Category Archives: MEMS

March 16, 2012 — The Great East Japan Earthquake, March 11, 2011 off Sendai, was "a Darwinian event" for the micro electro mechanical systems (MEMS) market, says IHS. The MEMS supply chain came out of the disaster much richer, more diverse, and better positioned for growth, shows the IHS iSuppli MEMS & Sensors Service.

Also read: Japan 1 year after the earthquake: Supply chain lessons
 
The majority of MEMS operations in Japan escaped damage, but the global business impact of the earthquake was significant, said Richard Dixon, principal analyst for MEMS & sensors at IHS. In light of the threat of supply disruptions, some MEMS buyers diversified their supplier bases, reducing reliance on a small pool of sole sources in Japan, he added. The result? A more secure supply chain, and new opportunities for MEMS suppliers globally.

Japan accounted for about 33% of global MEMS sensor market revenue at the time of the earthquake last year. Despite this, only 5 MEMS-related production facilities were directly affected, located in the northeast of the country (see map): Freescale Semiconductor’s accelerometer facility in Sendai; Canon’s MEMS printhead fab in Fukushima; Texas Instruments’ DLP wafer site in Miho; Seiko Epson’s printhead, gyroscope and microphone fab in Sakata; and Micronics Japan Corp.’s MEMS wafer probe operations.

Map. Locations of major MEMS and digital compass fabs in Japan. SOURCE: IHS iSuppli March 2012.

Knowles Acoustics is one example of the supply chain strengthening that took place after Japan’s quake. Last year, Knowles shipped 41% of all microphones — MEMS and others — for cellphones. The company had a single MEMS supplier for its advanced microphones, despite several years using MEMS technology, foundry partner Sony Kyushu in Japan. No other MEMS supplier could have met Knowles’ volume needs if Sony Kyushu had been damaged in the quake (The fab, located on Japan’s southern island of Kyushu, was not damaged).

With the supply chain threat recognized, Knowles is now looking to diversify its MEMS supply base and add an additional source, according to IHS iSuppli information. With two sources, Knowles is likely to attract more cellphone original equipment manufacturers (OEMs), securing more business alongside a more reliable supply chain.

Another example of supply chain concentration was the concentration (97%) in Japan of digital compass production. The total market for electronic compasses was $400+ million in 2011, with the majority coming from 4 Japanese companies: AKM, Yamaha, Aichi Steel and ALPS. If any of the 4 companies’ fabs had been quake-affected, the digital compass supply would have severely faltered. Three of the four plants are located furthest south on the island of Kyushu, including AKM, the largest supplier with 70% market share in 2011. AKM has a general policy of mitigating risk by employing multiple suppliers.

Certain sensor suppliers for automotive applications had a more difficult time following the quake. An estimated 24% of the global automotive MEMS sensors market comes from Japanese companies. The biggest suppliers in this area are Denso and Panasonic. Denso, which makes accelerometers and pressure sensors for Honda and Toyota, showed a Q2 2011 shortfall of $850 million, although it completely recovered in the subsequent quarter.

OEMs like Toyota, Honda and Nissan did an amazing job of damage containment by finding new sources and mitigating the disruptions caused by the earthquake or associated infrastructure-related events like blackouts. Unfortunately, Japanese automotive OEMs were also hit by the Thailand floods in November 2011, impacting much of the resourcing work up to that point.

IHS iSuppli MEMS & Sensors Service can be accessed at http://www.isuppli.com/MEMS-and-Sensors/Pages/Products.aspx. IHS iSuppli’s market intelligence helps technology companies achieve market leadership.

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March 14, 2012 — MATHESON debuted the Lasso System, a customer-centric supply chain and inventory management system that can monitor the location and operating status of gas products and other highly valued assets in the company’s REAL-Time Gas and Asset Management System.

The Lasso System uses radio frequency identification (RFID) and pressure monitoring technology to monitoring the inventory, movement and operating pressure of compressed gas cylinders. Lasso reports critical parameters of interest to compressed gases users, with gas cost and usage analytics generation to facilitate gas management decisions and costs management.

Also read: 300mm fabs and the role of bulk specialty gas supply and Metrology-aided gas purification development

MATHESON supplies industrial, medical, specialty and electronic gases, gas handling equipment, high performance purification systems, engineering and gas management services, and on-site gas generation. The company is the largest subsidiary of the Taiyo Nippon Sanso Corporation Group, Japanese supplier of industrial gases. Learn more at www.mathesongas.com.

March 14, 2012 — Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity etch tool for 200mm wafer-level packaging (WLP), micro electro mechanical systems (MEMS), light-emitting diodes (LEDs), CMOS image sensors (CIS), and other 3D IC applications.

The tool boasts a dual-station chamber architecture for faster throughput with single- or dual-wafer processing, integrated pre-heat stations, and a gas delivery design tailored for better uniformity and higher etch rates of through silicon vias (TSVs) in semiconductor die. A de-coupled high-density plasma source and bias increase etch rates at lower pressures and enable process control over a wide process window. This configuration can be extended to accommodate up to three dual-station process modules. An RF pulsing bias capability eliminates profile notching.

Also read: AMEC reactive ion etch tool enables sub-28nm nodes

AMEC claims a 30% capital-efficiency premium over other available TSV etchers. The system is flexible to etch a wide range of wafer-level features, said Tom Ni, VP at AMEC, noting a "constantly evolving" product mix at manufacturers.

Several Primo TSV200E tools are deployed for production at Q Technology Limited (Q Tech) and JCAP Corp. (JCAP) in China, supporting advanced packaging of semiconductors. 3D semiconductor packaging is "a key component of our technology roadmap, said JCAP president C.M. Lai. JCAP is meeting its product development milestones using the AMEC process modules for TSVs. JCAP has placed a repeat order, Lai noted.

AMEC expects orders soon from Taiwan and Singapore. AMEC notes that strong demand should come from China-based companies.

Development of a 300mm version is underway.

More data on the tool can be found at http://amec-inc.com/products/TSV.php.

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March 13, 2012 — The International Electronics Manufacturing Initiative (iNEMI) began 2 collaborative efforts related to micro electro mechanical system (MEMS) technology, specifically reliability and test, and will host a workshop, May 10 in Pittsburgh immediately following the MEMS Industry Group’s M2M Forum 2012.
 
Because test and reliability are common issues to be addressed across the MEMS manufacturing supply chain, a collaborative approach to industry-wide solutions was the best approach, said iNEMI CEO Bill Bader.
 
In 2011, the iNEMI Roadmap featured a separate chapter on MEMS for the first time, focused on the technology and business directions for MEMS technology over the next 10 years. This roadmap information, gap analysis, and industry input were combined to identify and prioritize several critical MEMS manufacturing issues:

  • MEMS Test Methods and Capabilities – iNEMI’s team will focus on providing possible refinements for testing in-process and at the process back-end.  
  • MEMS Reliability Methodologies – This initiative will investigate the development of generic reliability testing specifications/methods for integrated MEMS devices that enable specification conformance and effectively propagate key device failure mechanisms.    

The one-day MEMS Workshop will facilitate interaction and discussion on the key challenges that the industry needs to address collaboratively. The main objectives include refining the participants’ focus based on the iNEMI Roadmap and results from iNEMI’s MEMS workshop in the UK in 2011, identifying and evaluating additional collaboration opportunities around MEMS manufacturing and deployment, then forming action groups to define and execute the required collaborative programs. Attendees will also define research and development needs to support these programs.     

The International Electronics Manufacturing Initiative (iNEMI) comprises 100 manufacturers, suppliers, consortia and associations, and government agencies and academia, collaborating to forecast and accelerate improvements in the electronics manufacturing industry. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. For additional information about iNEMI, go to http://www.inemi.org.

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March 12, 2012 – BUSINESS WIRE — Qualtré, silicon MEMS inertial sensor developer, appointed Mark Laich as VP of sales and business development. He will be responsible for customer and partner development as Qualtré launches its latest iteration of inertial sensing technologies.

Laich has 27 years of experience in micro electro mechanical systems (MEMS) and semiconductor sales and marketing, specifically in MEMS sensors, and consumer and telecom ICs. He was previously VP of component sales and marketing at MEMSIC, MEMS-based accelerometer and magnetic sensor supplier for consumer, automotive and industrial markets. He helped grow MEMSIC rapidly during the last 3 years by leading MEMSIC’s business development with top-tier mobile handset customers. He also led the successful launch of MEMSIC’s magnetic sensor product family, driving unit volume sales to millions of units/month in 2 years and capturing significant market share within the high-volume mobile segment.

His experience also includes positions with AMD, LG, and Zilog, as well as several start-up semiconductor companies such as Lexra, Azanda, and Potentia.

Qualtré’s technologies combine performance advantages of high frequency mode-matched BAW sensor designs and cost/size scalability of the HARPSS process to deliver inertial sensors for demanding applications.

The company recently appointed a VP in engineering, Dr. Ijaz Jafri.

Qualtré is a venture-backed company commercializing the next generation of solid-state silicon MEMS motion sensor solutions. More information can be found at www.qualtre.com.

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March 12, 2012 — Multitest expanded its MEMS portfolio to pick-and-place test applications with the introduction of its test and calibration cart for the MT9510. Multitest MEMS solutions are now available for strip test and singulated package test on Multitest InStrip with optional InCarrier, on gravity test handlers MT93xx and MT9928, or on the MT9510XP tri-temp pick-and-place handler.

This new combination is based on the two well-established platforms: MT MEMS and MT9510. This setup leverages Multitest’s long-term MEMS test expertise as well as thorough understanding of the challenges in DUT handling. Thus, the industry-leading positioning accuracy and tri-temp performance of the MT9510 also is now available for MEMS test.

Multitest has developed this even further by leveraging the contact site dimension of the MT9510 x16. The company is now able to offer a quad-site test solution for MEMS on pick-and-place handlers. Based on the same MEMS cart as for the MT9928 this MT9510 x16 / MEMS set-up uses both, Multitest’s pick-and-place and MEMS expertise.

Multitest is a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors. For more information, visit www.multitest.com/MEMS

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March 9, 2012 – BUSINESS WIRE — Image Sensors 2012, March 20-22 in London, will highlight the emergence of CMOS image sensors against those based on thin film transistors (TFTs), applications possibilities for 3D cameras and non-visual spectrum cameras, and more.

Also read: Insights in Image Sensing from blogger Dr. Phil Garrou

"3D cameras could offer amazing possibilities of improvement in many areas like automotive, security and surveillance, cultural heritage preservation, ambient-assisted living, industrial control," says Dr David Stoppa of Fondazione Bruno Kessler.

SoftKinetic, a leading company in gesture recognition, have the view that this technology “will dramatically improve some established user interfaces, like the television for example. We also see user interactions emerging, where previously there were none: digital signage is a good example of such a market,” notes their CTO, Daniël Van Nieuwenhove.

For non-visible spectrum applications, Dr Renato Turchetta of RAL highlights that "in large area applications, like mammography or chest radiography, TFT technology has been the major player for many years now. CMOS technology is starting to emerge and it could become the major player in the next few years."

Dr. Eric R. Fossum, a primary inventor of the CMOS image sensor (CIS), will talk about his own current project, Quanta Image Sensing (QIS), which has potential to bring a new generation of change. On other disruptive technologies, he says, "I think use of non-silicon materials could be disruptive if any of them work out. Meanwhile, the rate of continuous improvement is so large that emerging technologies have to mature rapidly to have enough compelling advantage that they can grab a toehold in the marketplace once they get there. To that end, even a few years of continuous improvement can look disruptive to the user community."

The Image Sensors 2012 conference will take place March 20-22, 2012, Hotel Russell, London. For more information, visit www.image-sensors.com.

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March 9, 2012 — Media tablets, a consumer electronics product sector experiencing "remarkably rapid ascension," will become the fourth-largest application for semiconductors globally by 2014, up from 35th in 2010 and 8th in 2011, and predicted 5th in 2012, according to the IHS iSuppli Application Market Forecast Tool.

In 2014, semiconductor revenues from media tablet consumption will hit $18.2 billion, up from $2.6 billion in 2010, the year that Apple introduced the iPad.

Rank (2014) Application Revenue
1 Mobile Handsets $58,589
2 Mobile PCs $48,239
3 Desktop PCs $19,213
4 Media Tablets $18,447
5 LCD TVs $17,489

“The speed of the media tablet’s rise from near insignificance to top-tier prominence is unprecedented in the history of the global semiconductor industry,” said Dale Ford, head of electronics & semiconductor research for IHS, who attributes much of this growth to Apple’s iPad. The global semiconductor industry will need to realign to accommodate the fast growth and vast size of the media tablet market, Ford said.

  2010 2011 2012 2013 2014 2015
USD Millions $2,585 $6,864 $10,673 $15,253 $18,447 $18,162
Figure. Global media tablet semiconductor forecast (USD Millions). SOURCE: IHS iSuppli

In the past, the PC microprocessor boom lifted Intel Corp. and the cellphone chipset rise brought along Qualcomm Inc, Ford said. "Media tablets will generate semiconductor demand that is much more broadly diversified, spreading the opportunity among a wider set of suppliers than previous platforms did."

The winners? Application processors, baseband and radio frequency (RF) chips, NAND flash and DRAM, wireless ICs, image sensors, micro electro mechanical sensors (MEMS), light-emitting diodes (LEDs) and power management ICs.

Media tablets and handsets are a key driving force in reducing semiconductor industry consolidation, developed in more mature markets like PCs, Ford noted.

Mobile handsets will become the world’s largest semiconductor application in 2012, for the first time exceeding mobile PCs as the leading chip segment.
 
The IHS iSuppli Application Market Forecast Tool from information and analytics provider IHS (NYSE: IHS) is available at http://www.isuppli.com/Semiconductor-Value-Chain/Pages/Consumer-Electronics-Semiconductors-to-See-Largest-Decline-in-Q4-2011.aspx?PRX

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March 9, 2012 — Confovis will begin providing MountainsMap imaging and surface analysis software from Digital Surf with its ConfoCAM LED grid-confocal measuring systems for inspection and research.

MountainsMap imaging and surface analysis software provides real-time 3D imaging, using the latest surface metrology standards and methods and generating quality reports automatically. It allows users to visualize the 3D surface topography of a sample in real time, aiding in surface texture and geometry metrology. It uses ISO 25178 3D parameters and ISO 16610 advanced filtering techniques. Full metrological traceability is assured because every analysis step is recorded in a hierarchical analysis workflow and series of measurement data sets can be analyzed automatically using a workflow as a template. Universal ASCII data export means that numerical results can be exported in Excel-compatible text files for interfacing with third-party systems.

ConfoCAM LED grid-confocal measurement systems have no mechanical moving parts in the illumination, axial (Z) resolution down to 1nm, and fast processing speeds in a compact form factor. The tools are designed to inspect semiconductors, solar cells, flat panel displays (FPDs), lenses, medical devices, precision components after milling and grinding, optoelectronics components, micro electro mechanical system (MEMS), coatings and polymer surfaces, microfluidic chips, and more.

Confovis provides optical surface test and measurement instrumentation, suiting semiconductor and flat-panel display (FPD) inspection tasks.

Digital Surf provides surface analysis software for all types of surface metrology instrument including 2D and 3D profilometers, optical microscopes and scanning probe microscopes. Internet: www.digitalsurf.com.

March 8, 2012 — Inspired by nature’s ability to shape a petal, and building on simple techniques used in photolithography and printing, researchers at the University of Massachusetts Amherst have developed a new tool for manufacturing three-dimensional shapes easily and cheaply, to aid advances in biomedicine, robotics and tunable micro-optics.
 
Ryan Hayward, Christian Santangelo and colleagues describe their new method of halftone gel lithography for photo-patterning polymer gel sheets in the current issue of Science. They say the technique, among other applications, may someday help biomedical researchers to direct cells cultured in a laboratory to grow into the correct shape to form a blood vessel or a particular organ.
 
“We wanted to develop a strategy that would allow us to pattern growth with some of the same flexibility that nature does,” Hayward explains. Many plants create curves, tubes and other shapes by varying growth in adjacent areas. While some leaf or petal cells expand, other nearby cells do not, and this contrast causes buckling into a variety of shapes, including cones or curly edges. A lily petal’s curve, for example, arises from patterned areas of elongation that define a specific three-dimensional shape.
 
Building on this concept, Hayward and colleagues developed a method for exposing ultraviolet-sensitive thin polymer sheets to patterns of light. The amount of light absorbed at each position on the sheet programs the amount that this region will expand when placed in contact with water, thus mimicking nature’s ability to direct certain cells to grow while suppressing the growth of others. The technique involves spreading a 10-micrometer-thick layer (about 5 times thinner than a human hair) of polymer onto a substrate before exposure.
 
Areas of the gel exposed to light become crosslinked, restricting their ability to expand, while nearby unexposed areas will swell like a sponge as they absorb water. As in nature, this patterned growth causes the gel to buckle into the desired shape. Unlike in nature, however, these materials can be repeatedly flattened and re-shaped by drying out and rehydrating the sheet.
 
To date, the UMass Amherst researchers have made a variety of simple shapes including spheres, saddles and cones, as well as more complex shapes such as minimal surfaces. Creating the latter represents a fundamental challenge that demonstrates basic principles of the method, Hayward says.
 
He adds, “Analogies to photography and printing are helpful here.” When photographic film is exposed to patterns of light, a chemical pattern is encoded within the film. Later, the film is developed using several solvents that etch the exposed and unexposed regions differently to provide the image we see on the photographic negative.  A very similar process is used by UMass Amherst researchers to pattern growth in gel sheets.
 
Santangelo and Hayward also borrowed an idea from the printing industry that allows them to make complicated patterns in a very simple way. In photolithography, just as in printing, it is expensive to print a picture using different color shades because each shade requires a different ink. Thus, most high-volume printing relies on “halftoning,” in which only a few ink colors are used to print varied-sized dots. Smaller dots take up less space and allow more white light to reflect from the paper, so they appear as a lighter color shade than larger dots.
 
An important discovery by the UMass Amherst team is that this concept applies equally well to patterning the growth of their gel sheets. Rather than trying to make smooth patterns with many different levels of growth, they were able to simply print dots of highly restricted growth and vary the dot size to program a patterned shape.
 
“We’re discovering new ways to plan or pattern growth in a soft polymer gel that’s spread on a substrate to get any shape you want,” Santangelo says. “By directly transferring the image onto the soft gel with half-tones of light, we direct its growth.”
 
He adds, “We aren’t sure yet how many shapes we can make this way, but for now it’s exciting to explore and we’re focused on understanding the process better. A model system like this helps us to watch how it unfolds. For biomedicine or bioengineering, one of the questions has been how to create tissues that could help to grow you a new blood vessel or a new organ. We now know a little more about how to go from a flat sheet of cells to a complex organism.”

Learn more at www.umass.edu.

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