Category Archives: MEMS

August 18, 2011 — Laser micro-manufacturer Potomac Photonics added advanced quality control (QC) and inspection capabilities to its service offerings for micro-electronics, MEMS, and micro-fluidics, as well as medical, consumer, solar, and bio-photonics projects.

Potomac Photonics selected Media Cybernetics’ Image-Pro Plus Version 7.0 image processing and analysis software, which creates image informatics to automate QC processes.

Measurement standards are key at the micron scale in manufacturing, said Mike Davis, director of operations, Potomac Photonics, noting that the tool will give customers greater insight into process control on their projects. Potomac drills micro holes in polymers, metals, silicon, glass, and ceramics for both prototyping and production applications.

Potomac Photonics uses microfabrication to develop miniature products on a contract basis. Visit the website at www.Potomac-laser.com.

Also read:

Laser micromachining system eliminates lithography in MEMS prototyping

Newport laser microfabrication station optimized for MEMS research

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August 18, 2011 — Benedetto Vigna, group VP and GM of ST Microelectronics (STM, ST) MEMS, Sensors, and High-Performance Analog Division, will keynote the 4th International Microtech/MEMS Conference on August 24. Vigna will present "The Future of MEMS and Challenges to Success."

The International Microtech/MEMS Conference co-locates with MICROTech World 2011, August 24-26, at KINTEX in Korea.

Listen to Vigna speak on MEMS traps to avoid and the MEMS metamorphosis here

Vigna will address the challenges that new MEMS applications — context awareness, positioning and remote monitoring, etc. — pose to MEMS suppliers. He also will share STM’s approach to these new possibilities. ST MEMS sensors are used in consumer devices, as motion-based user interface components for smartphones, game consoles, and more. ST acceleration sensors are used for free-fall protection in laptop hard-disk drives. Automotive OEMs integrate ST’s MEMS into airbags and enhanced navigation systems.

STMicroelectronics will also showcase MEMS technologies for automotive, smart mobile devices, and healthcare applications at MICROTech World Booth D-21, Hall 5, KINTEX (Korea International Exhibition Center).

STMicroelectronics makes semiconductor products for multimedia convergence and power applications. Further information on ST can be found at http://www.st.com.

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August 17, 2011 – Marketwire — FLIR Systems Inc. (NASDAQ:FLIR) priced a public offering of $250 million aggregate principal amount of 3.75% notes due September 1, 2016. With about $248 million net proceeds, FLIR plans to fund general corporate needs, such as working capital, investments in or extensions of credit to FLIR subsidiaries, capital expenditures, stock repurchases, and acquisitions. The offering will close on August 19, 2011.

FLIR Systems Inc. designs, manufactures, and markets sensor systems.

Joint book-running managers for the offering include Merrill Lynch, Pierce, Fenner & Smith Incorporated and Barclays Capital Inc.

The public offering is being made pursuant to an effective shelf registration statement on form S-3 on file with the U.S. Securities and Exchange Commission.

Notes offerings may be made only by means of a prospectus and prospectus supplement. Copies relating to the securities can be obtained from Merrill Lynch, Pierce, Fenner & Smith Incorporated at 100 West 33rd Street, 3rd Floor, New York, NY 10001, attention: Syndicate Operations, telephone: 1-800-294-1322, email: [email protected]; and from Barclays Capital Inc., c/o Broadridge Financial Solutions, 1155 Long Island Ave., Edgewood, NY 11717, telephone: 1-888-603-5847, email: [email protected].

This press release shall not constitute an offer to sell or the solicitation of an offer to buy FLIR’s notes or any other securities, nor shall there be any sale of securities mentioned in this press release in any state in which such offer, solicitation, or sale would be unlawful prior to registration or qualification under the securities laws of any such state.

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August 16, 2011 — At the École Polytechnique Fédérale de Lausanne (EPFL) Integrated Actuactors Laboratory (IAL), researchers have constructed an electromagnetic three-phase motor that could make watches 3x more efficient and add telephony, compass navigation, and other applications to time keeping.

The micro electro mechanical system (MEMS) based device at the core of this watch technology outputs 3x as much energy as a traditional motor. It differs from typical MEMS, based on electrostatics. This MEMS is an electromagnetic drive system that uses a fixed magnet and three phases instead of a single phase.

Also read: Hard disk drive performance enhanced by MEMS devices

Fabrication took place in a cleanroom in 24 operations. This method produces components at a lower cost than traditional methods, according to Yves Perriard, head of LAI. Fixed parts of the motor were engraved in silicon wafers in bulk, simultaneously. This cut down on the form factor of a three-phase motor as well. LAI reinvented configuration and geometry for the motor, Perriard notes.

Researchers had to redesign the command electronics to handle a three-phase motor. The motor needs to "locate the rotor, or the rotating part, at any point in time," to tell time accurately, explains Perriard. Sensors would accomplish the task, but be prohibitively expensive. Instead, signal processing techniques use the motor’s voltage and current to derive location.

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August 16, 2011 — The 2011 iNEMI Roadmap, published by the International Electronics Manufacturing Initiative (iNEMI), includes a new chapter on micro electro mechanical systems (MEMS) and sensors, and an expanded chapter on packaging to include substrates discussions.

This issue also includes more input from international (outside of North America) participants than in prior years.

MEMS devices are expected to see exponential growth, expanding into sensors, fluidics, RF components, expanded gyroscope capabilities for motion-gesture sensors, and more applications. This variety is impeding standardization in the MEMS sector. Different functionality needs push MEMS devices into customization more than standardization. Scalable manufacturing processes, packaging technologies, cost-effective and non-destructive test technologies are needed, as well as a better basic understanding of MEMS failure mechanisms. Resonator performance must also be improved.

3D packaging affects a broad range of electronics manufacturing operations, and is discussed in many areas of the Roadmap. Increased momentum in the move toward 3D packaging — through-silicon vias (TSV), thinner die, high-density interconnect (HDI), die shrinkage, embedded actives and passives — creates issues up and down the supply chain, affecting assembly processes and equipment, design and simulation tools, reliability methodologies, thermal management strategies and cooling technologies, and test and inspection strategies.

The Roadmap also acknowledges ongoing challenges for R&D funding, resulting partially from an electronics industry move from vertically integrated OEMs to a multi-firm, globally distributed supply chain. IC assembly, passive components, and electronics manufacturing services have "critical need" for research and development. Industry collaboration is gaining traction in university R&D centers, industry consortia, ad-hoc cross-company development teams, and other areas. Government, academia and industry consortia will need to formulate ways to adopt and develop emerging technologies within the global outsourcing environment.

The more than 575 individuals who contributed to the 2011 Roadmap represent over 310 corporations, consortia/associations, government agencies and universities, located in 18 countries.  The 2011 Roadmap is free for iNEMI members and is for sale to non-members, with special discounted pricing available for universities, research institutions, government agencies and non-profit organizations. For the first time, individual chapters are available for sale and can be purchased on, and downloaded from, the iNEMI website. The 1800-page document features 27 chapters that provide in-depth discussion of six product sectors and 21 different manufacturing, component/subsystem, business process and design technologies. For information about purchasing options and pricing, go to http://www.inemi.org/node/1863/buy  

The International Electronics Manufacturing Initiative

August 16, 2011 — Stanford University will install 3 Plasma-Therm dry etch systems (based on its VERSALINE technology suite) in its research facility for nanotechnology and photonics, joining 2 Plasma-Therm deposition systems the university requisitioned during a facility upgrade in February 2010.

The 3 new inductively coupled plasma (ICP) etchers will etch advanced silicon, metal, dielectric, and other materialsin Stanford’s Nanofabrication Facility (SNF). The VERSALINE suite targets deep silicon etch (DSE) for silicon on insulator (SOI) structures, among other projects.

Over 600 users have access to the SNF, performing R&D and production-level tasks. It serves academic, industrial and governmental researchers across the US, focusing on optics, MEMS, biology, and chemistry, as well as traditional electronics device fabrication and process characterization. The SNF is a 10,000sq.ft. class-100 cleanroom. It is part of the NSF’s National Nanotechnology Infrastructure Network (NNIN).

Plasma-Therm manufactures advanced plasma processing equipment for specialty semiconductor markets including R&D, solid state lighting, data storage, renewable energy, MEMS, nanotechnology and compound semiconductor. Learn more at www.plasmatherm.com.

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August 11, 2011 — The CES, annual consumer electronics show, will feature for the first time a MEMS TechZone and MEMS conference program at CES 2012. The MEMS Industry Group (MIG) will spearhead this new effort.

CES takes place January 10-13 in Las Vegas, NV.

MEMS TechZone showcases the adoption of MEMS, micro electro mechanical systems, in mobile phones, game consoles, tablet PCs and other consumer-electronic devices. MIG will co-exhibit with several members including Bosch/Bosch Sensortec/Akustica, VTI Technologies and WiSpry.

The MEMS TechZone will take place at the Las Vegas Convention Center (LVCC), South Hall 2.

A panel on consumer devices enabled by MEMS will take place Wednesday, January 12 at 11:30am in N254, North Hall of the LVCC.

More information is available at www.cesweb.org/showFloor/techzones.asp#5320

2011’s CES was a staging ground for the new TV remote enabled by MEMS

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August 10, 2011 – Marketwire — Sensors are experiencing faster growth than the overall semiconductor chip industry, according to the Q3 Sensors and MEMS Market Tracker released by MarketResearch.com. Sensors hit almost $7 billion in 2010, with 6.5 million units shipped.

The WSTS expects sensors to surge 18% in 2011 to $8.18 billion, and another 11% in 2012 to $9 billion. For 2013 the WSTS projects nearly another 10% for sensors sales (still almost twice the overall market) to just under $10 billion.

After unprecedented 2010 increases, total optoelectronics, sensors, and discretes (O-S-D) revenues are predicted to hit $58.3 billion in 2011, says IC Insights.

Touch and orientation electronics require sensors to operate, and are being integrated into increasing numbers of applications. Other sensors are also seeing strong demand from automotive, medical electronics, and security applications.

The micro electro mechanical systems (MEMS) and sensors tracker vital market statistics on revenue by product, market forecasts, regional forecasts, and breakouts for each application sector, such as computers and automotive.

MarketResearch.com provides global market intelligence products and services. Learn more at http://www.marketresearch.com/product/display.asp?ProductID=6479420.

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August 10, 2011 – Two researchers at Mexico’s Monterrey Technological Institute have reportedly been the subjects of a targeted attack by an "anti-technology anarchist group" for their work in nanotechnology including MEMS, according to various reports.

A partially destroyed message at the scene outside Mexico City identified the attackers as "Individuals Tending to Savagery," a group that opposes nanotech development and its purported dangers to native species and ties to natural disasters, and have apparently struck before in other areas of the world, according to the reports.

The two workers — cited as different people by different news outlets — were injured by the package bomb but apparently did not suffer life-threatening injuries. The institute names two of its professors as the victims, José Armando Herrera Corral and Alejandro Aceves López. They have ties to the school’s engineering sciences unit, which includes robotics, microsystems, optics, and electronics, as well as materials research. The AP report cites a different intended victim, Oscar Camacho, who works in microelectromechanical systems, whom the group claims to have targeted earlier this year in similar fashion.

Few details are in the Mexican Attorney General’s bulletin.

August 4, 2011 – BUSINESS WIRE — Epson Electronics America (EEA) launched two new series of sensing platforms, based on Epson’s QMEMS and semiconductor technologies. The new Epson evaluation tools will help developers create and evaluate consumer applications that incorporate motion and position sensing. The E Series consists of two multifunction sensor evaluation units; the M Series are compact, specialized evaluation modules.

Companies with core competencies in software development, and small firms without extensive hardware development resources can use the new sensing platform series to advance their motion sensing technology in consumer applications, said Bob Porooshani, GM of the Microelectronics Operations Division of Epson Electronics America (EEA). Users do not need sensor evaluation expertise to perform applications development.

The sensing platforms combine Epson’s high-stability QMEMS quartz gyroscopic (angular rate) sensors with its semiconductor technology, such as sensor processors and GPS devices. They process and digitize sensor data then display and store the data via various interfaces (wired, wireless).

The E Series kits have a six-axis sensor, which consists of three Epson gyroscopes that provide high accuracy and stability (±1,000 deg/s) on three axes, and a triaxial accelerometer with a dynamic range of ±6 G, a triaxial geomagnetic sensor and a pressure sensor. These evaluation units are available with either a ZigBee or a USB interface for easy connection to a PC. An accessory board can enable new interfaces and provide power for use in a wider range of evaluation environments.

The M Series consists of more compact and easier-to-use sensor evaluation modules with specialized sensor functions. The S7U4E002002 is a highly accurate motion sensor with six degrees of freedom; the S7U4E002003 is a position sensor with a GPS receiver. Each can easily be built into portable, hand-held evaluation equipment. A micro-USB interface board (sold separately) is also available for performing evaluations in a PC environment.

Epson Electronics America, Inc. (EEA), is the North American sales, marketing and engineering arm of the Epson Microdevices Operations Division of Seiko Epson Corporation. For more information, please visit www.eea.epson.com. 

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