Category Archives: MEMS

Following economic leaders meeting in Switzerland for the World Economic Forum, electronics manufacturing executives will attend Europe’s SEMI Industry Strategy Symposium (ISS Europe) in Munich, Germany on 5-7 March. Hosted by SEMI Europe, the Symposium brings together leading analysts, researchers, economists, and technologists for critical insights on the forces shaping the electronics manufacturing supply chain. ISS Europe 2017 is the three-day flagship business event that discusses how to cope with the rapid changes and growing challenges of the digital revolution.

“ISS Europe is the leading European strategic platform where industry thought leaders across the electronics manufacturing value chain share the latest analysis and outlooks.  The conference covers global industry trends and challenges and opportunities from innovation, materials, design, and manufacturing – with a focus on end-applications in automotive, health care and smart manufacturing,” said Laith Altimime, president, SEMI Europe.

Twenty industry leaders will present insights into the current market developments in automotive, smart manufacturing, and health, including:

  • TSMC Europe: Maria Marced, president, High Performance Applications to Drive Innovation and Collaboration
  • Mentor Graphics: Wally Rhines, CEO, Semiconductor Consolidation versus Specialization: What’s the Driving Force for Mergers?
  • AUDI AG: Berthold Hellenthal, Robust Design / Komponentenerprobung Elektronik, Cross-Industry Collaboration Networks Accelerate Innovations
  • Dresden University Hospital: Christopher Piorkowski, professor at the Heart Center, Digital Health in Cardiovascular Medicine: Patients, Sensors, and Clinical Care
  • Bosch: Birte Lübbert, senior VP, Smart Manufacturing by Bosch in Reutlingen Plant 2
  • Imec: Ann Stegen, executive VP, Transformation into a 7nm Logic Node Solution with Fundamental Advantages

Join Europe’s strategic thinkers and business drivers at ISS Europe 2017 in Munich (Germany) from March 5-7, 2017!  Register here. For more information visit: www.semi.org/eu/iss-europe-2017

Fueled by lightning-fast demand for ubiquitous connectivity, the number of connected Internet of Things (IoT) devices globally will jump by 15 percent year-over-year to 20 billion in 2017, according to new analysis from IHS Markit (Nasdaq: INFO).

In a free new report entitled “IoT Trend Watch 2017,” IHS Markit technology analysts have identified four key trends that will drive the IoT this year and beyond. Increasingly, the report says, businesses see the IoT as a tremendous opportunity to create unique value propositions by linking disparate systems of connected devices that range from multiscreen content sharing to smart city networks.

IHS Markit defines IoT as a conceptual framework, powered by the idea of embedding connectivity and intelligence into a wide range of devices. “These internet-connected devices can be used to enhance communication, automate complex industrial processes and provide a wealth of information that can be processed into useful actions – all aimed at making our lives easier,” said Jenalea Howell, research director – IoT connectivity and smart cities for IHS Markit.

According to the report, the industrial sector — led by building automation, industrial automation and lighting — will account for nearly one half of new connected devices between 2015 and 2025.

IHS Markit has named these four trends as leading the IoT evolution in the coming years:

Trend #1 – Innovation and competitiveness are driving new business models and consolidation

  • To date, the focus on IoT monetization has rightly revolved around the way in which suppliers earn revenue selling components, software or services to IoT application developers. Increasingly, however, the focus is shifting to the IoT developers themselves and how they will monetize new streams of data delivered by their IoT deployments.
  • A wide range of monetization models are being tested, reflecting the fragmented nature of the IoT market across numerous vertical industries. Successful models will revolve around “servitization” and closer, ongoing relationships with end customers, the report says.

Trend #2 – Standardization and security are enabling scalability

  • With the high growth in IoT deployments and much hype surrounding the promise of the IoT marketplace, scaling the IoT is highly dependent on two factors: first, the pace at which devices are connected and second, the ability to manage a large number of devices.
  • Currently, diverse standards and technologies make it difficult to evaluate the many technology options available. Stakeholders also must take a holistic, end-to-end view of securing systems comprehensively and move beyond focusing only on device security.
  • By 2020, the global market for industrial cybersecurity hardware, software and devices is expected to surpass $1.8 billion as companies deal with new IoT devices on business networks as well as a new wave of mobile devices connected to corporate networks.

Trend #3 – Business models are keeping pace with IoT technology

  • The methods used to monetize the IoT are almost as diverse as the IoT itself. Many pioneers of the IoT sold products to build it. That is still happening, of course, but now there is a shift to reaping the benefits of the data that’s been created.
  • An overabundance of business models are being tested to determine which models work and for which applications. Advertising, services, retail and big data are just a few of the areas that have spawned many innovative experiments in monetization. In the coming years, the pace of innovation will slow as successful business models are identified.

Trend #4 – Wireless technology innovation is enabling new IoT applications

  • Advances in wireless technologies will continue to extend the IoT at both the low and high ends. At the low end, low-power wide-area network (LPWAN) promises low cost, low power and long range, connecting millions of devices that previously could not be unified in a practical way. At the high end, 802.11ad makes it possible to wirelessly connect very high performance applications such as 4k video.
  • Beyond 2020, 5G has the potential to address new, mission-critical use cases, particularly where mobility is essential. By 2020, IHS Markit expects around two billion device shipments by integrated circuit type will feature integrated cellular technology.

A simple technique for producing oxide nanowires directly from bulk materials could dramatically lower the cost of producing the one-dimensional (1D) nanostructures. That could open the door for a broad range of uses in lightweight structural composites, advanced sensors, electronic devices – and thermally-stable and strong battery membranes able to withstand temperatures of more than 1,000 degrees Celsius.

The technique uses a solvent reaction with a bimetallic alloy – in which one of the metals is reactive – to form bundles of nanowires (nanofibers) upon reactive metal dissolution. The process is conducted at ambient temperature and pressure without the use of catalysts, toxic chemicals or costly processes such as chemical vapor deposition. The produced nanowires can be used to improve the electrical, thermal and mechanical properties of functional materials and composites.

The research, which is scheduled to be reported this week in the journal Science, was supported by the National Science Foundation and California-based Sila Nanotechnologies. The process is believed to be the first to convert bulk powders to nanowires at ambient conditions.

Researchers have developed a new low-cost technique for converting bulk powders directly to oxide nanowires. Shown is a crucible in which an alloy of lithium and aluminum is being formed. Credit: Rob Felt, Georgia Tech

Researchers have developed a new low-cost technique for converting bulk powders directly to oxide nanowires. Shown is a crucible in which an alloy of lithium and aluminum is being formed. Credit: Rob Felt, Georgia Tech

“This technique could open the door for a range of synthesis opportunities to produce low-cost 1D nanomaterials in large quantities,” said Gleb Yushin, a professor in the School of Materials Science and Engineering at the Georgia Institute of Technology. “You can essentially put the bulk materials into a bucket, fill it with a suitable solvent and collect nanowires after a few hours, which is way simpler than how many of these structures are produced today.”

Yushin’s research team, which included former graduate students Danni Lei and James Benson, has produced oxide nanowires from lithium-magnesium and lithium-aluminum alloys using a variety of solvents, including simple alcohols. Production of nanowires from other materials is part of ongoing research that was not reported in the paper.

The dimensions of the nanowire structures can be controlled by varying the solvent and the processing conditions. The structures can be produced in diameters ranging from tens of nanometers up to microns.

“Minimization of the interfacial energy at the boundary of the chemical reaction front allows us to form small nuclei and then retain their diameter as the reaction proceeds, thus forming nanowires,” Yushin explained. “By controlling the volume changes, surface energy, reactivity and solubility of the reaction products, along with the temperature and pressure, we can tune conditions to produce nanowires of the dimensions we want.”

One of the attractive applications may be separator membranes for lithium-ion batteries, whose high power density has made them attractive for powering everything from consumer electronics to aircraft and motor vehicles. However, the polymer separation membranes used in these batteries cannot withstand the high temperatures generated by certain failure scenarios. As result, commercial batteries may induce fires and explosions, if not designed very carefully and it’s extremely hard to avoid defects and errors consistently in tens of millions of devices.

Using low-cost paper-like membranes made of ceramic nanowires could help address those concerns because the structures are strong and thermally stable, while also being flexible – unlike many bulk ceramics. The material is also polar, meaning it would more thoroughly wetted by various battery electrolyte solutions.

“Overall, this is a better technology for batteries, but until now, ceramic nanowires have been too expensive to consider seriously,” Yushin said. “In the future, we can improve mechanical properties further and scale up synthesis, making the low-cost ceramic separator technology very attractive to battery designers.”

Fabrication of the nanowires begins with formation of alloys composed of one reactive and one non-reactive metal, such as lithium and aluminum (or magnesium and lithium). The alloy is then placed in a suitable solvent, which could include a range of alcohols, such as ethanol. The reactive metal (lithium) dissolves from the surface into the solvent, initially producing nuclei (nanoparticles) comprising aluminum.

Though bulk aluminum is not reactive with alcohol due to the formation of the passivation layer, the continuous dissolution of lithium prevents the passivation and allows gradual formation of aluminum alkoxide nanowires, which grow perpendicular to the surface of the particles starting from the nuclei until the particles are completely converted. The alkoxide nanowires can then be heated in open air to form aluminum oxide nanowires and may be formed into paper-like sheets.

The dissolved lithium can be recovered and reused. The dissolution process generates hydrogen gas, which could be captured and used to help fuel the heating step.

Though the process was studied first to make magnesium and aluminum oxide nanowires, Yushin believes it has a broad potential for making other materials. Future work will explore synthesis of new materials and their applications, and develop improved fundamental understanding of the process and predictive models to streamline experimental work.

The researchers have so far produced laboratory amounts of the nanowires, but Yushin believes that the process could be scaled up to produce industrial quantities. Though the ultimate cost will depend on many variables, he expects to see fabrication costs cut by several orders of magnitude over existing techniques.

“With this technique, you could potentially produce nanowires for a cost not much more than that of the raw materials,” he said. Beyond battery membranes, the nanowires could be useful in energy harvesting, catalyst supports, sensors, flexible electronic devices, lightweight structural composites, building materials, electrical and thermal insulation and cutting tools.

The new technique was discovered accidentally while Yushin’s students were attempting to create a new porous membrane material. Instead of the membrane they had hoped to fabricate, the process generated powders composed of elongated particles.

“Though the experiment didn’t produce what we were looking for, I wanted to see if we could learn something from it anyway,” said Yushin. Efforts to understand what had happened ultimately led to the new synthesis technique.

In addition to those already named, the research included Alexandre Magaskinski of Georgia Tech and Gene Berdichevsky of Sila Nanotechnologies.

At the 2017 European 3D Summit in Grenoble (France, Jan 23-25), research and innovation hub for nano-electronics and digital technology imec and supplier of wafer-bonding equipment EV Group (EVG) announce an extension to their successful collaboration, achieving excellent wafer-to-wafer overlay accuracy results in both hybrid bonding and dielectric bonding. Expanding this collaboration, EVG will become a partner in imec’s 3D integration program through a joint development agreement to further improve overlay accuracy in wafer-to-wafer bonding.

Wafer-to-wafer bonding is a promising technique for enabling high-density integration of future ICs through three-dimensional (3D) integration. This is achieved by aligning top and bottom wafers that are then bonded, thus creating a stacked IC. An important advantage is that wafers/ICs with different technologies can be stacked, e.g. memory and processor ICs.

Many of the alignment techniques and bonding methods for 3D integration have evolved from microelectromechanical system (MEMS) fabrication methods. The fundamental difference between MEMS and 3D integration is that the alignment or overlay accuracy has to be improved by 5–10 times. Accurate overlay is needed to align the bonding pads of the stacked wafers and it is essential to achieving a high yield with wafer-to-wafer bonding. Imec and EVG have realized excellent results on overlay accuracy.

Firstly, the hybrid (via-middle) wafer-to-wafer bonding technique was improved by using EVG’s high quality bonding system with integration definition of bonding pads, resulting in a high yield and a 1.8µm pitch, which is significantly better compared to recently published results at recognized conferences such as ECTC and 3DIC reporting 3.6µm pad size,.

Secondly, the dielectric (via-last) wafer-to-wafer bonding technique was tackled. This technique requires extremely good overlay accuracy to align the copper pads from both wafers, which are then contacted by through-silicon vias (TSVs). In this case, 300nm overlay across the wafer was achieved.

“By joining forces, we achieved these excellent results on overlay accuracy,” explains Eric Beyne, fellow at imec. “We are excited that we can expand our collaboration with EVG with a JDP and the installation of EVG’s GEMINI FB XT wafer bonder in our cleanroom. The GEMINI FB XT has the potential to further reduce the wafer-to-wafer overlay errors and therefore allow for the development of sub-micron wafer-to-wafer interconnects technologies.”

“Further improving the overlay accuracy for wafer-to-wafer bonding into the sub-200nm range requires optimization of the interaction between the wafer bonding tool and processes as well as pre-and post-processing and the wafer material,” explains Markus Wimplinger, corporate technology development & IP director at EVG. “We are excited to partner with imec in an effort to advance overlay accuracies for wafer-to-wafer bonding to meet the needs of future 3D IC designs that rely on high density interconnects”

Imec’s 3D integration program explores technology options to define innovative solutions for cost-effective realization of 3D interconnect with TSVs. Imec’s 3D integration processes are completely executed on 300mm. Imec also explores 3D design to propose methodologies for critical design issues, enabling effective use of 3D interconnection on system level.

imec wafer to wafer

ams AG (SIX: AMS), a provider of high performance sensor solutions and analog ICs, today launched the world’s first series of cost-effective multispectral sensor-on-chip solutions, opening the way for a new generation of spectral analyzers for consumer and industrial applications.

Offered in a small 4.5 x 4.4mm land grid array package, the ultra-low power AS7262 visible range sensor and AS7263 NIR sensor each provide six calibrated spectral channels. Because of their attractive price point, the new multispectral sensors open the door to testing and use in a very wide range of consumer and real-world field applications. Key solution spaces include material and product authentication, product quality and integrity as well as material content analysis in the near-infrared (NIR) and visible spectrums.

“In much the same way that intense sensor integration into our smartphones and tablets has created a tidal wave of new mobile applications, the launch of the AS7262 and AS7263, enabling chip-scale spectral analysis, heralds a similar revolution that will open the door wide for spectral sensing innovation for both industrial and consumer applications,” commented Jean Francois Durix,
Marketing Director for Emerging Sensor Systems at ams. “The dramatic reduction in the size and cost of spectral analysis enabled by our new spectral sensing solutions brings the lab to the sample for an incredible variety of applications from food safety and product authentication, to routine
testing that can better protect both our health and our environment.”

The multispectral sensors employ a new fabrication technique which enables nano-optical interference filters to be deposited directly on the CMOS silicon die with extreme precision. This interference filter technology used for the sensors offers extremely precise and reproduceable filter characteristics which are stable over both time and temperature and are much smaller and more cost-effective than the components typically used in today’s spectral analysis instruments.

The AS7262 six-channel visible light sensor with integrated intelligence provides a calibrated digital output over an I2C or UART interface. It measures light intensity at six wavelengths in the visible light spectrum: 450nm, 500nm, 550nm, 570nm, 600nm and 650nm. The AS7263 operates in the NIR spectrum detecting 610nm, 680nm, 730nm, 760nm, 810nm and 860nm infrared signatures. Both devices include an electronic shutter with LED drive circuitry, which means that device de-signers can accurately control the light source and the spectral sensing functions with a single chip.

The small size of the new multispectral sensors combined with their low power consumption enable measurement equipment OEMs to develop new product types that take advantage of these unique attributes. For instance, bulky laboratory-grade analysis equipment can now be replaced by conve-nient handheld form factors. In factories, samples which today have to be removed from the production line and taken to a laboratory for chemical analysis or quality testing will be tested in-line by new small, robust spectral analyzers based on the multispectral sensors.

The AS7262 and AS7263 are in volume production now. Unit pricing is $4.00 in order quantities of 1,000.

HID Global forecasts a shift in the use of identity technology that will lead to increased adoption of mobile devices and the latest smart card technology, a greater emphasis and reliance on the cloud, and a radical new way of thinking of trust in smart environments and Internet of Things (IoT).

Ultimately, HID Global predicts the 2017 trends will transform the way trusted identities are used with smart cards, mobile devices, wearables, embedded chips and other “smart” objects, particularly in industries focused on regulatory compliance, such as government, finance and healthcare markets. This shift will precipitate the move from legacy systems to NFC, Bluetooth Low Energy and advanced smart card technology to meet the evolving needs of enterprises and governments worldwide.

The forecast for 2017 is also based on a breakthrough in adoption of mobile identity technology in 2016. Exemplifying industry-wide trending, HID Global experienced tremendous uptick in customer deployments of its broad mobility solutions and has a strong pipeline of future customer installations in the works to make verification of identities optimized for mobile applications.

“HID Global has forecasted top trends based on our broad view of the market in close collaboration with customers and partners who are assessing and deploying innovative solutions across markets worldwide,” said Stefan Widing, President and CEO of HID Global. “We have been at the forefront of major technology shifts over the years and HID Global believes 2017 will mark an important phase in the industry, as organizations seek to use the broadest range of smart devices ever. This will directly impact how customers view and use trusted identities on both mobile devices and smart cards for more activities in more connected environments in the years ahead.”

HID Global focuses on four significant trends in 2017 that will influence how organizations create, manage and use trusted identities in a broad range of existing and new use cases.

Stronger adoption of mobile devices and advanced smart cards underscores the need for trusted identities

  • Similar to the adoption of consumer trends to IT in past years, 2017 will also see further consumerization of security, with heightened demand from users seeking to open doors, and login to cloud-based resources, as well as have personalized on-demand printing of documents, and to deploy printed credentials remotely or conduct other transactions and daily activities using trusted IDs on their phone, wearable or smart card.
  • Trusted IDs that integrate security, privacy and convenience will provide a new level of assurance to these applications and transactions, while being uniquely positioned to make secure access more personalized to the individual.
  • The industry will look towards complete identity relationship management that considers the need to grant access based on the context or circumstances for risk-appropriate authentication across trusted identities assigned to people, devices, data and things in smart offices, buildings and other environments that are becoming more connected every day.

Greater emphasis on the cloud through “hybrid” solutions that combine on-premises and the cloud to create common management platforms for digital IDs

  • Organizations are recognizing the interdependencies of technologies and platforms needed for business agility, cost management and providing a better user experience within a mobile workforce, or for digital commerce and relationship management that continues to require more reach, flexibility, security.
  • In banking, government, healthcare and other regulated markets, multi-factor authentication for physical and IT access control will have more opportunities to merge into integrated systems that will also provide a more convenient experience for users and increase security.
  • This model will make it easier for administrators to deploy and maintain an integrated system throughout the complete identity lifecycle — from onboarding to offboarding;
  • It will make it possible to monitor and manage employees’ access rights as their role changes within an organization, ensuring employees only have access to what they need in a current role.
  • Credential issuance for physical ID cards will also experience a digital transformation, as the use of cloud technologies will enable managed service models for badge printing and encoding.

Emerging IoT uses cases to connect, more people, places and things, increasing the need to ensure the Internet of Trusted Things (IoTT)

  • Trusted identities will increasingly be employed to help secure, customize and enhance the user experience across a growing range of industry segments that are embracing the power of the IoT.
  • Organizations will look towards streamlining processes and operations using real-time location systems, presence- and proximity-based location functionality, condition monitoring solutions, beacons and cloud-based models for emerging IoT applications using Bluetooth Low Energy. These applications will include a growing number of energy efficient, productivity and safety-oriented use cases that will need to know the identity of occupants in a physical space to manage environmental conditions, book meeting rooms and auto-configure audio visual equipment and alarms.
  • Bluetooth Low Energy-based solutions will also advance existing secure proof of presence capabilities to include the predictive analytics and functionality based on location-based technologies.

Embedding trusted identities more deeply in everyday activities for businesses and consumers

  • Trusted identities will become an embedded feature of more use cases rather than simply an add-on capability. This trend of “security by design” will lead to many more convenient approaches to using digital identities across a growing variety of activities, services and industries.
  • Along with popular secure access use cases, new applications will emerge, such as employee mustering capabilities to address emergencies as well as the need to more accurately determine who is in a building in real-time.
  • New capabilities for managing and using trusted IDs will be driven by the increase of temporary offices, mobile knowledge workers and the evolution of the workplace, where adapting to the preferences of today’s talent pool is driving the need for more open, flexible workspaces. Consumers also will begin seeing trusted identities used in many everyday scenarios, such as guaranteeing authorized use of corporate and heavy machinery fleets, as well as creating new ways to safeguard students and validate drivers.

These trends will drive new user experiences that are tailored to vertical market requirements. Following are three particularly compelling examples:

Banking: A digital identity transformation will drive consistency across multiple service channels to improve the user experience, from faster instant issuance that is revolutionizing the way customers receive new or replacement debit and credit cards, to “out-of-band” mobile push capabilities that increase trust and reduce fraud for consumers, and deliver a much easier path to compliance for financial institutions. Digital IDs will also push the industry to increase trust levels by better associating a user’s true identity (biometrics) with their digital identities.

Government: Trusted identities will change the way citizens interact with government agencies and systems. Passports, national IDs, driver licenses and other credentials will co-exist with new disruptive technologies to change the way IDs are issued by government agencies and used by citizens. Citizen IDs are poised to move to mobile phones this year, where state and national governments will begin offering mobile driver’s licenses and other mobile identity IDs as an option alongside the physical document. Meanwhile, the combination of mobile with innovative physical and logical features will provide more options for government agencies to stay ahead of the counterfeiters by advancing the security, personalization, management and issuance of physical documents.

Healthcare: In the increasingly connected healthcare environment, institutions will seek to implement better systems to improve the patient experience and enhance efficiencies, while safeguarding and managing access to equipment, facilities, patient data and electronic prescriptions of controlled substances (EPCS) across the healthcare continuum. From hospital to home, healthcare organizations will seek to employ a combination of strong authentication, and new IoT applications to address these challenges.

HID Global anticipates the shift in the use of identity technology will drive industry trends in 2017, along with new solutions and capabilities that enhance the user experience for years to come.

Coupling Wave Solutions, S.A. (CWS) and STMicroelectronics (NYSE:STM) today announced that they partnered together to reduce time-to-market for high-performance radio frequency (RF) silicon-on-insulator (SOI) designs. RF Designers and design managers will now be able to enhance their designs of RF SOI switches that propel the next generation cellular and Wi-Fi communication chips. STMicroelectronics’ product development kits with SiPEX are available immediately.

“We are thrilled to partner with STMicroelectronics to provide our customers with a breakthrough design productivity solution,” said Brieuc Turluche, chairman of the board of directors and chief executive officer of CWS. “SiPEX™ accurately models interactions between devices, back-end-of-line, and silicon on insulator (SOI) substrates enabling RF Front End Module designers to fully simulate layout and design changes in less than 15 minutes, an accomplishment not possible until now. Our tool also helps simulation take into account physical effects that were only measurable on silicon in the past. This enhanced capability is fundamental to successfully designing high-performance RF SOI switches for the next generation communication chips.”

For the first time ever, with STMicroelectronics’ product development kits, customers can simulate the impact of layout geometry on RF switch losses and non-linearities (H2/H3 distortions), including active devices, metal interconnects, and substrate contributions. This design capability is empowered by the interaction of Spice models, Mentor XRC tool, and the SiPEX substrate simulation tool. This is significant because customers will now be able to design RF SOI Switches reaching a level of performance never achieved before.

“RF front-end components are complex to design. The right design tool is critical for our RF SOI customers to close the gap between simulation and silicon measurements, and optimize the layout to achieve the best linearity in their chips. Partnering with CWS allows our customers to eliminate design re-spins and accelerate time-to-market,” said Cyril Colin-Madan, head of Design Platform at STMicroelectronics.

Thanks to the SiPEX tool, substrate-aware RF switch simulation flow is now part of the H9 SOI FEM PDK design kit which supports RF SOI designs integrated in H9 SOI FEM technology for Cellular and Wi-Fi applications.

“By combining H9 SOI STM technology with substrate modeling via the CWS tool, we produce the world’s highest performance SOI Switches for IoT and Smart Phone applications,” said Greg Caltabiano, CEO of ACCO Semiconductor.

Researchers have developed a new type of optomechanical device that uses a microscopic silicon disk to confine optical and mechanical waves. The new device is highly customizable and compatible with commercial manufacturing processes, making it a practical solution for improving sensors that detect force and movement.

Researchers created an optomechanical silicon bullseye disk that traps optical waves in the outermost ring via total internal reflection while the radial groves confine the mechanical waves to the same area. Credit: Thiago P. Mayer Alegre, University of Campinas

Researchers created an optomechanical silicon bullseye disk that traps optical waves in the outermost ring via total internal reflection while the radial groves confine the mechanical waves to the same area. Credit: Thiago P. Mayer Alegre, University of Campinas

Optomechanical devices use light to detect movement. They can be used as low-power, efficient building blocks for the accelerometers that detect the orientation and movement of a smart phone or that trigger a car’s airbag to deploy split seconds after an accident. Scientists are working to make these devices smaller and even more sensitive to movement, forces and vibrations.

Identifying the smallest movements requires extremely high levels of interaction, or coupling, between light waves, which are used for detection, and the mechanical waves that are tied to movement. In The Optical Society journal Optics Express, researchers from the University of Campinas, Brazil, report that their new bullseye disk design achieves coupling rates that match those of the best lab-based optomechanical devices reported.

While most state-of-the-art optomechanical devices are made using equipment that isn’t widely available, the new bullseye disk device was fabricated in a standard commercial foundry with the same processes used to manufacture complementary metal-oxide-semiconductor (CMOS) chips, such as the ones used in most digital cameras.

“Because the device was made at a commercial CMOS foundry, any group in the world could reproduce it,” said Thiago P. Mayer Alegre, leader of the research group. “If thousands were made, they would all perform in the same manner because we made them resilient to the foundry’s fabrication processes. It is also much cheaper and faster to make these types of devices at a CMOS foundry rather than using specialized in-house fabrication techniques.”

Bringing light and motion together

Most optomechanical devices use the same mechanism to confine both the light and mechanical waves inside a material, where the waves can interact. However, this approach can limit the performance of optomechanical devices because only certain materials work well for confining both light and mechanical motion.

“Once you decouple the confinement rules for the light and mechanics, you can use any type of material,” said Alegre. “It is also makes it possible to independently tailor the device to work with certain light frequencies or mechanical wave frequencies.”

The researchers created a silicon disk 24 microns wide that confines the light and mechanical waves using separate mechanisms. The light is confined with total internal reflection, which causes the light to bounce off the edge of the disk and travel around the outer portion in a circular ring. The researchers added circular groves to the disc, giving it the appearance of a bullseye, to localize mechanical motion to the outer ring, where it can interact with the light. The disk is supported by a central pedestal that allows the disk to move.

“Radial groves have been used to confine light waves in other devices, but we took this idea and applied it to mechanical waves,” said Alegre. “Our optomechanical device is the first one to use radial groves to couple mechanical and optical waves.”

The versatility of the bullseye disk design means it could be used for more than sensing movement. For example, making the disk out of a lasing material could create a laser with pulses or power levels that are controlled by motion. The device could also be used to make very small and high frequency optical modulator for telecommunication applications.

The researchers are now working to further refine their device’s design to work even better with CMOS foundry fabrication processes. This should lessen the amount of light that is lost by the disk and thus improve overall performance. They also want to make the device even more practical by combining the optomechanical disk with an integrated optical waveguide that would bring light to and from the device, all in one package.

Microsemi Corporation (Nasdaq: MSCC), a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it was named M2M Network Equipment Technology Company of the Year by the inaugural IoT Breakthrough Awards. The mission of the awards program is to honor excellence and recognize the creativity, hard work and success of Internet of Things (IoT) companies, technologies and products.

Microsemi was recognized for developing innovative products and solutions which enable both wired and wireless connectivity among devices in machine-to-machine (M2M) environments and enhance the ability of original equipment manufacturers (OEMs) to develop leading-edge solutions in emerging IoT markets. The company’s Ethernet and Power-over-Ethernet (PoE) products enable faster market adaptation of new IoT applications, and its systems product portfolio provides unique solutions to M2M network challenges while offering cost-efficient and simple upgrade procedures.

“Microsemi is honored to be recognized by the IoT Breakthrough Awards as the first M2M Network Equipment Technology Company of the Year recipient,” said Roger Holliday, senior vice president and general manager at Microsemi. “Our team prides itself on our ability to tackle the most difficult challenges facing those in the IoT market as the industry addresses growing demand for reliable, efficient, scalable and cost-effective infrastructure.”

The IoT Breakthrough Awards program, which drew over 2,000 entries this year, is solely dedicated to providing recognition for the best products, people, services, technologies and companies focused on the IoT. All entries were judged by an independent panel of experts representing a range of mid to senior level experienced professionals, with hands-on experience in IoT product management and development, engineering, sales and marketing and more.

“Microsemi is a leading developer of technology that provides significant power to the infrastructure of industrial IoT,” said James Johnson, managing director at IoT Breakthrough. “The judges were particularly impressed with the company’s indoor and outdoor PoE solutions and its contribution to the highly scalable deployment of wireless LANs, mesh access points, small cells, IP cameras and microwave point-to-point links that support today’s innovative M2M applications.”

How can the Internet of Things change the future of the average citizen? To answer this question, imec joins forces with the City of Antwerp and the Flanders region to turn Antwerp into a Living Lab in which businesses, researchers, local residents and the city itself will experiment with smart technologies that aim to make urban life more pleasant, enjoyable and sustainable.

“Making life in cities more pleasant and sustainable, using everything that our technology has to offer, that is what Smart Cities is all about,” says Philippe Muyters, Flemish Minister for the Economy. “And imec, as a world-class research center, is the right partner to make this happen. With imec’s expertise, we can build a smart city with an open, secure and scalable infrastructure. A smart city where everyone has the opportunity to develop ideas and work together to create the future of Antwerp and the Flanders region.” Through imec, Flanders will invest €4 million annually in the City of Things project, in addition to the required project resources.

City of Things is a collaborative project between the City of Antwerp, Flanders and imec. The nerve center for this initiative is located at StartupVillage, the location from which imec also runs its Antwerp startup and incubation operations. During the period from 2017 to 2019, the City of Antwerp intends to invest €650,000 in the project. According to City Councilor for the Economy Caroline Bastiaens: “The city is targeting four strategic priorities: mobility, security, sustainability and digital interaction with citizens.”

Network of sensors

The City of Things project will roll out a fine-grained network of smart sensors and wireless gateways located around Antwerp’s buildings, streets, squares and other city objects. This network will connect the citizens with a whole range of innovative applications. The ensuing digital innovation is expected to enforce the city’s economic clout. And with the insights gained from the project, Antwerp and its businesses will learn how to collect the data they need to take well-informed decisions and develop innovative smart applications. Shortly, the seaport of Antwerp will also join the initiative, becoming an incubator for similar smart ideas.

“For the cities of tomorrow it’s all about the survival of the smartest,” says Antwerp mayor Bart De Wever. “Monitoring is the key to knowledge – so that’s exactly what we are going to do. Thanks to this unique collaboration, Antwerp is heading for a new golden age. In the coming years, the city will build a strong position in smart city technology, nationally and internationally. It is also the first step in putting Flanders firmly on the world map as a knowledge region: Smart Flanders, we call it.”

Europe’s biggest living lab

Imec has major ambitions. The Antwerp Living Lab is designed to grow into the largest living lab in Europe for Internet of Things applications. “Together with the City of Antwerp and Flanders, we have the ambition to become a leading player in the connected world,” says Luc Van den hove, CEO of imec. “The City of Things project allows us to join the city residents, developers, entrepreneurs, the government, and research centers and universities around one common goal: developing innovative solutions for better cities. Antwerp will become a living technology lab in which everyone can make a contribution to a sustainable, forward-looking society.”

The Antwerp Living Lab already has a number of projects up and running. These include vans operated by Bpost, the Belgian postal service, which have sensors to measure the air quality throughout the city, sensors whose data can be used to improve the city’s air quality. Another project involved the company Restore, measuring energy consumption in real-time and smoothing out usage spikes with the aim to ensure more efficient, cheaper energy production. With network operator Orange, we study how the project’s goals can be achieved using NarrowBand-IoT. This new technology enables communication of small data volumes over extended periods at hard-to-reach places, at the same time ensuring that the batteries of the connected devices can keep going for up to 10 years. The preparatory work on a host of other projects, e.g. concerning mobility, is underway.

A smart city will make life, living and working more enjoyable for local residents, visitors and businesses alike. Privacy and security are, of course, of great importance.

Ideal city

Caroline Bastiaens, City Councilor for the Economy: “Antwerp is an ideal city to establish this Living Lab. The city is big enough to test applications properly, yet sufficiently small to keep the cost and time required for development under control. Antwerp also has an interesting mix of offices, industry and retail, meaning that various applications can be developed to cover all needs.”

In recent years, Antwerp has developed a blooming ecosystem of start-up businesses and growth companies involved in digital innovation. Currently, the city has more than 350 start-ups and ten growth companies that have newly raised more than half a million euro capital, as well as nine incubators and accelerators, the StartupVillage, exciting corporation such as Nokia, and an extensive  international network. “And last but not least,” concludes Mayor Bart De Wever, “our city council is very open to innovation.”