increased miniaturization.

The MSL0402RGBU reflector-type 3-color LED leverages miniaturization technology cultivated over many years to achieve the smallest size in the industry (1.8mmx1.6mm). This enables high-density mounting and provides excellent color mixing characteristics, ensuring support for high resolution LED matrices.

In order to turn on matrix light sources it is necessary to take measures against ESD. Unlike conventional solutions that utilize a Zener diode, the MSL0402RGBU adopts an element with high ESD resistance. This makes it possible to superior ESD protection without a Zener diode and prevent light emission of unnecessary blocks in matrix circuits, resulting in clearer display.

In recent years, LEDs capable of representing the full color range are expected to be widely adopted in a variety of fields, including digital signage requiring improved design flexibility. At the same time, as applications become smaller and more sophisticated the need for greater expressiveness grows, along with increased miniaturization and long-term reliability. Up to now, ROHM offers ultra-compact molded type LEDs (PICOLED), high brightness reflector types (MSL series), and compact high brightness 3-color LEDs with excellent color mixing, but to meet market demands ROHM developed the industry’s smallest high brightness reflector-type RGB LEDs (MSL0402RGBU).

rohm led

Commodity prices, supplier viability, and geopolitical concerns top the list of risks sourcing professionals face in 2017, according to survey from IHS Markit (Nasdaq: INFO).

Findings from the Trends in Global Sourcing Survey, the fifth annual survey of global procurement and purchasing executives which assesses the risk environment and sourcing trends, indicate that support for China as a low-cost sourcing destination is waning.

“The share of respondents who agree that China is a low-cost sourcing destination dipped below 50 percent for the first time in 2016,” said Paul Robinson, economist at IHS Markit. “This was down markedly from 70 percent in the 2012 survey.”

“Taken together with continued support for the country as a sourcing destination, the survey signals the arrival of China as a hub, or even the hub, of global supply chains rather than a mere cheap outsourcing destination,” Robinson continued.

China, India, and other nations in Asia continue to be the biggest winners in insourcing, with each showing strong increases. The developed world, particularly the European Union and the United States, show the weakest results, with less than a quarter of respondents planning to increase sourcing in either region. A rare bright spot outside of Asia was the continued growth in Mexico, where 26 percent of respondents are looking to increase sourcing, up from 20 percent a year ago.

chinas role

The survey respondents see the financial costs of supply chain disruptions increasing, with 19 percent of respondents saying that it was significantly increasing. This represents a reversal of the 2015 results when just one percent of respondents had that view. Less than two percent of respondents in the 2016 survey viewed the risk as decreasing at all.

By Denny McGuirk, SEMI president and CEO

“Do not go where the path may lead, go instead where there is no path and leave a trail.”  Attributed to Ralph Waldo Emerson, this could be the credo of our industry.  Moore’s Law has created $13 trillion of market value and we’ve been pioneering the way forward – since even before Gordon Moore made the famous “observation” that became Moore’s Law more than 50 years ago.  Our industry paved the road forward with advancements in design, materials, processing, equipment, and integration, traveling at the speed of exponential growth number in transistors per chip (doubling approximately every two years).

Today, globally, we’re shipping more than one trillion ICs per year!  Leading-edge chips boast more than 10 billion transistors at the advanced 10nm (gate length) technology node and are made with 3D FinFET architectures formed by 193nm wavelength immersion multi-patterning lithography.  It’s become a very challenging – and very expensive – road (a single lithography tool alone costs in the tens of millions of dollars).  The companies building the road ahead are bigger and fewer as massive bets now need to be placed on new fabs costing more than $5 billion and even $10 billion and where a new single chip design alone costs more than $150 million to bring into production.

What follows, in Part 1 of this two-part article, is a quick look back at the industry in 2016 and the road ahead in 2017 followed by what SEMI achieved in 2016 and where SEMI’s road will lead in 2017 to keep pace our industry charging forward where there is no path. Part 2 (next week’s Global Update) will focus on SEMI 2020 initiatives.

A look back at 2016: “Straight roads do not make skillful drivers”

2016 was definitely not a straight road; truly it was a wild ride – so, SEMI members have become extremely skilled drivers. The semiconductor manufacturing industry had a slow first half with pessimism building throughout the first quarter, but by April semiconductors bottomed and NAND investment and a slate of new China projects drove a strong second half.  For semiconductor equipment, SEMI’s statistics indicate global sales in 2015 were $36.5 billion and 2016 came in at $39.7 billion, ultimately ending up about 9 percent.  For reference semiconductor materials in 2015 was $24.0 billion and 2016 came in at $24.6 billion, up nearly 2.6 percent year-over year (YoY).

But, it turns out, that’s not half the story.  2016 was full of surprises.  At the geopolitical level, Brexit, an impeachment in South Korea, and a Trump win were wholly unanticipated and leave a lot of questions as to how that road ahead might look.  In technology, the Galaxy Note 7 mobile phone became an airline hazard announcement and stalwarts like Yahoo! faded into the background (now part of Verizon).  In part due to challenges of the road ahead (and because the cost of capital remained low) M&A fever continued in semiconductors with more than $100B in deals announced in 2016.

It was an astonishing year for combinations with huge deal announcements such as Qualcomm buying NXP for $47 billion and SoftBank buying ARM for $32 billion.  Meanwhile, mergers in the equipment and materials space continued, to name a few notables ASML’s acquisition of Hermes Microvision, DuPont and Dow announcing the intent to merge (announced December 2015, but still in the works), and Lam Research and KLA-Tencor ultimately calling off their deal due to complications of regulatory pushback.  The extended supply chain was mixing things up, too, with acquisitions like the announcement by Siemens to acquire Mentor Graphics.  It has been very active, overall.  This was the second year of semiconductor M&A deals valued at more than $100 billion, a signal that size and scale is critical to build the road ahead.

A look ahead: “Difficult roads often lead to beautiful destinations”

With all the talk about roads, it’s no surprise that the automotive segment is gathering momentum as a strong growth driver for the electronics supply chain.  Not only is there increasing electronics content in cars for comfort and infotainment, but also for assisted and autonomous driving and electric vehicles which are ushering in a new era of electronics consumption.

Along with automotive, IoT (Internet of Things), 5G, AR/VR (Augmented Reality and Virtual Reality), and AI (Artificial Intelligence) round out a set of powerful IC and electronics applications drivers (see figure).  Per an IHS Study, 5G alone may enable as much as $12.3 trillion in goods and services in 2035. Gartner’s most recent forecast is cause for optimism further down the electronics manufacturing supply chain.  Gartner see IC revenue growing from 2016’s $339.7 billion to 2017’s $364.1 billion up 7.2 percent and growing further in 2018 at $377.9 billion up 3.8 percent.  For semiconductor equipment, SEMI’s forecast indicates 2015 was $36.5 billion, 2016 will come in at $39.7 billion, and 2017 is projected to be $43.4 billion, pointing to both 2016 and 2017 experiencing approximately 9 percent YoY growth.

In 2017, China investment is projected to continue as a major driver, likely consuming over 16 percent of the total global equipment investment (second only to South Korea).  SEMI is currently tracking 20 new fab projects.  Investments come from both multinationals and local Chinese ventures.  A sign of the rise of China is China’s upward production share trend of its own IC consumption market (IC Insights): 8 percent in 2009, 13 percent in 2015, and 21 percent in 2020. Further down in the electronics supply chain, fab equipment related spending in China will rise to more than $10 billion per year by 2018 and remain at that level or above for subsequent years.

NAND will continue to be a major driver with 3D NAND investment leading the way.  Silicon in Package (SiP) and heterogeneous integration will increasingly be solutions to augment traditional feature scaling to fit more transistors into less space at lower costs.  Materials innovations will be relied upon to solve front-end and packaging challenges while standard materials will be the focus of increased efficiencies and cost reduction. 200mm fab capacity will grow and stimulate new 200mm investment with upside driven by power devices and MEMS segments.  Investment in foundry MEMS will grow by an estimated 285 percent (2015 to 2017).

“There are far better things ahead than any we leave behind”

SEMI, the global non-profit association connecting and representing the worldwide electronics manufacturing supply chain, has been growing with the industry for 47 years.  SEMI has evolved over the years, but it has remained as the central point to connect.  Whether connecting for business, connecting for collective action, or connecting to synchronize technology, SEMI connects for member growth and prosperity.

As a reminder, here are SEMI’s mission, vision, and 2020 strategic focus areas.

  • Mission — our focus for the next five years
    • SEMI provides industry stewardship and engages our members to advance the interests of the global electronics manufacturing supply chain.
  • Vision — what we stand for
    • SEMI promotes the development of the global electronics manufacturing supply chain and positively influences the growth and prosperity of its members.  SEMI advances the mutual business interests of its membership and promotes a free and open global marketplace.
  • Members’ Growth — 2020 strategic focus
    • SEMI enables member growth opportunities by evolving SEMI communities and building new communities across the global electronics manufacturing supply chain via cooperation, partnerships, and integration.
  • Members’ Prosperity — 2020 strategic focus
    • SEMI enables members to prosper by building extended supply chain collaboration forums providing opportunities to increase value while optimizing the supply chain for SEMI members.

Our industry is in the midst of a vast change.  To deal with the escalating complexity (making a semiconductor chip now uses the great majority of the periodic table of the elements) and capital cost, many companies have had to combine, consolidate, and increasingly collaborate along the length of the electronics manufacturing supply chain.

Some companies have broadened their businesses by investing in adjacent segments such as Flexible Hybrid Electronics (FHE), MEMS, Sensors, LEDs, PV, and Display.  Lines are blurring between segments – PCBs have morphed into flexible substrates, SiP is both a device and a system.  Electronics integrators are rapidly innovating and driving new form factors, new requirements, and new technologies which require wide cooperation across the length of the electronics manufacturing supply chain and across a breadth of segments.

The business is changing and SEMI’s members are changing.  When SEMI’s members change, SEMI must change, too – and SEMI has, and is.  SEMI developed a transformation plan, SEMI 2020, which I wrote about at the beginning of 2016.  We’re well on our way on this path and in next week’s e-newsletter Global Update, I’d like to update you on what we’ve accomplished and what’s to come.

Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2017.

Driving the industry forward with materials engineering

Raja_Prabu_fullPrabu Raja, vice president and general manager, Patterning and Packaging Group, Applied Materials, Inc.

Over the past few years, the industry has made remarkable progress in bringing 3D chip architectures to volume production. In 2017, we will continue to see exciting technology innovations for scaling 3D NAND devices to 64 layers, ramping the 10nm process node into volume manufacturing and increasing the adoption of highly integrated chip packages.

With the transition to the 3D and sub-10nm era, the semiconductor world is changing from lithography-based scaling to materials-enabled scaling. This shift requires multiple new materials and capabilities in selective processing.

The magnitude and pace of these changes are truly disruptive. For example, with 3D NAND materials innovations for hard mask deposition and hard mask etch are essential. The challenge is to build high aspect ratio vertical structures with uniform profiles from the top to the bottom as more layers are added. Selective removal processes can remove targeted materials in vertical and horizontal structures without damage or residue throughout the stack.

For logic/foundry, the introduction of the 10nm process node in volume manufacturing brings significant growth in the number of patterning steps. This trend will increase even more for 7nm and below designs. Patterning these advanced nodes requires innovative etch capabilities to deliver feature-scale uniformity with low line edge roughness. Selective processes and alternative manufacturing schemes will also be needed as the industry seeks solutions for layer-to-layer vertical alignment. We expect this to result in a two-fold increase in the number of materials to be deposited and removed.

Finally, the industry will continue to adopt new and improved packaging schemes for enabling increased device performance, lower power consumption and to deliver desired form factors. In 2016, we saw the volume adoption of Fan-Out packaging in mobile devices and this trend is expected to grow further in 2017. The high performance computing segment will pursue 2.5D interposer and/or 3D TSV packaging schemes for higher memory bandwidth, lower latency and better power efficiency.

Applied Materials is focused on delivering game-changing selective process technologies and materials innovations to help solve the industry’s toughest challenges.

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Following economic leaders meeting in Switzerland for the World Economic Forum, electronics manufacturing executives will attend Europe’s SEMI Industry Strategy Symposium (ISS Europe) in Munich, Germany on 5-7 March. Hosted by SEMI Europe, the Symposium brings together leading analysts, researchers, economists, and technologists for critical insights on the forces shaping the electronics manufacturing supply chain. ISS Europe 2017 is the three-day flagship business event that discusses how to cope with the rapid changes and growing challenges of the digital revolution.

“ISS Europe is the leading European strategic platform where industry thought leaders across the electronics manufacturing value chain share the latest analysis and outlooks.  The conference covers global industry trends and challenges and opportunities from innovation, materials, design, and manufacturing – with a focus on end-applications in automotive, health care and smart manufacturing,” said Laith Altimime, president, SEMI Europe.

Twenty industry leaders will present insights into the current market developments in automotive, smart manufacturing, and health, including:

  • TSMC Europe: Maria Marced, president, High Performance Applications to Drive Innovation and Collaboration
  • Mentor Graphics: Wally Rhines, CEO, Semiconductor Consolidation versus Specialization: What’s the Driving Force for Mergers?
  • AUDI AG: Berthold Hellenthal, Robust Design / Komponentenerprobung Elektronik, Cross-Industry Collaboration Networks Accelerate Innovations
  • Dresden University Hospital: Christopher Piorkowski, professor at the Heart Center, Digital Health in Cardiovascular Medicine: Patients, Sensors, and Clinical Care
  • Bosch: Birte Lübbert, senior VP, Smart Manufacturing by Bosch in Reutlingen Plant 2
  • Imec: Ann Stegen, executive VP, Transformation into a 7nm Logic Node Solution with Fundamental Advantages

Join Europe’s strategic thinkers and business drivers at ISS Europe 2017 in Munich (Germany) from March 5-7, 2017!  Register here. For more information visit: www.semi.org/eu/iss-europe-2017

At next week’s SPIE Photonics West in San Francisco, imec, a research and innovation hub in nano-electronics and digital technologies, will introduce a new image sensor with integrated color (Red Green Blue, RGB) and narrow-band near-infrared (NIR) filters. This breakthrough optical filter integration platform will enable many different application fields from medical, industrial, security surveillance, automotive to virtual and augmented reality, where near-infrared signals need to be extracted and overlaid on top of color images.

Imec’s RGB-NIR multispectral platform demonstrates for the very first time the possibility to integrate together standard RGB color filters, NIR-cut filter, NIR narrow band-pass filters and on-chip microlenses technology, down to small pixels as small as 5µm today. The NIR band-pass filter and design pattern implementation can be tuned to match requirements of a specific application case, e.g. the wavelength of a particular laser or LED light.

“An affordable, high resolution and high speed solution for integrating true RGB color combined with narrow-band NIR detection was essential to develop for future applications that need to detect or track near infra-red signals that should not be visible to human eyes,” explains Andy Lambrechts, program manager for imec’s integrated imaging activities. “This capability to integrate a color view with one or several near-infrared narrow bands will be a key enabler for next-generation 3D, virtual reality (VR) & augmented reality (AR) imaging platforms. As well as in machine vision, medical, automotive and security surveillance applications.”

Leveraging imec’s background in CMOS scaling, its semiconductor fab, equipment and process technology, imec designs and manufactures interference based optical filters at wafer level, deposited and patterned directly on top of the CMOS image sensor pixels. Imec’s unique infrastructure provides very integrated, clean (class 1 – particle free) and high yield optical filter integration with strong potential for scalability in high-volume.

The first image sensor and camera prototypes will be demonstrated at SPIE Photonics West in San-Francisco on booth 4333 (North Hall of Moscone center). They are already available for early sampling and evaluation by strategic partners.

image005

Amtech Systems, Inc. (NASDAQ:  ASYS), a global supplier of production equipment and related supplies for the solar, semiconductor, and LED markets, today announced fiscal year 2017 year-to-date order bookings through January 20, 2017 are approximately $84 million.  This includes solar orders of $60 million.   The solar bookings include major wins for the Company’s high productivity PECVD platform with top tier customers in China, Malaysia, and Taiwan and an n-type bi-facial turnkey order from a new customer in China.  The majority of the orders are expected to ship within the next six to nine months.

Fokko Pentinga, CEO and President of Amtech, commented, “These competitive wins are a direct result of our ongoing investment program and a clear testament to the Company’s ability to meet the market’s expectations as they selectively invest in next-generation technology solutions.  Our newly introduced PECVD platform is recognized as a compelling solution to increase the efficiency in solar cell manufacturing while lowering the cost of ownership.  The continuing development of our advanced n-type technology led to this turnkey order from a customer who will use the technology for Bi-Facial glass-glass module design in the first of a multi-phase 1GW cell and module expansion.  We believe that Amtech has the right mix of n-type and PERC cell technologies for this expanding global solar market where success is driven by the best next-gen technology solutions.  Recently, we have experienced increased customer interest in our n-type technology.  As the solar market looks to the future, we believe n-type cell technology has the best roadmap to higher efficiency.”

Fueled by lightning-fast demand for ubiquitous connectivity, the number of connected Internet of Things (IoT) devices globally will jump by 15 percent year-over-year to 20 billion in 2017, according to new analysis from IHS Markit (Nasdaq: INFO).

In a free new report entitled “IoT Trend Watch 2017,” IHS Markit technology analysts have identified four key trends that will drive the IoT this year and beyond. Increasingly, the report says, businesses see the IoT as a tremendous opportunity to create unique value propositions by linking disparate systems of connected devices that range from multiscreen content sharing to smart city networks.

IHS Markit defines IoT as a conceptual framework, powered by the idea of embedding connectivity and intelligence into a wide range of devices. “These internet-connected devices can be used to enhance communication, automate complex industrial processes and provide a wealth of information that can be processed into useful actions – all aimed at making our lives easier,” said Jenalea Howell, research director – IoT connectivity and smart cities for IHS Markit.

According to the report, the industrial sector — led by building automation, industrial automation and lighting — will account for nearly one half of new connected devices between 2015 and 2025.

IHS Markit has named these four trends as leading the IoT evolution in the coming years:

Trend #1 – Innovation and competitiveness are driving new business models and consolidation

  • To date, the focus on IoT monetization has rightly revolved around the way in which suppliers earn revenue selling components, software or services to IoT application developers. Increasingly, however, the focus is shifting to the IoT developers themselves and how they will monetize new streams of data delivered by their IoT deployments.
  • A wide range of monetization models are being tested, reflecting the fragmented nature of the IoT market across numerous vertical industries. Successful models will revolve around “servitization” and closer, ongoing relationships with end customers, the report says.

Trend #2 – Standardization and security are enabling scalability

  • With the high growth in IoT deployments and much hype surrounding the promise of the IoT marketplace, scaling the IoT is highly dependent on two factors: first, the pace at which devices are connected and second, the ability to manage a large number of devices.
  • Currently, diverse standards and technologies make it difficult to evaluate the many technology options available. Stakeholders also must take a holistic, end-to-end view of securing systems comprehensively and move beyond focusing only on device security.
  • By 2020, the global market for industrial cybersecurity hardware, software and devices is expected to surpass $1.8 billion as companies deal with new IoT devices on business networks as well as a new wave of mobile devices connected to corporate networks.

Trend #3 – Business models are keeping pace with IoT technology

  • The methods used to monetize the IoT are almost as diverse as the IoT itself. Many pioneers of the IoT sold products to build it. That is still happening, of course, but now there is a shift to reaping the benefits of the data that’s been created.
  • An overabundance of business models are being tested to determine which models work and for which applications. Advertising, services, retail and big data are just a few of the areas that have spawned many innovative experiments in monetization. In the coming years, the pace of innovation will slow as successful business models are identified.

Trend #4 – Wireless technology innovation is enabling new IoT applications

  • Advances in wireless technologies will continue to extend the IoT at both the low and high ends. At the low end, low-power wide-area network (LPWAN) promises low cost, low power and long range, connecting millions of devices that previously could not be unified in a practical way. At the high end, 802.11ad makes it possible to wirelessly connect very high performance applications such as 4k video.
  • Beyond 2020, 5G has the potential to address new, mission-critical use cases, particularly where mobility is essential. By 2020, IHS Markit expects around two billion device shipments by integrated circuit type will feature integrated cellular technology.

Mentor Graphics Corporation (NASDAQ: MENT) today announced that company chairman and CEO Dr. Walden C. Rhines has been named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE). Dr. Rhines is being recognized for leadership and technology innovation in integrated circuit design and automation.

The IEEE Grade of Fellow is conferred by the IEEE Board of Directors upon a person with an outstanding record of accomplishments in any of the IEEE fields of interest. The total number selected in any one year cannot exceed one-tenth of one percent of the total voting membership. IEEE Fellow is the highest grade of membership and is recognized by the technical community as a prestigious honor and an important career achievement.

During Dr. Rhines’ tenure at Mentor Graphics, revenue has nearly quadrupled, enterprise value increased by 8X and Mentor has grown the industry’s number one market share solutions in four of the ten largest product segments of the electronic design automation (EDA) industry. At Mentor Graphics, he has built leading industry positions in areas outside of traditional EDA, including system design, embedded software, automotive and hardware emulation. This has led to innovation and growth of the entire EDA industry.

Prior to joining Mentor Graphics, Rhines was executive vice president of Texas Instruments (TI) Semiconductor Group, sharing responsibility for TI’s Components Sector, and having direct responsibility for the entire semiconductor business with more than $5 billion of revenue and over 30,000 people.

During his 21 years at TI, Rhines managed TI’s thrust into digital signal processing and supervised that business from inception with the TMS 320 family of DSPs through growth to become the cornerstone of TI’s semiconductor technology. He also supervised the development of the first TI speech synthesis devices (used in “Speak & Spell”) and is co-inventor of the GaN blue-violet light emitting diode (now important for DVD players and low energy lighting). He was president of TI’s Data Systems Group and held numerous other semiconductor executive management positions.

Dr. Rhines received the 2015 Phil Kaufman Award for Distinguished Contributions to EDA, presented by the Electronic System Design Alliance (ESDA), formerly the Electronic Design Automation Consortium, and the IEEE Council on EDA (CEDA). The award honors individuals who have had demonstrable impact on the field of EDA through technology innovations, education/mentoring, or business or industry leadership. Dr. Rhines was recognized for growing the EDA and integrated circuit (IC) design industries through his efforts as a leading voice of EDA and for pioneering the evolution of IC design to system-on-chip (SoC) design.

Rhines has served five terms as ESDA chairman and is currently serving as a director. He is also a board member of the Semiconductor Research Corporation. He has previously served as chairman of the Semiconductor Technical Advisory Committee of the Department of Commerce and as a board member of the Computer and Business Equipment Manufacturers’ Association (CBEMA), SEMI-Sematech/SISA, University of Michigan National Advisory Council, Lewis and Clark College and SEMATECH.

Dr. Rhines holds a Bachelor of Science degree in metallurgical engineering from the University of Michigan, a Master of Science and Ph.D. in materials science and engineering from Stanford University, a master of business administration from Southern Methodist University and Honorary Doctor of Technology degrees from the University of Florida and Nottingham Trent University.

DGIST announced that Professor Kyung-in Jang’s research team succeeded in developing a technology that can control various color changes by coating several nanometers of semiconducting materials on a metal substrate through joint research with a research team led by professor Young-min Song of GIST.

Professor Kyung-in Jang’s research team has succeeded in changing the unique color of metals such as gold, silver, aluminum, etc. with strong thin-film interference effect caused by light reflected on the surface of the metals and semiconducting materials by coating an ultra-thin layer of several nanometers (1 nanometer is one one-billionth of a meter) of semiconductor substances on the metals.

There have been previous studies that show that color changes depend on the thickness of ultra-thin film of semiconducting materials such as germanium coated on a gold substrate; however, there have been some difficulties due to the rapid change of colors and with color darkening techniques.

The research team coated a thin germanium film of 5 to 25 nanometers on a gold substrate by utilizing oblique angle deposition (OAD). As a result, they succeeded in producing various colors such as yellow, orange, blue, and purple at will according to the thickness and deposition angle of the germanium coating.

It was confirmed that the range of color expression expanded and the purity of color was enhanced by making a porous structure with a large number of fine holes that have a significant presence in the germanium layer. By applying the oblique angle deposition method, the variation and purity of colors were also varied according to the thickness change of the germanium film in nanometers.

Professor Kyung-in Jang from DGIST’s Department of Robotics Engineering said, “The result of this research is the development of a simple method of applying various colors to existing electronic devices and currently we have succeeded in expressing single colors, but we may also be able to coat patterns such as symbols and pictures. In the future, I think it can be used in coating visual designs on flexible devices such as solar cells, wearable devices, and displays that are used for various purposes including building exterior walls. It can also be applied in camouflage by coating things with the same pattern or color as the surrounding objects.”

Meanwhile, this research outcome was published on December 9, 2016 in the online edition of Nanoscale, an international academic journal in the field of nanotechnology, and the research was supported by the basic research project (collective research) of the National Research Foundation of Korea.