Category Archives: MEMS

November 28, 2011 – Next week is the semiconductor industry’s flagship technical conference show-and-tell: the 57th annual IEEE International Electron Devices Meeting (IEDM, Dec. 5-7), this year held in the East Coast venue of Washington, DC. This year’s slate has a strong overall emphasis on circuit-device interaction, with ~220 presentations, panels and special sessions and short courses, and coverage in related sectors: optoelectronics, MEMS/NEMS, energy-related devices, and bioelectronics. Toyota, Intel, and CEA will give plenary talks, and energy harvesting devices get a special focus. Evening panel sessions will address 3D integration and future power chip materials (SiC vs. GaN).

Solid State Technology will have IEDM 2011 covered from multiple angles: podcast interviews with key paper presenters, on-site show reporting, blogs from industry observers attending/presenting at the show, and plenty of post-show analysis. (Chipworks’ Dick James has already previewed an Intel paper on edge dislocation stress.) To kick things off, we’ve scanned the entire IEDM 2011 program to present a quick sampling of some of the more intriguing papers, from graphene and 3D devices to future exotic device structures/materials and even solar-cell technologies. Enjoy the slideshow!

What I love about this blog from Analog Devices’ Marketing Program Manager, Howard Wisniowski, is that it starts with the simple idea of making human motion smarter through technology. Last year I broke my ankle while running (avoiding a truck and I fell in a ditch…but I digress). If I had the inertial motion technology described below, perhaps I could have avoided injury and be a smarter, more efficient runner. Think it’s science fiction, a la Bionic Woman? Nope. As this blog will tell you, the technology is here and is being applied in very real-world examples that will revolutionize the way we interact with our environment, thanks to the MEMS inside. Enjoy — Karen Lightman, Managing Director, MEMS Industry Group.

November 28, 2011 — Whether it’s keeping athletes in top form, improving navigation in medical robots, helping industrial operators extend factory equipment life, or preventing automotive rollovers, high-performance micro electro mechanical system (MEMS) inertial sensing technology adds a new dimension that transforms many conventional applications.

Recently, a leading Dutch scientific research center, Roessingh Research & Development (RRD) began using the Xsens MVN system (developed by Xsens Technologies B.V.), to study rowing kinematics and the associated implications for competitive rowing. This system combines Analog Devices’ iMEMS inertial sensing technology with XSENS’ sensor fusion algorithms and biomechanical models to produce accurate 3D movement and kinematic output. In this application, the MVN system is being used to provide coaches with comprehensive, accurate information about the movement, timing and behavior of individual rowers or assembled rowing teams. The iMEMS’ inertial sensors enable the application of advanced motion tracking technology to competitive rowing in ways previously unexplored.

For example, the system is equipped with 17 motion trackers (MTx) containing more than 80 high-performance ADI inertial sensors and 17 Blackfin DSPs (digital signal processors, also supplied by ADI). The inertial sensors integrate proprietary sensor designs with high-performance signal processing technology to precisely measure both linear rate and angular rate motion.  In the RRD pilot studies, rowers wore the Xsens MVN system while rowing for 20 minutes on the water. The data was rendered via the Rowing Coach Assistant (RCA) a software application built by RRD to precisely replicate the real-time 3D movements of the rowers. This method included real-time wireless recording of 3D angular velocity, linear acceleration and earth magnetic field vector of 1 inertial sensor module on each body segment. The accurate and detailed rowing cycle data analysis of RCA provided the RRD research team with clear live visualization of coordination issues.

In rowing, an oarsman depends on his/her technical skills, coordinative abilities, physical shape and motivation. Optimizing the technical skills and coordination of the rower is a key element for maximum power and endurance. Rowing coaches can use this information during training to optimize and correct movements and reduce the risk of injury to the rowers.

Acknowledgments

iMEMS and Blackfin are registered trademarks of Analog Devices.

Contact:

Chris Baten at [email protected]

Colleen Monaghan at [email protected]

Howard Wisniowski at [email protected]

Read other MEMS Industry Group (MIG) blogs:

November 25, 2011 — SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announces the cooperation with Swansea University´s Centre for NanoHealth (CNH). This cooperation is linked to CNH´s recent purchase of a SUSS Mask Aligner, MA/BA8 Gen3 with SCIL option. SCIL (Substrate Conformal Imprint Lithography) is a technology for large area imprint that enables patterning at nano scale, whilst maintaining consistent uniformity over entire wafer areas.

The research of CNH is addressing challenges in healthcare such as developing next generation solutions to enable early intervention and detection of diseases followed by immediate identification of appropriate treatments. The Centre is backed by the European Regional Development Fund through the Welsh Government to address some of the biggest challenges facing the future of healthcare such as enhancing early intervention in diagnosing and treating diseases in non-hospital environments; in the home, community clinic or local doctors’ surgery. This can be achieved through the use of devices such as biosensors to detect disease-relevant biomarker for heart disease, cancer, diabetes or other chronic conditions.

The SUSS Mask Aligner will facilitate the processing of such novel technologies by applying micro/nano fabrication methods to produce biosensors, bioMEMS devices, microfluidics and photonics.

“There are enormous opportunities in the biomedical industry. BioMEMS devices are the platform through which the nanomedicine applies.” states Frank P. Averdung, President and CEO of SÜSS MicroTec AG. “We believe that with the establishment of economical production processes the emerging bioMEMS segment is about to exceed the threshold to become a fast growing market. Our innovative nano imprint solution will enable CNH to develop production processes on large area wafers which is the key to rapid transfer of prototype technologies to cost effective volume production and commercialisation.”

Dr. Matt Elwin, Centre Manager for the Centre for NanoHealth said, “The SUSS MicroTec Aligner will be an essential tool for the development of sensors and devices within the CNH, and there are already numerous projects vying for equipment time. The additional capabilities of SCIL will also open up new possibilities and we are excited about the potential of this new technique. SUSS MicroTec has made a significant contribution to the CNH project, and we are looking forward to developing its applications in the fabrication of new biosensors and medical devices.”

Contact SÜSS MicroTec AG at www.suss.com

November 24, 2011 — Qualcomm MEMS Technologies Inc. (QMT), a wholly owned subsidiary of Qualcomm Incorporated (NASDAQ:QCOM), and Kyobo Book Centre of Korea launched the first e-reader using mirasol display technology. The touch display features vibrant color in bright sunlight and power management enables weeks of reading (under typical usage).

Qualcomm MEMS Technologies Inc.’s mirasol display technology uses interferometric modulation (IMOD); a micro-electro-mechanical systems (MEMS)-based technology capable of creating color from ambient reflected light. Qualcomm’s mirasol displays are bi-stable, energy efficient, offer refresh rates to support interactive content and are highly reflective.

The Kyobo e-Reader features a 5.7" XGA format (1024 x 768 pixels) mirasol display (screen resolution of 223 ppi) and Qualcomm’s 1.0 GHz Snapdragon S2 class processor. Kyobo’s custom application interface sits atop an Android 2.3 base.

Also read: Reader me this: The evolution and future of e-reader technology

The Kyobo e-Reader includes access to Kyobo’s 90,000 ebook library, notably including early rights from Korean publisher Minumsa for the much-anticipated Steve Jobs’ exclusive biography, a full one-month before any other Korean digital outlet. Additionally, the device features: video lecture content exclusive to EBS, a leading Korea-based provider of educational material; content sharing through Korean social networking services; English language text-to-speech capabilities; and searchable content through the popular Diotek dictionary application.

Kyobo Book Centre distributes books and services in Korea. Learn more at http://www.kyobobook.co.kr

Qualcomm Incorporated (NASDAQ: QCOM) creates 3G and next-generation mobile technologies.

Subscribe to our MEMS Direct newsletter

November 23, 2011 — The co-located Energy Harvesting & Storage and Wireless Sensor Networks & RTLS USA 2011 conference were held in Boston, MA recently. Following are highlights from the keynoters.

Clay Maranville from the FORD Motor Company discussed how FORD developed thermoelectric generators for their vehicles. Waste-heat recovery is part of the company’s strategy on sustainable transportation. Energy efficiency in transportation will be increasingly important, with China’s car ownership soaring to 230M by 2030 and rising fuel costs. Decreasing energy consumption is an "economic as well as an environmental" neccessity.

Reducing total fuel consumption, weight and cost compared to an alternator/battery system would be the ideal way to implement thermoelectric energy generation. Replacing the alternator completely is a very challenging approach though so, at this point, supplementing it is a much more viable option. Recovering waste heat without interfering with the rest of the systems on the vehicle was a central development consideration and results on a vehicle demonstrated the recovery of around 275W at cruising speed.

Clay also briefly touched on wireless vehicle sensors, with considerations including the potential elimination of 1500 different types of wires, (over 4km in length, 40kg in weight) with reduced cost, weight and improved long term durability wireless solutions.

Michael Balthasar, the Volvo Group, picked up the vehicle conversation from a commercial-use standpoint. The thermodynamic Rankine cycle approach is currently preferred due to higher efficiencies but thermoelectric generation is also important, where considerations at Volvo include lower cost, higher efficiency, and use of non-toxic materials. Such developments would make thermoelectric generation a preferred option.

Cost considerations are also important in the wireless sensors space: including product, manufacturing, development, and maintenance costs. Signal interference and cross communication have to be avoided and  security of wireless communications is a high priority, making sure it is implemented with minimal energy consumption.

Warren Kronberger from The Marketing Store shared the perspective of a marketing company. Energy harvesting technologies could improve everything from promotional toys to furniture, replacing toys’ batteries for proximity and sound sensors, for example. Some interactive electronic toys (first introduced in 2003) are at times deployed in very large volumes of over 30,000,000 units in the space of a month and so, the overall opportunity in terms of harvesters necessary could be significant. Harvesting ambient energy would enable more interactive retail applications as well, with window signage and packaging, among other applications. In any implementation, safety is extremely relevant. Kronberger noted that the close proximity and increased interaction of the consumer with these types of products makes avoiding lead and other toxic materials, and other issues, crucial.

Dr Kars Michiel Lenssen from Philips Research Laboratories discussed electronic skin development, in collaboration with HP, and its power requirements in autonomous devices. Electronic skin describes the change of the appearance of surfaces electronically and remotely, with large size examples including smart windows and electronic wallpaper (managing lighting, privacy, temperature, etc). Consumers have shown that the application is interesting in theory, but excessive cabling and higher electricity bills are strong deterents. Energy harvesting and wireless solutions are a perfect solution. Electrophoretic displays are one approach, being able to easily control transmission rates from 0 to 70% with 5 levels of grayscale in between with low power consumption (zero power consumed to maintain dark state, nanoWatts to maintain transparent state, milliWatts during changing states). The size of implementation ranges from portable electronics personalization all the way to potentially changing the colour of one’s entire home depending on weather conditions and whether one would desire to keep a building warmer or cooler.

Dr Lenssen also announced for the first time HP’s development of a technology based on electrokinetics. The electrokinetic panels are manufactured on a roll to roll process and can also operate with very little power provided, whether by indoor PV or RF power.

Professor Manos Tentzeris, Georgia Institute of Technology, discussed Georgia Tech’s research, including long range wireless power transfer (5-6 miles) as well as multiple mode energy harvesting and electronic skin applications. The research group’s work on wireless sensor nodes follows a "three in one" approach, developing sensors, communication as well as power, integrating high efficiency nanotechnologies as well as low cost substrates. Paper electronics is one of the low cost substrate approaches, with examples such as RFID inkjet printed on paper. The substrate can be made hydrophobic (can be washed, rained upon) with 20 micron inkjet accuracy.

Inkjet-printed carbon nanotubes can be used as gas sensors due to their high sensitivity to nitrogen, detecting ammonia, nitrogen compounds etc, with applications including efforts to develop ways to stopping leakages before they become catastrophic.

The prolific group has also demonstrated solar smart skin for structural health monitoring, powering strai gauges and has shown how broadband RF harvesting can produce useful amounts of power, whereas narrowband gives very little power.

Richard Smith of One Laptop Per Child (OLPC) discussed the main needs of the highly ambitious project, and its charitable efforts to provide children all over the world with the necessary tools to promote education and opportunities even where availability of resources is scarce. Low power requirements, fault tolerance and robustness as well as mostly inexpensive devices (although current devices need to get to lower price point), with sunlight readable display are some of the main points Richard made during his presentation. OLPC has produced 2.2 million laptops since 2006, mostly deployed in Latin America. The 3rd generation of laptops goes into production in 2012 and there’s a tablet device under design as well.

Off grid power remains a challenge as there is no "one size fits all" solution at different sites, different environments, cultures, social requirements (e.g. Mongolia vs Kenya). Options discussed included hand cranks, waterwheels, and even "cow power."

Since for the developing world, the size of a laptop battery is meaningless – as Richard said during his presentation "How big does your battery have to be if there is no place to plug it in?"- opportunistic charging is the way forward: high charge rate, low power draw and being humanly feasible (relying on power you generate yourself) are the three main requirements for it. According to OLPC the ideal ration of charging time over runtime achieved is 1 to 10: 10 minutes charging for 100 minutes of runtime. That’s the kind of device the charity is working towards.

Infinite Power Solutions’ Joe Keating closed the keynote sessions with an overview of the ways the company is implementing complete solutions to energy harvesting requirements for further deployment of wireless sensor networks. The company’s proprietary solid state battery technology, the Thinergy Micro-energy Cells, along with collaborative work with leading low power electronics companies and energy harvester developers has led to a multitude of demonstrators that were showcased at the conference and tradeshow. During the IPS presentation, Keating discussed the topic of optimization of DC to DC buck conversion, in order to get the maximum possible energy out of storage cells.

The Energy Harvesting & Storage and Wireless Sensor Networks & RTLS series of events next heads to Berlin, Germany for May 15-16, 2012. For full information, visit www.IDTechEx.com/eh.

More on energy harvesting.

Subscribe to our MEMS Direct newsletter

November 22, 2011 — Gentex Corporation has acquired substantially all assets of InterSense, which makes MEMS-based hybrid motion tracking systems.

Terms of the agreement were not disclosed. InterSense general manager Ken Jones will now be a GENTEX vice president, and other InterSense leaders, including founder Eric Foxlin, will join the new subsidiary. The companies have worked together previously.

Headquartered in Billerica, MA, InterSense develops inertial and hybrid motion tracking systems that enable highly precise human motion tracking for use in training and operational environments. GENTEX’s growth strategy includes precision motion tracking and situational awareness products for military and other markets. This acquisition should "significantly accelerate" Gentex’s efforts in simulation, augmented reality and helmet-mounted technology, said L. Peter Frieder, president and CEO of GENTEX Corporation.

GENTEX Corporation serves personal protection and situational awareness markets. For more information, see www.gentexcorp.com.

Subscribe to our MEMS Direct newsletter

November 21, 2011 — University of Wisconsin-Madison engineers and physicists have integrated highly piezoelectric single-crystal material onto silicon to fabricate a low-voltage, micro electro mechanical system (MEMS) for communications, energy harvesting, sensing, actuators and other applications.

Chang-Beom Eom, UW-Madison professor of materials science and engineering and physics, led a team studying lead magnesium niobate-lead titanate (PWN-PT), which possesses piezoelectric properties that deliver much greater mechanical displacement with the same amount of electric field as traditional piezoelectric materials.

Rather than starting with bulk piezoelectric material and grinding it down to use in the nearly nanoscale device, the UW-Madison team layered PMN-PT onto silicon using wafer fabrication techniques. The atomic-level fabrication control prevented chemical reactions among components.

Onto a silicon substrate, Eom’s team adds a very thin layer of strontium titanate, which acts as a template and mimics the structure of silicon. Next, a layer of strontium ruthenate as electrode, and finally the single-crystal piezoelectric material PMN-PT.

The researchers have characterized the material’s piezoelectric response, which correlates with theoretical predictions. The properties are as good as the bulk single-crystal material, Eom said.

The resultant devices are called hyper-active MEMS, because active control is high. The material can also be used for fabricating piezoelectric MEMS.

Applied in signal processing, communications, medical imaging and nanopositioning actuators, hyperactive MEMS devices could reduce power consumption and increase actuator speed and sensor sensitivity. Additionally, through a process called energy harvesting, hyperactive MEMS devices could convert energy from sources such as mechanical vibrations into electricity that powers other small devices-for example, for wireless communication.

The National Science Foundation is funding the research via a four-year, $1.35 million NIRT grant. At UW-Madison, team members include Lynn H. Matthias Professor in Electrical and Computer Engineering Robert Blick and physics professor Mark Rzchowski. Other collaborators include people at the National Institute of Standards and Technology, Pennsylvania State University, the University of Michigan, Argonne National Laboratory, the University of California at Berkeley, and Cornell University.

The multi-institutional team published its results in the November 18 issue of the journal Science. Access it here: http://www.sciencemag.org/content/334/6058/958.short.

Subscribe to our MEMS Direct newsletter

November 21, 2011 — System Plus Consulting releases MEMS CoSim+ V3.0, a comprehensive simulation tool for the non-standard manufacturing process of micro electro mechanical system (MEMS) devices. The tool was developed in collaboration with Yole Développement.

The system helps MEMS designers estimate the cost of manufacturing various MEMS sensor types. It helps users determine cost structures, identify cost drivers, form competitive analyses, estimate supplier margins, and evaluate technology options. It can also define business models (fabless, fab-lite, foundry).

It uses an Excel interface, and final results can be modified and ported, with reports generation in Excel. Processes and operations libraries guide project set-up. Project and reference data is stored in a sharable database. A hierarchically defined bill of materials (BOM) includes any number of MEMS, ASICs and passive components. Front-end processes can use multiple wafers, each with its own front-end process. Each process can use multiple fabs, with individually defined cost and overhead parameters.

System Plus Consulting specializes in the cost analysis of a wide variety of electronics, from semiconductor devices to electronic systems. Learn more at www.systemplus.fr.

Subscribe to our MEMS Direct newsletter

November 18, 2011 – PRNewswire — SMArt systems Co-design (SMAC) launched today, bringing together a multinational, multidisciplinary partnership of leading companies on a three-year project for design and integration of smart systems. Smart systems incorporate sensing, actuation, computation, wireless communication, and energy harvesting in one package.

The SMAC program aims to put European companies in leadership positions in these key markets by reducing design costs and time-to-market for next-generation smart systems. SMAC partners assert that the design methodology is holding back smart system development. Separate design tools are used currently for different parts of the system, separately modeling, simulating, and designing MEMS sensors, analog and RF components, and digital ICs. No design methodology/tools exist that can simultaneously and seamlessly overcome potential intended or parasitic couplings (e.g. thermal or electromagnetic) of closely packed elements, and other challenges.

We need "a structured design methodology that explicitly accounts for final integration," said Salvatore Rinaudo, SMAC project co-ordinator and Industrial and Multisegment Sector CAD R&D Director at STMicroelectronics. A "holistic, integration-aware, design platform" will allow the industry to exploit the potential of smart systems, while reducing design costs, time-to-market, and integration risks.

Advanced packaging technologies such as system-in-package (SiP) and chip stacking (3D IC) with through-silicon vias (TSV) already allow manufacturers to package heterogeneous parts — digital and analog electronics, RF, MEMS, other sensors, power sources, wireless transmission devices — densely with performance and cost gains.

The SMAC mission covers:
1.New modeling and simulation capabilities to support accurate multi-physics, multi-layer, multi-scale and multi-domain co-simulation.
2.Innovative integration-aware design techniques for components and subsystems from different technology domains and with different functions.
3.Combination and augmentation of existing modeling and simulation tools into a seamless design flow (i.e., the SMAC Platform), enabling integration-aware co-design of smart systems.
4.Demonstration of the effectiveness of some of the new design solutions through implementation of test-cases featuring leading-edge technology.
5.Demonstration of the accuracy and ease of integration of new and existing EDA tools within the SMAC Platform by comparison with state-of-the-art reference methodologies.
6.Demonstration of the usability of the SMAC Platform through its application to an industry-strength design case.

Partners include academia and several Electronic Design Automation (EDA) and semiconductor companies:
STMicroelectronics s.r.l. (Italy), the Project Coordinator;
Philips Medical Systems Nederland BV (The Netherlands);
ON Semiconductor Belgium BVBA (Belgium);
Agilent Technologies Belgium NV (Belgium);
Coventor Sarl (France);
MunEDA GmbH (Germany);
EDALab s.r.l. (Italy);
Fondazione Istituto Italiano di Tecnologia (Italy);
Tyndall National Institute, University College Cork (Ireland);
Instytut Technologii Elektronowej (Poland);
Politecnico di Torino (Italy);
Universita degli Studi di Catania (Italy);
University of Nottingham (United Kingdom);
Katholieke Universiteit Leuven (Belgium);
Technische Universiteit Eindhoven (The Netherlands);
Slovak University of Technology Bratislava (Slovakia);
ST-POLITO s.c.a.r.l. (Italy).

SMAC is partially funded by the EU’s FP7 (FP7-ICT-2011-7).

The SMAC project will involve a total effort of over 1,300 person/months and an investment of approximately 13M Euros, of which the industrial partners will contribute around 5M Euros.

November 18, 2011 — Ultrabook shipments will take off over the next 4 years, says analyst firm IHS, and various semiconductor markets will feel the effects. Sensors are hot items for ultrabook functionalities, boosting MEMS sales. The thin form factor of ultrabooks will deter DRAM device integration and DRAM use as memory upgrades, according to IHS iSuppli Semiconductor Value Chain.
 
Less than 1 million ultrabooks will ship this year. Globally, 136.5 million ultrabooks will ship in 2015. This subset of the notebook computer segment is characterized by thin (<0.8" thick) and light form factors and full computer operating systems. Ultrabooks also use features from the media tablet arena, like instant-on, solid state drives, and long battery life. They could be popular enough with consumers to reshuffle chipmaker rankings in the notebook arena.

Ultrabooks need sensors, which could greatly benefit makers of microelectromechanical system (MEMS). This is an area in which ultrabooks resemble media tablets more than notebook PCs, said Jérémie Bouchaud, principal analyst, MEMS and sensors, for IHS. Look for MEMS microphones, accelerometers, gyroscopes and pressure sensors, as well as compasses, ambient light sensors and possibly proximity sensors. With ultrabooks replacing up to 42% of the notebook consumption by 2015, MEMS device integration could see major growth, Bouchaud said. Media tablets in 2011 contain an average of $3.45 worth of sensors, compared to $0.51 for conventional notebooks, illustrating the huge opportunity for these devices in ultrabooks.

Analog semiconductors, particularly power-management devices, will also gain from ultrabook adoption. The power-savings and battery-life requirements for ultrabooks are even more aggressive than those in notebooks, said Marijana Vukicevic, senior principal analyst, power management for IHS. Solid state drives in ultrabooks will also spur demand for sophisticated power management. Thinner power management ICs will command a higher price in ultrabooks. Look for more integration with slimmer packages and smaller footprints.  

Figure. Shipments of upgrade DRAM modules for laptops, with and without ultrabooks. SOURCE: IHS iSuppli November 2011.

The media-tablet-like form factor of ultrabooks spell bad news for dynamic random access memory (DRAM) modules, particularly those used for memory upgrades, IHS reports. DRAM chips are overwhelmingly soldered to the motherboard in today’s ultrabooks, said Clifford Leimbach, memory demand forecasting analyst at IHS, to maintain the sleek device design. Notebook PCs typically use a separate PCB for DRAM modules. "However, this also eliminates the need for a traditional small outline dual in-line memory module DRAM module." As ultrabooks eat into traditional notebook markets, the upgrade DRAM module market will be negatively impacted. The ultrabook in 2015 will reduce the number of upgrade notebook PC modules shipped by 13.5 percent, amounting to some 10.8 million units.

Learn more at www.isuppli.com.

Subscribe to our MEMS Direct newsletter