Category Archives: MEMS

February 13, 2012 – PRNewswire — MagnaChip Semiconductor Corporation (NYSE:MX), analog and mixed-signal semiconductor designer and manufacturer, began ramping its 0.35µm mixed-signal foundry service process for micro electro mechanical systems (MEMS) accelerometers.

MagnaChip’s low noise and cost effective 0.35µm mixed-signal technology is used to ramp up production of MEMS accelerometers for motion sensing in mobile devices. The foundry service targets high accuracy and functionality in the MEMS devices.

The MEMS accelerometer 0.35µm mixed-signal foundry process is part of MagnaChip’s effort to develop highly differentiated mixed-signal technology products to meet application-specific needs.

MagnaChip is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. For more information, please visit www.magnachip.com.

View recent issues of the MEMS Direct newsletter

mPhase courts $2M+ investment


February 10, 2012

February 10, 2012 – Marketwire — mPhase Technologies Inc. (OTCBB:XDSL) is in negotiations with an undisclosed private equity group, which could invest at least $2 million in mPhase. The investment would come with a new board member, with a background in cost reduction and marketing.

mPhase expects the private investment to ease the requirement of "continuous financings in the public markets," and help accelerate the time to market for mPhase products. mPhase offers its SmartNanoBattery and other Smart Surface Technology products based on micro electro mechanical system (MEMS) technology for government applications, and is seeking a consumer market.

Also read: mPhase hints at new auto and marine energy product

mPhase Technologies’ Smart Surface technology combines nanotechnology, MEMS processing and microfluidics for applications in drug delivery, lab-on-a-chip analytics, self-cleaning systems, liquid and chemical sensor systems, and filtration systems. More information about the company can be found at http://www.mPhaseTech.com.

View recent issues of the MEMS Direct newsletter

February 9, 2012 — Colibrys SA, high-reliability micro electro mechanical system (MEMS) motion sensors manufacturer for precision navigation and seismic monitoring applications, will relocate locally, to the Y-Parc at Yverdon-les-Bains, Canton Vaud, Switzerland. The move will be completed by mid-2013.

Colibrys will use a US$10 million investment for new cleanrooms to manufacture 6" silicon MEMS wafers and perform advanced assembly and test capabilities, as well as areas for design, product engineering, and administration tasks.

The move enables Colibrys to expand into medical and industrial sensor markets, said Sean Neylon, CEO, adding that the company will be able to ramp up new product developments, customer support, and employee benefits in the new location.

Colibrys expects substantial rent reductions from the move, and will occuy modern, eco-friendly premises. The new location, owned by Meigerhorn, is in the Y-Parc technology center for high-tech SME businesses.

COLIBRYS makes standard and semi-custom MEMS-based motion sensors for harsh-environment (Aerospace & Defense and Energy) and safety critical (Industrial and Instrumentation) applications. Additional information is available at www.colibrys.com.

View recent issues of the MEMS Direct newsletter

February 8, 2012 — The Semiconductor Industry Association (SIA), representing US semiconductor manufacturing and design, released the 2011 International Technology Roadmap for Semiconductors (ITRS), a roadmap of near-term and long-term challenges and innovations for the semiconductor design and manufacturing industry through 2026.

Also read: ITRS 2010: What happened during this off-year?

The ITRS is sponsored by five regions of the world; Europe, Japan, Korea, Taiwan, and the United States and is overseen by SIA. The 2011 ITRS was first presented at a public forum in Incheon, Korea on December 14, 2011. Through the cooperative efforts of the global chip manufacturers and equipment suppliers, research communities and consortia, the Roadmap teams identify critical challenges, technical needs and potential solutions.

2011 edition. Several key areas of advancement have been highlighted in the 2011 ITRS, specifically: DRAM and Flash memory, and micro-electro-mechanical systems (MEMS).

Dynamic random access memory (DRAM) technology development will be accelerated, allowing for new higher-performance servers and sophisticated graphics for game consoles. Flash technology, used as memory in mobile computing devices such as digital cameras, tablet PCs and cell phones, will experience accelerated development over the next 2 years. The introduction of three-dimensional (3D) flash technology, beginning in 2016, will bring greater memory capabilities to a range of popular consumer electronics.

The 2011 ITRS also explores the newest possibilities for innovative interconnects, switches, devices, and materials to advance nanotechnology. While the continued scaling down to the nanometer level occurs, innovative designs and models for new applications and products have expanded research and development of MEMS, increasingly included in smartphones, tablets, digital cameras, and numerous other consumer electronic products. Researchers are also increasing attention on RF and analog mixed-signal technologies.

Also read: NIST collaborates on MEMS roadmaps: ITRS, iNEMI

One of the primary challenges that the industry has identified is how to decrease the size of semiconductors while increasing performance standards to meet consumer demands. In addition to addressing scale and performance challenges, the ITRS presents models for enhancing the highly complex manufacturing and measurement processes required to achieve smaller, higher performance and more energy efficient semiconductors. The ITRS also focuses on cost-effective manufacturing and resource conservation to meet the rapidly changing needs of semiconductor design innovations.

Also read: Packaging, assembly changes coming in next ITRS

Each ITRS working group coordinates with related teams across disciplines to write reports indicating the state of the current technology, technology challenges, critical needs, potential solutions, and areas of innovation. When incorporated into the ITRS, the reports provide guidelines for the global industry that are intended for technology assessment only, without regard to any commercial considerations. The roadmap can serve as a guide for corporate strategic plans and business unit programs; help to assess lead times for equipment development plans, process and materials; and assess key metrics for industry productivity/profitability such as progress on Moore’s law, productivity trends, industry cycles and economic models.

Access the ITRS at www.itrs.net. 

Subscribe to Solid State Technology

February 8, 2012 – PRNewswire via COMTEX — Egypt-based integrated circuit (IC) and micro electro mechanical system (MEMS) maker Si-Ware Systems (SWS) launched a US subsidiary, Si-Ware Systems Inc. Scott Smyser, a new executive vice president for worldwide marketing and business development, will manage the US business.

SWS aims to deliver advanced devices to key markets, as it expands beyond design services and into standard products. The new US subsidiary falls in line with this business strategy. SWS operates in ASIC solutions, with configurable ASICs for MEMS-based components such as sensors and resonators; timing products, providing all-silicon clock oscillator products; and MEMS solutions, including the flagship SiMOST platform for single-chip optical systems.

Smyser has a experience in the semiconductor industry as an executive and strategy consultant for companies focused on timing devices, MEMS sensors and wireless technologies. He has led and advised various companies in the industry with an emphasis on marketing, technology, and product development. Most recently, Smyser was vice president & general manager for VTI Technologies, Inc. a leading supplier of MEMS sensors to the automotive, medical, and consumer markets. He also co-founded VTI’s timing device business. He spoke in the panel, "Connecting the Real World with the Digital World: Harnessing the Power of MEMS," at the International CES 2012 in Las Vegas this January.

"The continuing growth of ever-smaller ‘smart’ devices requires higher levels of integration and miniaturization," said Scott Smyser, executive vice president and general manager, Si-Ware Systems, Inc. "Si-Ware’s innovative design platforms and its expertise in integrating MEMS and ASICs make them an ideal provider for new cutting-edge solutions."

"Si-Ware has focused its design services efforts in growth areas – MEMS sensors are increasingly used across multiple industries, silicon timing devices are cost-effective alternatives to quartz, and there is a continued drive to miniaturize optical systems," said Hisham Haddara, Ph.D, CEO at Si-Ware Systems. "We have been able to leverage our design expertise to create highly integrated new products that can be easily incorporated into larger systems. Establishing a subsidiary in the U.S. and bringing Scott on to manage global business development is the next logical step in consolidating our growth plan for these strategic products."

Si-Ware Systems is an independent fabless semiconductor company providing a wide spectrum of product design and development solutions, custom ASIC development and supply as well as standard products. For more information, please visit www.si-ware.com.

View recent issues of the MEMS Direct newsletter

UPDATED February 8, 2012 — The Semiconductor Industry Association (SIA), representing US semiconductor manufacturing and design, shows 2011 worldwide semiconductor sales hit $299.5 billion, a 0.4% year-on-year (YOY) increase and new record. This comes despite natural disasters in major semiconductor hubs of Japan and Thailand, and an overall weak global economy, noted Brian Toohey, president, SIA.

Semico Research’s forecast for 2012 shows a 10.11% growth in semiconductors revenues over 2011. Semico believes that the bottom of the cycle is occurring now, in Q1 2012, with pent-up PC demand and other factors carrying 2012 growth starting in Q2.

Figure. Worldwide semiconductor industry revenues. SOURCE: SIA, WSTS.

Worldwide semiconductor sales in December amounted to $23.8 billion, a decrease of 5.5% from November and down 4.5% YOY, with units steadily lower coupled with a slight increase in ASP, says SIA. Excluding memory, however, semi revenues were down just 1% YOY, Barclays Capital noted.

Q4 sales of $71.5 billion represent a 7.7% decline from Q3, and a 5.3% decrease over the same period in 2010. All monthly sales numbers represent a 3-month moving average.

The Semico IPI report indicates that semiconductor sales will jump 6.3% in Q1 2012. "We continue to look for 1Q12 to mark the inflection (average guide from semi makers is -3% at midpoint), and supported by 5-8% average Q/Q CAGR for revenues in 2Q-4Q12 (6-10% ex-Memory), we model semi revenues at Flat to +4% in CY12," commented Barclays Capital. "SIA data, coupled with 1Q outlook from chipmakers, suggest…the inventory correction [is] largely resolved." Semiconductors are expected to outpace end markets in 2Q12.

"The health of the industry is a direct reflection of the pervasiveness of semiconductor innovations and their applications in almost every aspect of modern society," Toohey said. The semiconductor industry saw strong demand for optoelectronics, sensors and actuators, as well as microprocessors in 2011. The memory segment underperformed, Barclays Capital pointed out.

What to expect in 2012? Semico points to new memory technologies, MEMS oscillator emergence, and new growth in system on chips (SoC). In 2012, the semiconductor industry will "invest billions in capital expenditures and in R&D," SIA’s Toohey added. This will pay off early, and in the long term.

Also read: Semiconductor industry revenue targets $323.2B in 2012

Lamps and image sensors drove 2011 growth in the optoelectronic market to $23.1B, a 6.4% increase over 2010. Despite generally positive results and continuing development activities in the optoelectronics industry, the LED segment appeared to slow toward the end of 2011, according to Strategy Analytics GaAs and Compound Semiconductor Technologies Service (GaAs), http://www.strategyanalytics.com/. "Mid- to long-term prospects for the LED market remain positive, but continuing economic turmoil and rapidly dropping prices have manufacturers in the LED supply chain on edge," said Eric Higham, Director of the Strategy Analytics GaAs and Compound Semiconductor Technologies Service.

"The optoelectronics market appears poised for growth. Optical device and network manufacturers are targeting 40 and 100Gbps systems, a number of new LED products have been introduced and the US Department of Energy continues to make large investments in solar energy," Asif Anwar, Director, Strategy Analytics Strategic Technologies Practice added. Optoelectronic applications bring energy efficiency and low cost in a wide range of products including mobile devices and cameras.

Sensors and actuators, currently the smallest semiconductor market segment, showed the highest YOY growth at 15.5% to $8.0B in 2011, as the technologies are adopted for consumer electronics, medical devices and automotive systems. Sensors include the growing micro electro mechanical systems (MEMS) devices, increasingly used in smartphones, tablets, digital cameras, and other consumer electronic products.

MOS Microprocessors, part of the integrated circuit category, which are predominantly used in PCs and other devices that need processing capabilities, experienced 7.5% in revenue to $65.2B YOY, making it the second largest semiconductor market segment for 2011, behind logic. Strong demand in the enterprise computing segment drove microprocessor sales.

In 2012, the industry is expected to experience further recovery due to increased demand across a broad range of end market segments combined with the delayed sales impact from the supply chain disruptions in H2 2011. Additionally, several large semiconductor companies announced plans for new facilities and new R&D projects that will serve to fuel the industry’s long-term growth expectations (see Samsung, Intel reports).

The Semiconductor Industry Association represents US leadership in semiconductor manufacturing and design. Learn more at http://www.sia-online.org/.

Semico released its expanded version of the IPI report, which now contains end market forecasts from Semico’s MAP Model database, along with semiconductor bill of materials, semiconductor total available market in dollars and units, and wafer demand reports. The IPI Report will continue to publish Semico’s semiconductor forecast every quarter while the other two months in each quarter will be bolstered with articles from Semico’s analysts providing additional topical research enhancing the information provided in the IPI report. Semico is a semiconductor marketing & consulting research company, and can be reached at www.semico.com.

Subscribe to Solid State Technology

February 8, 2012 — JP Sercel Associates, Inc. (JPSA), advanced laser micro machining provider, expanded its Ultrafast processing capabilities, using Pico-second lasers with innovative laser beam delivery techniques. The technology is used for high-volume production of light-emitting diodes (LED), semiconductors, solar products, and bio-medical devices.

The Pico-second laser systems operate at wavelengths ranging from UV to IR (355-1064nm) for precision machining, cutting, and hole drilling, with minimized thermal effects. JPSA Pico-second laser systems provide high peak energy intensity, resulting from the short pulse duration. JPSA’s proprietary beam delivery technologies speed the Pico-second laser machining throughputs up to 10X.

JPSA shipped its first IX-6168 Micromachining System configured with a Pico-second laser and Galvanometer to a manufacturer. The tool can cut, drill holes and vias, apply texture, ablate or pattern thin films, and machine 3D features.

JPSA supplies industrial grade UV excimer, DPSS, and Pico-second laser micromachining systems and materials processing services. Learn more at http://www.jpsalaser.com/.

Related articles:

February 6, 2012 — Micro-scale thermal management device maker Nextreme Thermal Solutions announced that its thin-film thermoelectric technology has achieved a 60.1°C temperature difference between its cold and hot sides at an ambient temperature of 24.7°C, bringing it on par with the performance of bulk thermoelectric technology.

The 60°C temperature milestone, known as the ΔTmax, indicates the thermoelectric device’s ability to pump heat efficiently, improving cooling and lowering input power requirements for applications in electronics, photonics, automotive, avionics, and high-speed PCR applications.

The improved performance is the result of new materials development at Nextreme and the use of advanced, state-of-the-art interconnect and contact technology developed at the Center for Solid State Energetics at RTI International.

Nextreme will be introducing new products with this higher level of cooling performance in 2012.

Nextreme Thermal Solutions manufactures thin-film thermoelectric modules and subsystems. For more information, visit www.nextreme.com.

View recent issues of the MEMS Direct newsletter

February 3, 2012 — Tokyo Electron Ltd. restructured its organization, with a new "Organic EL Division" established under GM Takeshi Okubo, as well as other new and consolidating subsidiaries in the semiconductor and liquid crystal production segments. All of the changes announced will take effect on April 1, 2012.

The Next Generation Deposition Development Center will be newly established under TEL’s SPE Process Development Division, led by GM Gishi Chung. The company will do away with its MEMS Development Department (part of the "New Product Development Division").
 
Three departments — New Products Development, FPD Photo Process Equipment, and FPD Dry Process Equipment — will merge to form FPD Process Equipment Department.

The company will establish a new subsidiary in Singapore for sales and services support of semiconductor production equipment and parts in Singapore and South East Asia. The subsidiary will operate as Tokyo Electron Singapore PTE Ltd.

Tokyo Electron Ltd. will merge its Tokyo Electron Korea Ltd. subsidiary into its Tokyo Electron Korea Solution Ltd. to increase operational efficiencies. The merger is expected to be approved this month, with execution in April 2012. Tokyo Electron Korea Solution Ltd. will change its trading name to Tokyo Electron Korea Ltd. The subsidiary manufactures, purchases and sells semiconductor production equipment, liquid crystal production equipment, and related parts, raw materials, and accessories.

The company also made several personnel changes related to these changes; the list can be found on its website at http://www.tel.com/eng/news/2012/0203_002.htm.

Tokyo Electron Limited (TEL) is a global supplier of semiconductor and related production equipment. Learn more at www.tel.com

February 3, 2012 – Marketwire — Silicon Frontline Technology Inc. (SFT), an EDA company in the post-layout verification market, announced that X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT’s R3D (Resistive 3D) software for X-FAB’s 0.18