Category Archives: Displays

April 11, 2011 – BUSINESS WIRE — Corning Incorporated (NYSE: GLW) said today the company plans to maintain production levels at its Shizuoka and Sakai City LCD glass facilities during Sharp Corporation’s temporary production curtailment of LCD panels.

"Sharp has informed us they are significantly curtailing operations at their Gen 8 and Gen 10 panel making facilities for a period of time. We intend to continue to maintain our own production levels at both of our Japan manufacturing facilities to replenish LCD glass inventories and provide glass to other geographic regions," said James B. Flaws, vice chairman and chief financial officer.

"The decision by Sharp has no impact on our Corning Gorilla Glass operations in Japan. Demand for Gorilla Glass continues to be very strong."

Corning will provide additional details when it announces first-quarter results on April 27.

Corning Incorporated provides specialty glass for LCD televisions, computer monitors and laptops; ceramic substrates and filters for mobile emission control systems; optical fiber, cable, hardware & equipment for telecommunications networks; optical biosensors for drug discovery; and other advanced optics and specialty glass solutions for a number of industries including semiconductor, aerospace, defense, astronomy and metrology. Learn more at www.corning.com

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Longtime semiconductor exec Takeshi Hattori continues his reporting on the aftermath of the massive Japanese earthquake and tsunami, with updates on the nuclear crisis, status of facilities and production struggles. See previous updates from Japan here, here, and here.

Click to EnlargeApril 11, 2011 – Just one month has passed since the March 11 "Great East Japan Earthquake." The death + missing toll from the earthquake and tsunami has reached 28,000 — in several towns in Miyagi Prefecture, all the municipal documents including residency files (and even municipal office buildings themselves) were swept way by the tsunami, so the exact number of missing people there are still unknown. The nuclear crisis is still ongoing with unstable GE/Toshiba/Hitachi-made reactors at the Fukushima Daiichi Nuclear plant in Fukushima Prefecture. Strong aftershocks among many other smaller ones halted again the operations of once-recovered manufacturing plants. Continuous aftershocks (one after another) make continuous fab operations as well as nuclear reactor cooling works more difficult. The supply chain disruption due to the halt of fab operations has been expanding to all over Japan and globally.

As bad as Chernobyl

The Japanese Government announced today (11:00am, Tuesday, April 12) that they have escalated the Fukushima Nuclear Plant Accident to be ranked at Level 7 on the International Nuclear Event Scale (INES), up from previously a level 5. This is the scale’s highest level, and equal to the 1986 Chernobyl nuclear disaster. Some international institutes, however, had already pointed out such a kind of alert. Japanese government (Ministry of Economy, Trade, and Industry) will be criticized for its delay of procedures internationally, as will Tokyo Electric Power Company, which has kept much important information about the nuclear plant crisis in the dark.

Aftershocks one after another

The strongest aftershock so far — M7, or measuring six upper (6+) in Sendai and three (3) in Tokyo on the Japanese intensity scale — struck Miyagi Prefecture and Tohoku District at 11:32pm on last Thursday April 7, causing large area blackouts to 4 million houses and plants in six prefectures in Tohoku Districts. The aftershock and the subsequent power outages halted already-recovered plant operations, as well as recovery work required checking structures and equipment for possible damage in every semiconductor/electronics facility in Tohoku District. This includes:

  • Fujitsu’s semiconductor wafer processing plant in Kitakami, Iwate Prefecture;
  • Seiko Epson’s wafer processing plant in Sakata, Yamagata Prefecture;
  • Elpida Memory’s Assembly plant in Akita Prefecture;
  • Renesas Electronics’ four semiconductor plants in Aomori and Yamagata Prefectures;
  • Alps Electric’s four electronic components plants in Miyagi Prefecture;
  • Rohm’s semiconductor plant in Miyagi prefecture;
  • Sony’s two optical parts plants in Miyagi prefecture;
  • Tokyo Electron’s three semiconductor equipment manufacturing plants in Iwate and Miyagi;
  • TDK’s electronic materials plant in Akita; and
  • Ulvac’s vacuum equipment plant in Aomori, among others.

Tohoku Electric Power Co. reported that external electric power sources at the Onagawa nuclear plant in Miyagi Prefecture and at the Higashidori nuclear plant in Aomori Prefecture were partially lost. The Nuclear and Industrial Safety Agency of the Ministry of Economy, Trade, and Industry (METI) said cooling functions were lost for up to 81 minutes for the spent fuel pools at the Higashidori and Onagawa power stations. (By the way, it is very questionable that the Safety Agency belongs to and is controlled by nuclear-energy promoting METI.) These plants have been out of operation since the March 11 quake and tsunami. Backup external power sources are being used for cooling the reactors and spent fuel pools. Some of the external sources were out of order and one diesel generator had fuel leakage. These facts clearly proved that nuclear plants’ countermeasures against power-station blackouts after earthquakes are very poor.

Another strong earthquake (M7.0, or six lower (6-) in Fukushima, and five lower in Tokyo on the Japanese scale) struck Fukushima prefecture at 5:16pm on Monday, April 11. The epicenter was near Fukushima Daiichi Nuclear Plant. Reactor cooling functions was lost for 50 minutes there, according to the METI’s agency. Large-area blackouts happened in Fukushima Prefecture. The damage to factories in the area is unknown presently. Smaller aftershocks are hitting East Japan every 10-20 minutes from 5:45-8pm (while I am typing this report). According to Japan Meteorological Agency, M7-class afterquakes are expected in the Tohoku District in the near future — though it is unclear whether that means a few days, or weeks, or even months.

Operation "Tomodachi"

Dubbed "Operation Tomodachi" ("friends" in Japanese), the US has deployed more than 16,000 military-related personnel (Army, Navy , and Air Force) since the March 11 earthquake and tsunami in East Japan, including the US Navy Seventh Fleet with aircraft carrier USS Ronald Reagan. Many of those troops have started moving back to normal duty posts in Japan or elsewhere. In their place, 155 Marines from the Marines’ Chemical Biological Incident Response Force (CBIRF), which is based at the Indian Head Naval Surface Warfare Center in Maryland, arrived at the US Air Base in Yokota, Tokyo in midnight on April 4. Trained in personnel decontamination and monitoring of radiation levels, the team would not be involved in the efforts to stabilize the reactors at the nuclear plant, but preparing for the worst case — probably reactor explosions or something like this, according to the sources.

Flame-less Japanese mass-media

Japan’s mainstream media such as major newspapers and commercial TVs have served as something like TEPCO’s spokesmen, because TEPCO and the Federation of Electric Power Companies are one of the biggest source of advertising revenue for all the major mass-media. TEPCO is reportedly to spend about US$120 million annually for advertisements on Japanese television, radio, and major newspapers. Even the repetitive public "apology" and "energy-saving" advertisements offered everyday by the company is bringing more money into the media. TEPCO refused to disclose the amount of the expenses; people expect TEPCO to donate it to refugees in Tohoku Districts.

Governmental estimation of loss

The Japanese Government estimates, based on hearing from major Japanese companies as of the end of March, that the possible halt in production of semiconductor and related materials in Japan from March 11 to the end of April will have some ¥40 trillion ($500B) impact on worldwide end-product manufacturing and services. The halt will continue beyond this month for several months, so the impact will become much more.

The halt of microcontrollers and its embedded SoCs in the Naka Plant of Renesas Electronics Corp., the world’s top supplier of microcontrollers (as a merge of Hitachi, Mitsubishi, and NEC’s logic LSI divisions), will result in a loss of around ¥6.5T ($80B) in the automobile industry worldwide during March 11-April 30, according to the government estimate. The production of ¥400B worth of flat-panel television sets will also be halted.

The halt of production of silicon crystal ingots and wafers in SHE’s Shirakawa Factory in Fukushima Prefecture, the world largest silicon wafer producing base, will result in a total loss of ¥1.5T ($18B) in world-wide semiconductor production during March 11-April 30. The impact of this halt to the consumer electronics, telecommunications, information and broadcasting and other industries could reach about ¥32T ($400B), the government estimates.

According to a quarterly report released by the Bank ob Japan today (April 11), seven of nine Districts in Japan downgraded their assessment of local economic conditions in April from three months ago, citing disruption to production caused by the March 11 earthquake.

Travel tips for Japan

Japan Rail’s Narita Express trains from Narita (New Tokyo) International Airport to Tokyo are available both in the morning and evening, but are not available between 11:15am and 5:15pm when most flights arrive from major cities in the US. Keisei Electric Railway serves reduced numbers of limited express to Ueno, Tokyo. Limousine buses are available as scheduled to major hotels in Tokyo. JR and private railway trains and subways in Tokyo as well as "shinkansen" bullet trains from Tokyo to Osaka/Hakata/Nagano/Niigata are available on time, but not available to Sendai and beyond in Tohoku District. Instead, bus service is available between Narita/Tokyo and Sendai. Once Sendai Airport was buried in mud brought by the tsunami; after cleaning up, relief flight services will be available between Sendai to/from Tokyo (Haneda) and Osaka (Itami) starting April 13 until the reopening of JR Tohoku Shinkansen which is expected at the end of April. Almost all offices, hotels, restaurants, and shops are open as usual in Tokyo, but many of them dim lights and close earlier in the evening to save electricity.

Update: Semiconductor plants

Sharp

Sharp Corp. in Osaka has reportedly (but not yet announced officially) suspended operations in its two major domestic LCD panel plants early April, citing an inability to secure a stable supply of industrial gas in the aftermath of the March 11 earthquake. The drastic drop of LCD panel demand after the March 11 earthquake and excess stocks might be another reason, according to industry observer sources.

The LCD panel plants in Kameyama, Mie Prefecture, and Sakai, Osaka Prefecture, are expected to resume operations after the Golden Week holidays that fall in the end of April to early May.

The shutdown is not likely to affect Sharp’s LCD TV output as it has a month’s worth of panel inventory. Production of smaller LCD panels for smart phones and video game consoles among other applications , will be continued at Sharp’s plants in Tenri. Nara Prefecture and other places.

Renesas

As reported previously, Renesas plans to restart partial operation this July at its Naka plant for automotive controllers. But the government has ordered all manufacturing factories in Kanto District — which includes the Naka Plant — to reduce electricity consumption this summer, as another rolling blackout is scheduled during the peak season of electricity consumption. So, it will be difficult to continue operations after July. The alternative microcontroller production is planed at GlobalFoundries in Singapore, as well as Renesas’ two plants in Saijyo on Shikoku Island, and in Kumamoto-Kawajiri on Kyushu Island.

Shin-Etsu Handotai

SHE has just started shipment from its Shirakawa Plant of silicon wafers already completed before the March 11 earthquake. The company has issued no revised announcement regarding the status of severely damaged plant. Further damage by today’s big aftershock is anticipated, but not known as of now. Big aftershocks have been hitting Fukushima Prefecture where SHE’s plant is located. Adding the problematic nuclear plant and sudden large area blackouts after the quake, continuous production will be difficult after operation recovery and even the recovery work must be slow.

The company cannot predict when the plant will become operational.

Toyota Motor

Toyota Motor Corp. in Toyoda-city in Aichi Prefecture announced that, due to parts supply difficulties, vehicle-production plants in North American will be halted on April 15, 18, 21, 22 and 25, and production at virtually all North American engine and parts plants is also to be halted on the same dates. Production of Toyota’s Camry model at a Fuji Heavy Industries Ltd. factory in Indiana will also be halted. No decisions have yet been made regarding production after April 25.

Toyota also announced that it will be able to start vehicle production inside Japan on April 18 (to be continued until April 27) with 50% of normal production capacity. Afterward, all domestic production facilities will observe so-called annual Golden holidays (series of national holidays + two weekends) through May 9. A decision on post-holiday production will be made later.

Freescale

Freescale announced on April 6 (JST) that its seriously damaged wafer processing facility in Sendai, Miyagi Prefecture, will not reopen. The ongoing safety concerns, damage to infrastructure and other basic services in the region, compounded by numerous major aftershocks, prohibit them from returning the facility to an operational level required for wafer fab production in a reasonable timeframe. Two years ago the company announced it would close the Sendai operations; prior to the earthquake and tsunami, the company planned to complete the closure of the facility in December 2011.

ON Semiconductor/SANYO Semiconductor

The firm announced on April 8 that infrastructure services such as fuel, electricity, gases, water, chemicals and logistics to ON Semiconductor’s and SANYO Semiconductor’s factories in Japan and those of its customers and suppliers in Japan are continuing to stabilize. While the potential for intermittent supply of these services to cause temporary production disruptions is diminishing, as a risk mitigation, the company is identifying options to shift production to other facilities to support supply continuity for customers.


Takeshi Hattori is president of Hattori Consulting International and editorial columnist of Electronic Journal in Japan, with more than 36 years experience in the semiconductor field. He is a Fellow of the Electrochemical Society, founding member of the International Symposium on Semiconductor Manufacturing, member of SEMI’s Japan regional standards committee and SEMI/SEAJ Forum, and The Confab advisory board, among many others.

April 11, 2011 — ACS Motion Control, an international manufacturer of advanced multi-axis motion and machine control systems, developed an EtherCAT slave Universal Drive Module that directly drives one or two axes.

The product suits use in wafer handling robots and positioning stages and optical wafer inspection as well as flat panel display (FPD) inspection machines, custom robotics, and medical CT Scanning machines.

Designated the SPiiPlus UDMnt, the Universal Drive Module operates as an EtherCAT slave device to any SPiiPlus EtherCAT master controller. The SPiiPlus UDMnt supports AC servo, DC brushless, DC brush, closed and open loop 2- and 5-phase step motors.

In addition, many UDMnt devices can be linked together on a network, allowing up to 32 axes of fully coordinated control."The SPiiPlus UDMnt drive is an economical, yet high performance product that can be used as part of a completely distributed control network or as an auxiliary drive to complement an ACS MC4U integrated control system," said Jason Goerges, sales and support manager at ACS Motion Control.

"ACS’ SPiiPlus EtherCAT family of products offer advanced, high-level machine control with a smaller footprint and lower cost when compared to competing control solutions. Our universal drive technology provides a flexible solution for all motor topologies, helping to reduce costs by enabling users to run multiple axes from one drive module."

The SPiiPlus UDMnt is available in a 5A, 10A, or 20A peak current rating at up to 60Vdc bus voltage, and has dedicated encoder and limit inputs as well as general purpose I/O and robust fault protection. The drive performs real-time control of position, velocity and current at a 20kHz update rate for each axis.

An international manufacturer of advanced multi-axis motion controllers, machine controllers and integrated control modules, ACS provides standard and custom products that combine power and precision to deliver flexible, economical, user-friendly motion and machine control solutions. For more information about the SPiiPlus UDMnt and other ACS EtherCAT network control components, visit www.acsmotioncontrol.com.

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April 4, 2011 – BUSINESS WIRE — SiliconBlue Technologies unveiled its mobileFPGA platform device roadmap using TSMC’s 40nm low-power standard CMOS process. MobileFPGA platform families offer reduced power and 30-50% increased performance in comprehensive product families comprised of over 15 new devices, all with footprints smaller than 50 mm2.

"Los Angeles" incorporates advanced interface support for emerging standards such as SLIMbus and USB 2.0-based HSIC and ULPI, targeting sensor management and port expansion requirements that are being driven by the explosion of sensors and other peripherals in handheld applications.

"San Francisco" incorporates 1080p support with HDMI and MIPI interfaces. It has been designed for video, multi-display, and high-bandwidth memory interface applications, targeting the convergence of video and image content being simultaneously viewed on home and handheld devices.

The two distinct families target the two areas where smartphones and other handhelds differentiate, said Kapil Shankar, CEO of SiliconBlue. "These devices will be available for designs this year, in time to support the explosion in new handheld products."

More details regarding SiliconBlue’s 40nm-based mobileFPGA devices will be announced in 2Q2011.

SiliconBlue Technologies Custom Mobile Device solutions target handset applications, including IP, design services and a new class of ultra-low power, single-chip, CMOS SRAM mobileFPGA devices with patented non-volatile configuration memory (NVCM). Visit http://www.siliconbluetech.com.

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Longtime semiconductor exec Takeshi Hattori continues his reporting on the aftermath of the massive Japanese earthquake and tsunami, updating the status of facilities and the struggles to ramp production in the face of rolling blackouts (hint: overnight operations) and major holes in the supply chain. See Part 1 of his Japan quake reporting here.

March 22, 2011 – The supply chain is being disrupted by the 3/11 earthquake in Japan, and the disruption may spread globally by the on-going disasters.Click to Enlarge

Sony, Canon, Xerox, Toyota, Honda, and many other companies’ factories nationwide survived without any damage by the earthquake and tsunami — but have stopped their production due to difficulty of procuring materials and parts from many smaller suppliers in eastern Japan, many of which were damaged by the earthquake and tsunami. Only rescue vehicles can use the highways between Tokyo and the Tohoku District, and the Sendai Airport was severely damaged by tsunami. There has been severe shortage of fuels in the district, so the transportation of materials and parts is another issue.

Continuing scheduled rolling blackouts in Kanto Plane (Tokyo, Kanagawa, Yamanashi, Tochigi, Gunma Chiba, Saitama, Ibaraki, and Shizuoka Prefectures) by Tokyo Electric Power Company (TEPCO) makes continuous fab operations impossible. The central Tokyo area has no blackout because there are many important governmental offices, where there are no big fabs. Tohoku Electric Power Company, Sendai, is also planning similar rolling blackout in Tohoku Districts, but it has not yet applied because there is too much serious damage in the district and electricity demand has not yet come to the peak.

The nuclear crisis continues. Though sea water spray to the nuclear reactors continues by brave Japan defense forces and nationwide fire station officers, the serious situation is on-going and people are very afraid of radiation spreading. The number of dead people by the 3/11 earthquake and tsunami reached 9000 as of March 22 and 10000-20000 people are still missing. Among them are some Americans, including a young American lady teaching English to Japanese kids in a local primary school in Iwate.


Update to facilities impacted:

Canon‘s digital camera manufacturing sites in Oita and in Nagasaki, both on Kyushu Island, cannot be operational this week due to procurement problems. Fuji Xerox’s factories in Niigata and Mie Prefectures can also not be operational due to the same reason.

At Sony Corp. in Tokyo, five fabs including a semiconductor laser plant have damage from the earthquake and tsunami and can not be operational for a while; another five fabs are not operational due to difficulty of materials and parts purchase, though they have no structural damage and ready for operation.

Manufacturing operations at the following Sony manufacturing sites remain suspended due to damage:

  • Sony Chemical & Information Device Corp.’s Tagajyo Plant in Miyagi Prefecture, responsible for magnetic tapes, Blu-ray discs, and other recording media, has very severe damage by both the earthquake and tsunami.
  • Sony Shiroishi Semiconductor Inc., Shiroishi, in Miyagi Prefecture, responsible for manufacturing semiconductor lasers.
  • Sony Energy Devices Corp., two plants n Fukushima Prefecture (Koriyama and Motomiya), both for Lithium ion secondary batteries.
  • Sony DADC Japan Inc., Ibaraki Facility in Ibaraki Prefecture, for CDs and DVDs.

While the following manufacturing sites were not directly damaged by the earthquake and tsunami, the company plans to temporarily suspend certain parts of its manufacturing operations at these sites on and after March 22 through March 31, 2011, depending on the availability of necessary raw materials and components.

  • Sony EMCS Corp.
  • Tokai Technology Center, Kosai Site (Shizuoka Prefecture): Broadcast and professional equipment.
  • Tokai Technology Center, Kohda Site (Aichi Prefecture): Camcorders, digital still cameras, etc.
  • Tokai Technology Center, Minokamo Site (Gifu Prefecture): Lens for digital single-lens reflex cameras, cell phones, etc.
  • Tokai Technology Center, Inazawa Site (Aichi Prefecture): LCD TVs, etc.
  • Sony/Taiyo Corp. (Oita Prefecture): Microphones, headphones, etc.

Sony EMCS’s Kisarazu Technology Center (Chiba Prefecture) for manufacturing a wide variety of consumer electronic products such as Blu-ray disc recorders and home audios is intermittently resuming manufacturing operations on March 22. It had no direct damage caused by the earthquake and tsunami but suspended operations temporarily primarily due to planned power outages; it may have to suspend manufacturing operations temporarily again, depending on the planned power outage situation.

Some fabs of Sony, Fujitsu, and many other companies started overnight operation to avoid TEPCO’s rolling blackouts because they are applied sometime between 6:20-22:00 and never applied in the night time. Some companies try to purchase diesel generators to continue fab operations during the rolling blackout , but the purchase of generators and diesel fuels is difficult due to their shortage.

Toyota Motor Corp. in Toyada, Aichi Prefecture, has decided today that the halt of vehicle production at all the plants and subsidiary vehicle manufacturers nationwide will continue until (and include) March 26 (a scheduled Saturday production day) due to difficulty of procuring automobile parts from many suppliers in eastern Japan, where the 3/11 earthquake epicenter was located.

Meanwhile, TMC resumed production of replacement parts on March 17 and resumed the production of parts for overseas production (including knockdown parts) on March 21.

Toyota’s "Kanban" system, the darling of American business school professors (aka "just-in-time" production), has clearly proven to be very, very weak after every earthquake and disaster. Toyota itself does not have excess stocks, but much smaller suppliers must have many stocks, by their own risk.

Honda Motor Corp. in Tokyo also is extending the suspension of vehicle production at the following plants until March 27: For automobiles, Sayama Plant at Saitama Factory (Sayama, in Saitama Prefecture) and Suzuka Factory (Suzuka, in Mie prefecture ); and for motorcycles, Kumamoto Factory ( in Kumamoto prefecture on Kyushu Island).

Both Toyota and Honda will make decisions of next week operations based on the status of the recovery of transportation systems in Japan as well as the supply of parts.

According to today’s Japanese newspapers, Japan’s supply chain issues will spread to American and French automobile companies, and possibly to Nokia and Apple Computers, among others.

Toshiba Corp.‘s Yokkaichi Plant in Mie Prefecture, which has five fabs for NAND flash memory volume manufacturing, was again attacked by another earthquake: a Magnitude 6.4 on the evening of March 15 (21:32), with epicenter in Shizuoka Prefecture, much nearer than the of the 3/11 earthquake. Several pieces of wafer processing equipment inside the cleanrooms automatically stopped operations, but were recovered by the next morning. The plant managers are now making survey of supply chain issues, but some issues are anticipated for materials procurement to be used in production. The plants are producing more than 40% of NAND flash memories used in the world and huge amount of materials are necessary for production continuously.

Iwate Toshiba Electronics, Kitakami in Iwate Prefecture, Toshiba’s wholly own subsidiary for logic and SoC chips, has structural damage on building ceilings, walls, and air conditioning systems, and wafer processing equipment shifted on the floor. It will take a few weeks to recover and fix the problems.

Toshiba’s headquarters in Tokyo has been devoting all efforts day and night to make safety countermeasures to the still-uncontrollable nuclear crisis. The company is one of the major suppliers (GE, Toshiba, and Hitachi) of nuclear reactors to TEPCO’s Fukushima Daiichi Nuclear Plant. Some 700 nuclear engineers are presently working toward the serious problem solutions at the TEPCO plant site in Fukushima or in Toshiba’s Nuclear Engineering site in Yokohama. The other 150-200 Toshiba engineers are working toward recovery of heat power plants of both Tokyo and Tohoku Electric Power companies damaged by the earthquake and tsunami.

Toshiba Mobile Display, Fukaya, in Saitama Prefecture, a supplier of small and medium-sized LCD panels, has damage (mainly equipment shifts) and has not be operational since March 11. It is not clear when the headquarters plant will become operational. The firm has another plant in Ishikawa Prefecture and plans to increase LCD production there.

Hitachi Display Ltd., Mobara in Chiba Prefecture (formerly known as the Mobara Factory of Hitachi Ltd.), a manufacturer of LCD panels, has structural damage of the ceiling of rooms in the buildings and manufacturing equipment shifts occurred on the floor. It will not be operational till sometime in April.

Renesas Electronics, Tokyo: Its Naka factory, Hitachi Naka in Ibaraki Prefecture (formerly Hitachi’s LSI manufacturing base) and Takasaki factory, Takasaki in Gunma Prefecture are not yet operational. Renesas Yamagata Semiconductor, Tasuruoka in Yamagata Prefecture (formerly NEC’s LSI volume-manufacturing base) is partially operational but full operation will be difficult as far as scheduled rolling blackouts continue.


Takeshi Hattori, president of Hattori Consulting International, has more than 36 years experience in the semiconductor field. He spent over three decades at Sony, including work in silicon materials (clean surface prep, thermal oxidation, contamination/defect control). He was head of Sony’s Ultra Clean Technology Research Lab involved in development of single-wafer spin cleaning and surface preparation technologies, non-aqueous and supercritical-fluid cleaning, and yield enhancement strategies. He is a Fellow of the Electrochemical Society, founding member of the International Symposium on Semiconductor Manufacturing, member of SEMI’s Japan regional standards committee and SEMI/SEAJ Forum, and The Confab advisory board, among many others.

March 17, 2011Applied Materials Inc. (AMAT) introduced the Applied Centura Conforma, with conformal plasma doping (CPD) targeted for 22nm and beyond logic and memory chips. The technology replaces ion beam implantation for conformal doping of complex 3D structures.

Click to EnlargeThe Conforma system combines high-dose, low-energy doping technology with in-situ clean capability in a single vacuum chamber to deliver uniform, high throughput doping on both planar and 3D structures. The system uses a pure, additive-free doping chemistry that preserves the underlying device structures.

The plasma doping technology draws from AMAT technologies for RF engineering and CVD chamber design, said Sundar Ramamurthy, vice president and general manager of the Front End Products business unit at Applied Materials, adding that Conforma systems are running in customers’ pilot and high-volume manufacturing. "We’re also working with customers and research entities on pioneering R&D programs using our proprietary technology."

Doping is traditionally performed by bombarding the wafer with a beam of dopant ions moving at high speed. However, this straight line bombardment process cannot provide uniform doping of advanced three-dimensional structures. More importantly, the fast-moving ions can damage the ultra-thin semiconductor layers in cutting-edge chips. Applied’s Conforma technology provides a gentle, low-energy process that enables uniform, conformal doping over complex 3D chip structures. The Centura Conforma combines integrated plasma pre-clean and RTP anneal on the same vacuum platform.

Some of the advanced devices enabled by the new Conforma system include finFET logic, vertical gate DRAM and vertical NAND flash memory arrays.

Applied Materials, Inc. (Nasdaq:AMAT) provides equipment, services and software to enable the manufacture of advanced semiconductor, flat panel display and solar photovoltaic products. Learn more at www.appliedmaterials.com.

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March 11, 2011 — In the wake of several major earthquakes in Japan today, the largest registering an 8.9 on the Richter scale, IHS iSuppli has released data on Japan’s role in the global semiconductor, DRAM and NAND, LCD, and electronics assembly sectors.

Japanese suppliers accounted for more than one fifth of global semiconductor production in 2010. Companies headquartered in Japan generated $63.3 billion in microchip revenue in 2010, representing 20.8% of the worldwide market. While not all of this actual production is located in Japan, a large percentage is produced in manufacturing facilities in Japan.

The major impact on Japan’s semiconductor production is not likely to be direct damage to production facilities, but disruption to the supply chain. Suppliers are likely to encounter difficulties in getting raw materials supplied and distributed and shipping products out. This is likely to cause some disruption in semiconductor supplies from Japan during the next two weeks, based on the IHS iSuppli preliminary assessment of the situation.

DRAM manufacturing in Japan accounts for 10% of the worldwide supply based on wafer production. The two major DRAM fabs in Japan, operated by U.S. based-Micron and Japan’s Elpida, have not been directly affected, according to preliminary indications from IHS iSuppli contacts.

Japanese companies, mainly Toshiba Corp., account for 35% of global NAND flash production in terms of revenue.

Japanese headquartered companies in 2010 ranked No. 3 in semiconductor production among the world’s major chip manufacturing regions. The Asia-Pacific region outside of Japan was No. 1, the Americas ranked No. 2 and Europe/Middle East/Africa was fourth. Of the 300 semiconductor suppliers tracked worldwide by HIS iSuppli, 39 are based in Japan.

Japan in 2010 accounted for 6.2% of the world’s $86.3 billion in global production of large-sized LCD panels in 2010, i.e., panels 10" and larger in the diagonal dimension. Japan also accounts for 14% of LCD TV panel production. The country is home to many higher-generation fabs, including the world’s only 10th Generation LCD fab operated by Sharp Corp. The IHS iSuppli Japanese display research team has issued a preliminary view that the Sharp fab has not been directly impacted by the quake, given the remote location of the fab. Only one large LCD fab may be in the zone of peripheral impact by the quake.

The more important impact may be on Japan’s production of components for LCD panels. Japan accounts for a very high share of components uses in LCD panels and LCD-based products, including glass, color filters, polarizers, cold cathode fluorescent lamps (CCFLs) and light-emitting diodes (LEDs).

Japan in 2010 accounted for 13.9% of all global electronic equipment factory revenue, according to a preliminary IHS iSuppli estimate. This includes manufacturing of all electronic equipment, including computers, consumer electronics devices and communications gear. Japan produced $216.6 billion worth of electronic equipment in 2010, compared to $1.6 billion worldwide. Japan accounted for 16.5% of global consumer electronics equipment factory revenue in 2010. The country represented 10.2% of worldwide data processing revenue in 2010.

Visit IHS iSuppli at www.isuppli.com for more information.

Click here to see a map of wafer fabs in Japan, and listen to analysis of the quake’s effect on semiconductor supply with Jim Handy, Objective Analysis 

ElectroIQ has also been in communication with several semiconductor industry members in Japan. They share first-hand accounts of the damage in Letter from Japan: Update on infrastructure, fab status after earthquake (this is a letter from Takeshi Hattori, president of Hattori Consulting International) and News from Japan on the Impact of Disasters (this is a blog posted by editor-in-chief Pete Singer, sharing news from Kenji Tsuda).

Also read: 
Japan earthquake’s impact on semiconductor community 
Panasonic, Seiko Epson lead MEMS resurgence in Japan

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March 2, 2011 – PR Newswire — At SPIE Advanced Lithography 2011, Cymer Inc. (Nasdaq: CYMI), light sources supplier to chipmakers to pattern advanced semiconductor chips, introduced a focus drilling technology for its immersion light sources including the XLR 600ix, XLR500i, XLA 400 and XLA 300. Focus drilling provides up to a 2X improvement in the depth of focus on the wafer, thereby enabling a larger process window that can positively impact chipmakers’ yield.

Laser focus drilling technology was developed to aid chipmakers in patterning deep contact and via structures with thick resists where high depth of focus is required. Cymer’s focus drilling product is supported by a technique involving operation of the light source at multiple bandwidths, utilizing metrology that was designed to measure high-bandwidth spectra. Additionally, the unique spectral shape of Cymer’s light sources can improve depth of focus with minimal impact on other key process parameters.

More than five years of development effort at Cymer went into investigating multiple approaches to improving depth of focus through spectral engineering, said Ed Brown, president and chief operating officer of Cymer. "Our close collaboration over the past year with our direct scanner and chipmaker customers was instrumental."

Light sources equipped with focus drilling are being qualified, and are currently under chipmaker evaluation.

Click here to listen to an interview with Cymer’s Nigel Farrar about EUV, DUV, focus drilling, and lithography advances.

SPIE Advanced Lithography’s exhibition wraps up today in San Jose, CA, with conferences finishing on March 3.

Cymer, Inc. (Nasdaq: CYMI) develops light sources used by chipmakers worldwide to pattern advanced semiconductor chips, and is pioneering a new silicon crystallization system for the flat panel display industry. Please visit www.cymer.com.

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February 23, 2011 — Nitto Denko Asia Technical Centre (NAT) will be expanding its Singapore base to include a prototyping centre in Singapore. The center will be pioneered at Singapore’s Agency for Science, Technology and Research (A*STAR) Institute of Materials Research and Engineering (IMRE) under a unique Lab-in-RI* program. NAT can leverage on existing infrastructure, research expertise, and save cost on facilities and equipment while working to establish the new prototyping center.
 
The decision for the new center stems from IMRE’s successful R&D project with NAT on optical waveguide devices, which are cheaper to manufacture and more sensitive than current alternatives. NAT now wants to explore the biosensing applications of these devices and put them into a new range of low-cost, easy-to-use, home-based, consumer biosensors.
 
"The optical waveguide devices that were developed will give us the opportunity to create version 2.0 biosensors for future homes," said Dr Su Xiaodi, a senior scientist who heads the IMRE research team. She will be working with NAT to put the devices into home-based biosensors that allow users to monitor their health with greater frequency and care, in their home, between visits to the doctor. The targeted users are those with health conditions that could change rapidly or require immediate attention.
 
"IMRE has been a credible partner since our initial collaboration in 2008, and we would like to continue to draw on IMRE’s intellectual resources and excellent facilities to further our R&D activities in Singapore," said Dr Visit Thaveeprungsriporn, Director of NAT.
 
"The new sensor demonstrates how materials science research can benefit even the biomedical industry," said Prof Andy Hor, IMRE’s executive director, adding that the prototyping lab in IMRE shows how industrially relevant research institutes can be.
 
Nitto Denko is one of Japan’s leading diversified materials manufacturer and a major producer of optical films used in LCD TVs. It invested S$10 million in setting up the Nitto Denko Asia Technical Centre (NAT) in Singapore to work on organic electronics research in 2008.
 
The IMRE-Nitto Denko team will begin R&D development at the new prototyping center this month, with a prototype expected to be available in early 2012.

IMRE has built strong capabilities in materials analysis, characterization, materials growth, patterning, fabrication, synthesis and integration. State-of-the-art facilities include the SERC Nanofabrication and Characterisation Facility to conduct world-class materials science research. Industry-coupled research is conducted on organic solar cells, nanocomposites, flexible organic light-emitting diodes (OLEDs), solid-state lighting, nanoimprinting, microfluidics and next generation atomic scale interconnect technology. For more information about IMRE, please visit www.imre.a-star.edu.sg

The Agency for Science, Technology and Research (A*STAR) is the lead agency for fostering world-class scientific research and talent for a vibrant knowledge-based and innovation-driven Singapore. A*STAR oversees 14 biomedical sciences, and physical sciences and engineering research institutes, and seven consortia & centres, which are located in Biopolis and Fusionopolis, as well as their immediate vicinity. For more information about A*STAR, please visit www.a-star.edu.sg.

Nitto Denko Asia Technical Centre Pte Ltd manages the Integrated Organic Optoelectronic Sensing Device Project – three concurrent research projects with the Data Storage Institute, Institute of Materials Research & Engineering and Nanyang Technological University, to advance the field of organic electronic device development.

*Lab-in-RI – A laboratory based in one of A*STAR’s research institutes (RIs) in which the RIs provide partners with infrastructure and framework at an early stage of their R&D projects, allowing companies to jumpstart their R&D activities in Singapore.

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February 18, 2011 – Marketwire — C3Nano Inc. closed a US$3.2 million round of Series-A financing from China and Silicon Valley-based GSR Ventures. A spinout company from Professor Zhenan Bao’s chemical engineering lab at Stanford University, C3Nano has developed a sustainable, proprietary hybrid carbon nanotube (CNT) based transparent electrode ink and film for use in devices such as touch screens, organic light emitting diode (OLED) devices, photovoltaic solar panels and flexible displays.

C3Nano’s inks and films are designed to be viable, low-cost alternatives to indium tin oxide (ITO). The funding will support C3Nano’s efforts to further develop and scale its technology, engage in joint development programs with customers, and establish strategic channel partnerships.

"For years the display industry has been searching for an alternative to ITO, but everything that came along either underperformed or was too expensive. C3Nano’s material delivers a cost-effective, robust, printable, solution-coatable material that enables the industry to move forward without the intrinsic disadvantages and scarcity issues of ITO," said Cliff Morris, chief executive officer of C3Nano.

ITO supply is increasingly scarce; it is brittle and, therefore, prone to cracking; and, is highly capital intensive for large display screens and unsuitable for flexible displays on plastic. C3Nano uses a hybrid carbon-based material that is abundantly available and intrinsically lower in cost. In addition, the material is flexible and transparent, rendering it an ideal, low-cost alternative to ITO.

Begun as a project in Professor Bao’s lab by Dr. Melbs LeMieux and Dr. Ajay Virkar on solving fundamental problems with CNT conductivity, C3Nano has developed a novel thin film transparent electrode — one of the basic components for devices ranging from touch sensors in smart phones to solar panels — to rival the performance levels of ITO. C3Nano’s films are cost effective to produce, more durable and flexible and, in some applications, more transparent than conventional ITO-based electrodes. Unlike ITO, which is created using a vacuum sputtering process, C3Nano’s material is solution-coated and printable.

"C3Nano has taken a simple and unique approach to solving one of the display industry’s biggest challenges," stated Kevin Yin, partner at GSR Ventures and a board member at C3Nano. "GSR is excited to support C3Nano in the development of global partnerships, especially in mainland China, Taiwan, and Asia, where many of the leading manufacturers of displays, touch screens, solar, and OLED devices are based."

C3Nano is an early stage venture-backed startup developing a revolutionary new transparent electrode material for applications such as flexible displays, touch screens, solar cells and smart windows. C3Nano was founded in January 2010 based on research and technology developed by Dr. Melbs LeMieux, Director of Materials and Process Engineering, and Dr. Ajay Virkar, Director of Research and Development, with Prof. Zhenan Bao, a member of C3Nano’s Board, at Stanford University. C3Nano won the 2010 MIT Clean Energy Prize, and the 2010 NASA Game Changer Technology Award. For more information, please visit www.c3nano.com.

GSR Ventures is a venture capital fund focusing primarily on investing in high-tech start-up companies with substantial operations in China and serving the worldwide market. For more information, please visit http://www.gsrventures.cn/en.

 

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