Category Archives: News

Radiant Vision Systems, a provider of light and color test and measurement systems, announced the release of the ProMetric (R) I29, an ultra high-resolution imaging colorimeter developed to meet the needs of high-volume display and consumer electronics manufacturers. The newest addition to the ProMetric I-Series, the I29 complements the I2, I8, and I16 models, providing a higher resolution option for inspection applications that call for high resolution while meeting short cycle time requirements.

The high spatial resolution of the I29 makes it capable of detecting very small flaws that can be missed by human inspectors. Mura, particles, scratches, and other defects in flat panel displays can be identified and quantified using Radiant’s TrueTest (TM) Automated Visual Inspection software to provide objective and repeatable pass/fail criteria. “The I29 enables inspection of very fine detail, even in large and very high-resolution displays,” stated Doug Kreysar, Chief Solutions Officer for Radiant Vision Systems. “It is also advantageous in ‘multi-channel’ configurations, where multiple devices are tested in a single cycle. Additionally,” continued Kreysar, “the I29 has been engineered for optimal measurement speed, which means the shortest possible takt times are achieved. This is critical to large volume manufacturers.”

Radiant’s ProMetric I Series colorimeters are built around scientific-grade, cooled interline CCD sensors, ranging in resolution from 2 to 29MP. Specially constructed to replicate human spatial perception of brightness and color, they bring the benefits of automation – speed, flexibility, and repeatability – and the accuracy of human vision to production inspection applications. Each model is available with a variety of interchangeable lenses, enabling optimized measurements over a wide range of working distances and viewing angles. ProMetric I supports high-speed USB and Ethernet communications, providing reliable operation over long distances. Smart Technology (TM) features, including electronic lens control and onboard touchscreen, simplify setup and improve measurement accuracy. ProMetric I can be paired to Radiant Vision Systems’ TrueTest software to provide a complete, turnkey solution for testing displays, keyboards, housings, and other products.

OMRON Corporation, which is in the field of automation based on its core sensing and control technology, and Adept Technology, Inc., a provider of intelligent robots, autonomous mobile robot solutions and services, today announced that the two companies have entered into an agreement whereby OMRON will acquire Adept.

OMRON plans to acquire 100% of the outstanding shares of Adept common stock through an all-cash tender offer followed by a second-step merger. OMRON will offer Adept investors $13.00 per share of Adept common stock, which represents a 63% premium over the closing price for Adept’s common stock on September 15, 2015. This values Adept at approximately $200 million. OMRON will fund the tender offer through cash on hand.

The tender offer is expected to commence on or about September 23, 2015, and the transaction is expected to close on or about October 23, 2015. The closing of the transaction is subject to customary closing conditions, including at least a majority of shares of Adept common stock being tendered in the offer, expiration of the applicable waiting period under the Hart-Scott-Rodino Antitrust Improvements Act of 1976 and receipt of required foreign antitrust approvals. The transaction has been unanimously approved by the Boards of Directors of both companies.

Commenting on the acquisition, Yutaka Miyanaga, OMRON Industrial Automation Business Company President, said, “We are delighted Adept Technology, a world leader in robotics, has agreed to join OMRON. This acquisition is part of our strategy to enhance our automation technology and position us for long term growth. Robotics will elevate our offering of advanced automation.”

Rob Cain, President and Chief Executive Officer of Adept, added, “We are excited about the opportunity to join OMRON, a global leader in automation. Together, our products will offer new innovative solutions to customers all around the globe.”

Following the transaction, Rob Cain will continue to lead Adept and will report to Nigel Blakeway, Chairman, Chief Executive Officer and President of Omron Management Center of America, Inc., OMRON’s wholly owned United States subsidiary.

As global manufacturing comes under even more pressure to cut costs, shorten supply cycles and operate across global environments, production sites around the world strive to improve productivity. Increased use of labor-saving robots is one of the solutions. By adding the robotics technology of Adept to its current offering, OMRON will be positioned to provide manufacturers in the automotive, digital device, food and beverage, packaging, and other industries with solutions to these challenges, as well as engineering support.

Founded in 1983, Adept is listed on NASDAQ under the ticker symbol ADEP. The company recorded annual sales of $54.2 million and gross margin of 42.0% in the fiscal year ended June 30, 2015. The company is a U.S. based manufacturer of industrial robots. Adept’s product lines include autonomous mobile robots, industrial robots, configurable linear modules, machine controllers for robot mechanisms and other flexible automation equipment, as well as machine vision systems and software. Adept’s strategy is to provide a broad range of highly reliable integrated products along with world-class service to allow manufacturers to maximize productivity, safety, flexibility and product quality. This acquisition is a part of the acceleration of OMRON’s “ILO+S” (Input, Logic, Output and Safety) strategy for its Industrial Automation Business, which provides automation solutions for the manufacturing industries.

September 30 – October 2, 2015, Wild Horse Pass Hotel & Casino, Chandler, AZ, USA

Chandler, AZ – September 8, 2015 – ICPT 2015 provides the largest forum for academic researchers, industrial practitioners and engineers from around the world dedicated to the exchange of information on the state-of-the-art in Chemical Mechanical Polishing (CMP) and other planarization technologies. It represents the collaborative effort of CMP Users Groups from all six major semiconductor technology regions of the world (USA, Japan, South Korea, Europe, Taiwan and China). This year’s conference includes over 100 technical presentations and poster papers, with 10 invited talks and 2 keynote speakers. A total of 36 sponsors and exhibitors will also be participating, which represents the majority of major consumables vendors and tool suppliers in the industry. To date, we have over 300 registered attendees and the list is still growing.

Technical topic areas include:

  • Front end and back end CMP applications
  • Process integration, control & reliability
  • Consumables, equipment and metrology
  • Defects and Post CMP cleaning
  • CMP fundamentals, modeling and simulation
  • 3D ICs/TSV applications
  • CMP for MEMS
  • Environmental issues related to CMP
  • Emerging technologies in CMP
  • Alternative planarization technologies

ICPT 2015 is jointly hosted by CMP User’s Group of the Northern California Chapter of the American Vacuum Society, Clarkson University Center for Advanced Materials Processing (CAMP), and the Institute of Electrical and Electronics Engineers (IEEE). The format for Thursday morning of this year’s conference has been adapted to be all invited talks similar to the traditional CAMP format. The speakers were selected by Professor Babu and the organizing committee from top-tier suppliers and major semiconductor manufacturers in the industry.

Soitec (Euronext), which generates and manufactures semiconductor materials for the electronics and energy industries, and Shanghai Simgui Technology Co., Ltd. (Simgui), a Chinese silicon-based semiconductor materials company, jointly announced today that the first 200-mm silicon-on-insulator (SOI) wafers have been produced at Simgui’s manufacturing facility in Shanghai using Soitec’s proprietary Smart Cut (TM) technology, and will be shipped within the next weeks for customers’ qualification. This major milestone in the companies’ licensing and technology transfer agreement, signed in May 2014, demonstrates that the process has been successfully implemented at Simgui and that the technology transfer is proceeding as planned to produce Soitec’s SOI products in order to increase SOI wafer capacity to serve the growing RF and power markets.

“We are very pleased to have reached this major milestone with Simgui, which now has the capability to manufacture Soitec’s SOI products using our Smart Cut technology. This represents a key step in our commitment to increase capacity in response to the needs of our customers who serve the fast-growing RF and power markets, both in China and worldwide,” said Paul Boudre, CEO and chairman of the board of Soitec.

“China is a hot spot for the IC industry today. The fast growth of China’s mobile devices demands a large number of SOI wafers. Through the collaboration with Soitec, Simgui has successfully demonstrated a strong technical ability and expanded capacity to meet our customers’ needs. In addition to the planned high-volume manufacturing of SOI wafers, we will continue to promote the SOI ecosystem in China and build a globally influential Chinese silicon industry,” said Dr. Xi Wang, chairman of the board of directors of Simgui.

The two companies formed their international partnership last year to address both China’s growing demand and to increase worldwide production capacity for 200-mm SOI wafers used in fabricating semiconductors for RF and power applications. When completed, the partners’ first wafer production line in China will boost the industrial manufacturing capacity of SOI wafers to meet increasing worldwide usage and will also be a key element in establishing an SOI ecosystem in China.

Simgui is a high-technology company in Shanghai focused on supplying SOI wafers and providing foundry services for epitaxial (epi) wafers used in key sectors of the semiconductor industry. Soitec designs and manufactures high-performance semiconductor materials.

With a recent sharp rise in the number of patent applications for flexible display technologies, the market for various types of flexible displays is expected to broaden. According to IHS, 312 patents for flexible displays were filed with the United States Patent and Trademark Office in 2014; user-interface technology was the most active sector for patent applications. Flexible displays accounted for 62 percent of US display patent applications last year.

“Flexible displays are next-generation display panels fabricated on a paper-thin and flexible substrate, so that they can be bent and rolled without damage,” said Ian Lim, Senior Analyst of Intellectual Property for IHS Technology. “These types of displays, which lend themselves to far wider applications than conventional rigid displays, are projected to create an entirely new display market and replace existing non-flexible display solutions.”

Based on the latest information from the IHS Flexible Display Patent Report–which covers patents related to flexible displays issued in the US, in 2014, focusing on materials, manufacturing technology and applied devices–Samsung Electronics filed half of all new flexible display patents in the United States, followed by LG Electronics at 17 percent. Most of these patent applications focus on preventing image degradation, reducing device distortion and providing a range of user interfaces for bendable and foldable displays. Patents on parts and manufacturing technologies that primarily focus on the use of polyimide flexible substrates and metal nanowire in organic light-emitting diode (OLED) displays were also popular.

“Patents for flexible display device technologies outnumber those for flexible display parts and manufacturing technologies in recent patents, indicating that the flexible display market is entering a period of maturing growth,” Lim said. “As manufacturer requirements for flexible displays grow, battles to acquire relevant patents will only become fiercer.”


Global semiconductor capital equipment manufacturer OEM Group announced today that it has launched its new Cintillio-S (TM) automated batch wet chemical processing system. This automated batch system integrates industrial automation with the Cintillio platform, which continues to be the leading system for both Acid and Solvent processing since its introduction in 2009. This next evolution provides automated wafer handling technology and replaces the SEMITOOL Spectrum and Magnum platforms which were acquired last year from Applied Materials.

“The Cintillio-S incorporates all of the excellent features of Cintillio and adds the advantages of industrial automation,” said Graham Pye, CPT Product Manager at OEM Group. “Using Cintillio as the base processing module and incorporating industrial automation on the front-end allows us to move away from the custom-design philosophy used in the Spectrum and Magnum platforms. The use of common electro-mechanical components for both the process and automation modules ensures supply chain continuity for end-users. In addition, the use of Cintillio process module ensures existing Spectrum and Magnum users have a seamless process transfer from these older platforms.”

With global demand for semiconductor devices increasing and the constant pressure to deliver those products at minimal cost, today’s manufacturers increasingly seek to maximize tool utilization. These firms—particularly those utilizing wafers at 200mm and above, or seeking to invest in technology to produce at this level—universally view automation as an essential element for increasing efficiency and process throughput as a means of meeting this objective.

“The main drivers for automation at 200mm and above is to reduce manual operator intervention and dependency”, states Paul Inman, CPT Business Development at OEM Group. “This provides ergonomic relief to operators, fulfills the automation requirements of SMIF and FOUP operations, and has the added advantage of automated wafer control. The Cintillio-S handling solution is well-suited for those manufacturers who require an automated wet processing mini-environment in a compact footprint, including power semiconductor, CMOS IC, Advanced Packaging, MEMS, and LED applications.”

Through higher productivity, automation, and advanced process control, the Cintillio-S platform provides effective Acid, Solvent, and Ozone process solutions for FEOL and BEOL manufacturing, as well as wafer-scale packaging, with low cost-of-ownership. By leveraging the advantages of the Cintillio G2 system—including flexible chemical layout, modern controller design and diagnostics, and efficient exhaust design and facility requirements—the Cintillio-S gives manufacturers the tool it needs to meet its production demands today and in the future.


IBM today announced two new business units that will apply the company’s considerable knowledge in Big Data, advanced analytics and cognitive computing to the Internet of Things (IOT) and Educations markets, respectively. Harriet Green, formerly CEO and executive director of the Thomas Cook Group and of Premier Farnell plc, has joined the company as vice president and general manager for the new units, and will be responsible for developing these and other new growth businesses.

“Harriet brings to IBM a strong, proven track record as a transformative leader,” said John E. Kelly, senior vice president, solutions portfolio and research. “Throughout her career, across multiple geographies and cultures, she has consistently shown a deep understanding of the needs of her customers and clients, and how to help them achieve their goals and aspirations. Her creativity and vision will help organizations transform themselves to take fuller advantage of emerging data and cognitive technologies.”

IBM announced in March 2015 that it will invest $3 billion over the next four years to deliver new industry-specific cognitive computing technologies, cloud data services and developer tools to help clients and partners integrate data from an unprecedented number of sources across the Internet of Things. Ms. Green will lead a team that will soon comprise more than 2000 consultants, researchers and developers dedicated to helping clients unlock value in new insights. IBM has helped thousands of organizations to deploy IOT solutions, working with partners such as The Weather Company, ARM, AT&T and others on projects including smart cities, automobile and electronics manufacturing, and to safeguard food and water supply chains, among other applications.

The new Education unit will formally launch later this year.

“I’m honored to join IBM and to become part of a team that is shaping this exciting and transformative moment for industries,” said Ms. Green. “The Internet of Things will help enterprises and governments at every level unlock entirely new areas of opportunity and growth, and no company is better positioned than IBM to be the partner of choice as these organizations embrace its potential.  Likewise, education is being transformed by technology and IBM is incredibly well positioned to help leaders in the field enable this change.”

Earlier in her career, Ms. Green spent over a decade in executive roles at Arrow Electronics, a global provider of products, services and solutions to industrial and commercial users of electronic components and enterprise computing solutions.

Ms. Green was named Leader of the Year 2013 in the UK National Business Awards, as well as the Sunday Times Business Leader of the Year 2013. She was awarded the Order of the British Empire (OBE) by Queen Elizabeth II for services to electronics in June 2010.

Qualcomm Incorporated today announced that its subsidiary, Qualcomm Life, Inc., has acquired Capsule Technologie, a global provider of medical device integration and clinical data management solutions with more than 1,930 hospital clients in 38 countries. Capsule will become a wholly owned subsidiary of Qualcomm Life.

The acquisition of Capsule extends Qualcomm Life’s connected health offerings into the hospital, ultimately creating a more seamless care continuum from hospital to home and points in between. By combining Qualcomm Life’s wireless expertise and ecosystem of connected medical devices outside of the hospital with Capsule’s leadership for connecting medical devices, EMRs and IT systems across the hospital enterprise, Qualcomm Life is creating an open connected health ecosystem to deliver intelligent care everywhere.

Capsule’s medical device integration and clinical data management platform enables data collection, EMR and health IT system integration and monitoring in the ecosystem of connected devices inside the hospital. Capsule’s smart networking goes beyond device integration by delivering timely clinical data to various in-hospital decision support systems, alarm and notification systems and asset management tools, which help reduce latency and transcription errors to ensure timely, informed care.

“Qualcomm is focused on strengthening its position in specific Internet of Everything verticals, like healthcare,” said Derek Aberle, president, Qualcomm Incorporated. “The acquisition of Capsule expands the breadth of our healthcare platform, enabling us to provide connectivity solutions for the entire care continuum and create one of the world’s largest connected health ecosystems. This will be an important step in advancing the Internet of Medical Things.”

“As health care continues to move into the home and ambulatory settings and outside of traditional care areas such as the hospital, the convergence of medical device data from wherever the patient is located is critically important,” explained Gene Cattarina, CEO, Capsule. “Together, Qualcomm Life and Capsule will power this convergence by making data more accessible and interoperable among care teams to provide true continuity of care at the hospital, in the home and at all points in between.”

At SEMICON Europa, attendees and exhibitors will delve into the technologies that shape the future of the microtech, nanotech, medtech and cleantech industries. Representing the entire supply chain from materials to electronic systems and services, 35 major European start-ups will participate in the Innovation Village and present their new technologies at SEMICON Europa.  The largest and most important semiconductor event in Europe, SEMICON Europa  will be held 7-9 October in the Grenoble location for the first time. The new three-day Innovation Village program will be the stage for emerging innovators, industry leaders, strategic investors, and venture capitalists to discuss the needs of the industry’s innovation engine. Attendees will gain insights on technology, capital, partnership, and collaboration strategies necessary for mutual success.

Innovation Village consists of a start-up exhibition (7-9 October), Silicon Innovation Forum (7 October) and Innovation Conference (8 October). As part of the Silicon Innovation Forum, all selected start-ups will have the opportunity to “pitch” to investors and SEMICON Europa visitors. The pitch session will be followed by a start-up panel discussion  “Fundraising for the Future Champions of European Electronics,” led by Jean-Pascal Bost of SATT-GIFT with panelists: Jacques Husser (Sigfox), Eric Baissus (Kalray), Serguei Okhonin (ActLight) and Mike Thompson (Hotblock Onboard).

The Innovation Conference, sponsored by Fidal Innovation, will bring together notable names in European innovation to discuss current practices and relevant funding issues facing semiconductor and high-tech start-ups today. Keynote speakers will include Nicolas Leterrier (Schneider Electric) on Innovation Practices and Dan Armbrust (Silicon Catalyst) on Lean Innovation. Christine Vaca (Gate1) will act as the conference chair.

“For the inaugural SEMICON Europa in Grenoble, our team was intent on developing a program that would highlight the strength of the local and the European ecosystems in innovation and new technology,” explains Anne-Marie Dutron, director of the SEMI Grenoble office. “At Innovation Village, visitors will discover the creativity of 35 European start-up companies, presenting their products, partnership and investment opportunities.”

Participating start-ups were chosen by a selection committee which included ten of the most recognizable venture firms in the industry: Applied Ventures LLC, Robert Bosch Venture GmbH, TEL Venture,3M Ventures, CEA Investissement, Samsung Ventures, Air Liquid Electronics, ASTER Capital), VTT Ventures, and  Capital-E.

Start-ups include ActLight (Switzerland), BlinkSight (France), BluWireless Technology (UK), Calao-Systems (France) and Silicon Line (Germany). For more information about Innovation Village, participating start-ups or about the Innovation Conference, please visit the SEMICON Europa website:

All events in Innovation Village, including the three-day start-up exhibition, Silicon Innovation Forum and Innovation Conference will be available at no charge for all SEMICON Europa guests and visitors. The event will be co-hosted by SEMI Grenoble and Gate1. The mission of GATE1 is to support the creation of new technology-driven businesses by capitalizing on the proximity of numerous university laboratories and research centers. GATE1 offers programs for technology maturation, business incubation and business acceleration.

Kateeva  announced that it has closed its Series D round with $38 million in financing. The newest participant is Samsung Venture Investment Corporation (SVIC). Existing investors also contributed. They include: Sigma Partners, Spark Capital, Madrone Capital Partners, DBL Investors, New Science Ventures, and VEECO Instruments, Inc.

The company has raised more than $110 million since it was founded in 2008.

Kateeva makes the YIELDjet™ platform — a precision deposition platform that leverages inkjet printing to mass produce flexible and large-size OLED panels. The new funds will be used to support the company’s manufacturing strategy and expand its global sales and support infrastructure. Production systems are currently being built at the company’s facility in Menlo Park, Calif. to fulfill early orders.

The funding news coincides with the 2014 OLEDs World Summit taking place this week in Berkeley, Calif.

“Kateeva is a technology leader and has built a significant business in the OLED space,” said Michael Pachos, Senior Investment Manager at SVIC. “The company has demonstrated both a technical and business vision in driving adoption of OLED displays and lighting, and we look forward to contributing to its progress.”

“We believe that OLEDs on flexible substrates play a major role in the insatiable quest for ultra-durable, high-performance, and unbreakable mobile displays, and Kateeva has proven to hold the keys to a critical industry problem,” said Fahri Diner, Managing Director of Sigma Partners and a member of the Board of Directors of Kateeva. “Moreover, we are very excited about Kateeva’s impressive innovations that are poised to make large-panel OLED televisions finally an affordable reality — perhaps the Holy Grail of the display world. In partnership with SVIC, we’re delighted to offer continued support to Kateeva as they rapidly scale operations to support accelerating demand for OLED manufacturing solutions,” Diner continued.

Kateeva Chief Executive Officer Alain Harrus said: “SVIC’s investment speaks volumes about our technology’s enabling value to world-class OLED producers. It will reinforce our leading position and help serve all our customers better. Also, we appreciate our existing investors for their enduring commitment and trusted guidance. Thanks to their confidence in our technology and execution, mass producing OLEDs will be much smoother for leading display manufacturers.”