Category Archives: MEMS

March 8, 2011 – BUSINESS WIRE — TESCAN, scanning electron microscope and focused ion beam workstation maker, delivered a VEGA 3 scanning electron microscope (SEM) to the Massachusetts Institute of Technology (MIT).

The VEGA 3 SEM will support the undergraduate students in the mechanical engineering program, specifically in the Micro and Nano Engineering lab. This course, co-founded by Dr. Sang-Gook Kim encourages creative thinking through hands-on experience via building, observing and manipulating micro and nano scale structures (MEMS, Microfluidics and Nano Materials).

Click to EnlargeThe VEGA 3 includes high-performance electronics for faster image acquisition (down to 20ns/pixel) and signal processing, an ultra-fast scanning system with compensated static and dynamic image aberrations, an extended range of scanning modes using the original Wide Field Optics, In-Flight Beam Tracing for real-time beam optimization, updated software control with high level of automation, and built-in scripting for user-defined applications. The proprietary Intermediate Lens (IML) works as an "aperture changer." The column design, without any mechanical centering elements, allows fully automated column set-up and alignment. Live stereoscopic imaging, using the advanced 3D Beam Technology, enables 3D viewing and navigation of micro- and nanoscale subjects. Jaroslav Klima, CEO of TESCAN, noted that the SEM will perform easily in the leading-edge research arena with multiple users.

TESCAN is focused on research, development and manufacturing of scientific instruments and laboratory equipment. Learn more at www.tescan.com

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March 8, 2011 – BUSINESS WIRE — IMT, wafer level packaging (WLP) company and MEMS foundry, introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding. In development for nearly a year, this bond is being actively used in production, and it is said to be one of the lowest cost methods of achieving a hermetic wafer level package bond.

Low-temperate, low-cost wafer bonding could benefit MEMS packaging, as well as other applications.

In addition to the Au-Au thermo compression and the other bond technologies supported, IMT’s flagship remains its proprietary low-temperature hermetic eutectic bond. With sealing temperatures below 190°C and support for reflow temperatures of more than 500°C, this bond is ideal for temperature-sensitive sensors or electronics that require a hermetic package. The bond line width is controlled at less than 50µm.

"More than 80% of our total business makes use of wafer level packaging," said John Foster, IMT Chairman and CEO.

IMT produces and develops MEMS devices and is a pure-play MEMS foundry in the United States. IMT designs, manufactures, tests and supplies products to the RF, biotech, biomed, optical communications, infrared, navigation and general markets servicing Fortune 500 companies as well as startups. For more information, visit http://www.imtmems.com.

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March 8, 2011 – BUSINESS WIRE — IMT, wafer level packaging (WLP) company and MEMS foundry, introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding. In development for nearly a year, this bond is being actively used in production, and it is said to be one of the lowest cost methods of achieving a hermetic wafer level package bond.

Low-temperate, low-cost wafer bonding could benefit MEMS packaging, as well as other applications.

In addition to the Au-Au thermo compression and the other bond technologies supported, IMT’s flagship remains its proprietary low-temperature hermetic eutectic bond. With sealing temperatures below 190°C and support for reflow temperatures of more than 500°C, this bond is ideal for temperature-sensitive sensors or electronics that require a hermetic package. The bond line width is controlled at less than 50µm.

"More than 80% of our total business makes use of wafer level packaging," said John Foster, IMT Chairman and CEO.

IMT produces and develops MEMS devices and is a pure-play MEMS foundry in the United States. IMT designs, manufactures, tests and supplies products to the RF, biotech, biomed, optical communications, infrared, navigation and general markets servicing Fortune 500 companies as well as startups. For more information, visit http://www.imtmems.com.

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March 7, 2011 — Shipments of complementary metal oxide semiconductor (CMOS) image sensors for digital still cameras (DSCs) are set for rapid growth over the next three years, allowing them to exceed those of charge-coupled devices (CCD) for the first time ever in 2013, according to new IHS iSuppli research. CMOS image sensors are winning over Sony, Canon, and other OEMs with better power consumption, lower fab costs, and circuit integration, among other benefits.

CMOS image sensor shipments for DSCs in 2013 will reach 71.1 million units, up from 30.7 million in 2010. Meanwhile, CCD shipments will decline to 66.9 million in 2013, down from 94.1 million in 2010. By 2014, more than 85 million DSC CMOS units will be shipping, compared to 51 million for CCD.

Figure. Digital still camera (DSC) image sensor unit shipments by technology (millions of units).

"After many years of using CCD technology, original equipment manufacturers (OEM) like Sony, Canon, Kodak, Casio and Samsung now are turning to CMOS, which has narrowed the image quality gap with CCDs to a great degree," said Pamela Tufegdzic, analyst for consumer electronics at IHS. "This has allowed DSC makers to enjoy the advantages provided by CMOS sensors, including lower power consumption and reduced cost."

The lower power consumption of CMOS sensors yields longer battery life. Meanwhile, CMOS sensors are cheaper to produce than CCDs, cutting the cost for manufacturing DSCs. Other advantages of CMOS sensors include their support for multiple channels of sensor data to be read out simultaneously at high speeds, improving the performance of DSCs. CMOS sensors also allow for the possible inclusion of on-chip peripheral circuits, increasing the integration of electronics and reducing the size of DSCs.

Finally, CMOS sensors support backside illumination technology, enabling better quality imaging in low and normal lighting conditions. Backside illumination is especially of interest to camera OEMs that are shifting from CCD technology to CMOS.

Some lingering issues remain, however, involving the switch to CMOS technology. In comparison to CCDs, CMOS image sensors generate more electrical noise, which can result in poor image quality with irregular pixels. CMOS image sensors also create random noise that appears in different pixels at different times, caused by flickering light.

2009 was a tough time for DSCs, as it was for most consumer electronics products. However, IHS believes the worst has passed and that the market is set to expand in 2011 and beyond. Growth will be fueled by lower price points that stimulate demand and drive unit sales. Furthermore, a number of new areas within the DSC market will continue to expand, such as hybrid cameras (video and still images), Wi-Fi digital, and 3D cameras. Such factors, in combination with the positive outlook for digital single-lens reflex (DSLR) cameras, whose prices continue to drop, will increase demand and desire among consumers to use DSCs over their mobile handset cameras in the future.

Read more in "Image Sensors Continue to Experience Demand for 2011 and Beyond," abstract at http://isuppli.com/Abstract/P12201_20110216155231.pdf

IHS iSuppli technology value chain research and advisory services range from electronic component research to device-specific application market forecasts, from teardown analysis to consumer electronics market trends and analysis and from display device and systems research to automotive telematics, navigation and safety systems research. More information is available at www.isuppli.com

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March 7, 2011 — Coventor Inc., software supplier for developing micro-electromechanical systems (MEMS), announced availability of SEMulator3D 2011, the latest version of its virtual fabrication software for semiconductor and MEMS process development organizations. It includes the debut of SEMulator3D Reader.

SEMulator3D is already in use by semiconductor companies, MEMS integrated device manufacturers (IDMs), and MEMS foundries for tasks ranging from process integration and documentation of advanced logic and memory process nodes to MEMS design verification.

The SEMulator3D 2011 release provides a three-fold performance boost in model building time and new robust 3D mesh generation capabilities that create silicon-accurate meshes for physics-based simulations used to optimize the performance and manufacturability of semiconductor and MEMS devices. In addition, Coventor is providing the first release of SEMulator3D Reader, a downloadable interactive 3D model viewer that will streamline communications among process development team members and with suppliers and customers.

The release of SEMulator3D 2011 offers 3D virtual fabrication for existing process integration and documentation applications, as well as emerging applications, including novel semiconductor processes, non-destructive metrology, and highly integrated MEMS+CMOS processes.

SEMulator3D’s new mesh generation capability means that device simulations are no longer limited to idealized device models. Surface and volume meshes can be exported to finite element analysis (FEA) and TCAD simulation tools in multiple industry-standard formats, including ans (Ansys), dxf, obj, and unv formats. The meshes are of uniform quality and density suitable for simulation of many physical domains, including mechanical, thermal, and electromagnetics, in addition to coupled physics such as electromechanics.

The new SEMulator3D Reader is a full-featured 3D viewer that uses a compact file format designed for portability. It enables process development and foundry service teams to easily share 3D device models that convey far more information than the static screenshot images or PowerPoint slides typically used to communicate with colleagues or customers. Users are able to interact directly with the models to manipulate the 3D view, see a cross section at any location, toggle visibility of layers, and animate the fabrication process. Comments and annotations can be added for each process step to further streamline communications and documentation throughout the entire development cycle. A downloadable version of the SEMulator3D Reader is immediately available with online access to a variety of sample semiconductor and MEMS 3D models.

"IBM uses Coventor’s SEMulator3D to emulate advanced FEOL, MOL and BEOL integrated processes, with specific attention to 22nm technology and beyond. SEMulator3D allows modeling of a complete process sequence and creates realistic 3D models that can be shared with colleagues. The process/layout editor tools allow development and calibration of a process emulation and expands our understanding of the resulting structures to a variety of layouts," said David Fried, 22nm chief technologist at IBM. "With this capability, our visibility into the full technology implication of process selections and changes has been improved. SEMulator3D has helped IBM predict problems that otherwise would only have been found by subsequent testing and physical failure analysis."

"IMEC uses SEMulator3D for process documentation and design verification. Our SiGeMEMS-above-IC technology allows product developers to monolithically integrate MEMS devices with CMOS circuits, enabling new applications and reduced form factors. By providing SEMulator3D process files with our PDK, we enable designers to verify manufacturability of their designs before tape-out for fabrication. Using SEMulator3D, we can ensure that designers receive the accurate and complete process information they require," commented Stephane Donnay, Ph.D., CMORE program manager at IMEC.

Coventor profiled customer test cases to identify steps that required the most computing time, and then optimized the algorithms and implemented parallel processing support (making use of multi-core CPUs) to achieve performance gains of 3 to 4x over the previous release. SEMulator3D 2011 is more than three times faster for a 25nm flash memory application. In addition, the tool now detects incremental changes to the process description and automatically re-builds only subsequent process steps, saving on average 50% or more in model development time.

"SEMulator3D is our tool…for experimenting with new technologies and ideas," said Thomas Ostermann, staff engineer, Power Technology Development, Automotive Power at Infineon Technologies Austria AG. "We also use SEMulator3D to create 3D cross sections for documentation and training of new colleagues. The ability to generate 3D pictures and animations makes it much easier to explain a process."

Coventor Inc. makes automated design products for micro-electromechanical systems (MEMS) and virtual fabrication of MEMS and semiconductor devices. More information is available at http://www.coventor.com

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March 7, 2011 – Marketwire — Boston Micromachines Corporation (BMC), MEMS-based deformable mirror (DM) provider for adaptive optics systems, won a Phase 1 contract for $100,000 from NASA’s Small Business Innovation Research Program (SBIR) to support space-based imaging research.

The Phase 1 project is for the development of a reliable, fault-tolerant microelectromechanical deformable mirror (MEMS-DM) technology, which will fill a critical gap in NASA’s roadmap for future coronagraphic observatories. BMC will implement two innovative, complementary modifications to the MEMS manufacturing process. The team will develop a drive electronics approach that inherently limits actuator electrical current density generated to prevent permanent failure when a short time frame single fault failure occurs, as well as modify the actuator design to mitigate failure due to adhesion between contacting surfaces of the actuator flexure and fixed base.

NASA has identified a current technology need for compact, ultra-precise, multi-thousand actuator DM devices. Space-based telescopes have become indispensible in advancing the frontiers of astrophysics. Over the past decade NASA has pioneered coronagraphic instrument concepts and test beds to provide a foundation for exploring feasibility of coronagraphic approaches to high-contrast imaging and spectroscopy.

"Space-based astronomical imaging systems are inherently challenged by the need to achieve diffraction-limited performance with relatively lightweight optical components. Given the current constraints on fabrication methods, a new manufacturing technique is required to increase reliability and prevent single actuator failures," said Paul Bierden, president and co-founder of Boston Micromachines. "This project will result in innovative advances in component design and fabrication and substantial progress in the development of high-resolution deformable mirrors suitable for space-based operation."

This Phase 1 award is part of NASA’s Small Business Innovation Research programs. The competitive programs afford small businesses the chance to propose unique ideas that meet specific research and development needs of the government. The criteria used to choose these winning proposals include technical merit and feasibility, experience, qualifications, effectiveness of the work plan and commercial potential.

Boston Micromachines Corporation (BMC) makes advanced microelectromechanical systems (MEMS)-based mirror products for use in commercial adaptive optics systems. By applying wavefront correction to produce high resolution images, BMC devices can be used for imaging biological tissue and the human retina and to enhance images blurred by the earth’s atmosphere. The company’s suite of compact deformable mirror (DM) products is cost effective and high performance. For more information on BMC, please visit www.bostonmicromachines.com.

Other NASA news in microelectronics:

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March 7, 2011 — The Institute of Microelectronics (IME), an institute of the Agency for Science, Technology and Research (A*STAR), and electronic defense systems company ELTA Systems Ltd. (ELTA), a group and a wholly owned subsidiary of Israel Aerospace Industries (IAI), have inked an agreement to design and develop a novel through silicon via (TSV) substrate technology for multi-chip module (MCM) packaging.

The collaboration will result in new applications in multi-chip modules in radar, communication, and electronic warfare systems. The new technology platform would enable miniaturization of wireless applications that are faster, lighter and can withstand higher temperatures.
 
"Our joint goal is to develop innovative manufacturing and design processes to address the challenges associated with the use of TSV substrate technologies. We expect the resultant technology to have a fundamental impact on the defense systems industry, and on a wider scale, the worldwide semiconductor packaging market," said Professor Dim-Lee Kwong, executive director of IME. IME offers capabilities in IC packaging design and wafer-level molding.

By providing high density, very fine pitch interconnects and better stress tolerance between the die and substrate, TSV substrate technology is increasingly viewed as a critical means of resolving the growing geometric and material incompatibility between printed circuit boards and ICs. Apart from the greater miniaturization they afford, TSV substrate technology also offers more flexibility and shorter time-to-market. IME has been spearheading the development of this disruptive technology through its TSV research program and the 3D TSV consortium it leads.

The Institute of Microelectronics (IME) is a research institute of the Science and Engineering Research Council of the Agency for Science, Technology and Research (A*STAR) in Singapore. Its key research areas are in integrated circuits design, advanced packaging, bioelectronics and medical devices, MEMS, nanoelectronics, and photonics. For more information, visit IME at http://www.ime.a-star.edu.sg. A*STAR is the lead agency for fostering world-class scientific research and talent for a vibrant knowledge-based and innovation-driven Singapore.

Israel Aerospace Industries Ltd. is a leader in the aerospace and defense industry and Israel’s largest industrial exporter. ELTA Systems Ltd., a group and wholly owned subsidiary of IAI, is one of Israel’s leading defense electronics companies specializing in intelligence, surveillance, target acquisition and reconnaissance (ISTAR); early warning command and control; homeland security (HLS); self-protection and self-defense, and fire control applications. Please visit www.iai.co.il for more information.

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March 3, 2011 — Vistec Lithography Inc., electron-beam lithography system supplier, received a major order from Greece. The National Center for Scientific Research (NCSR Demokritos) bought an EBPG5000plusES system for one of its associated Institute of Microelectronics (IMEL). This will be the first 100kV lithography system in Greece, enabling multidisciplinary cutting-edge nano-research.

Click to Enlarge"Due to the different fields of research carried out at the IMEL we had very special demands for the new patterning system. It not only had to be capable of a multi user environment but also had to provide high class and efficient nano-lithography in all areas of our activities spanning from nanoelectronic devices to sensors and MEMS/NEMS. The EBPG5000plusES is the perfect match to these requirements and it will allow IMEL to further improve its position at the nanotechnology forefront," said Professor Dimitris Tsoukalas, director of IMEL. The Vistec EBPG5000plusES is a high-performance lithography tool based on reliable and well-proven system architecture. Due to its electron-optical column, the system can expose various substrate types with a spot size down to <2.2nm, enabling nano-dimensional features below 8nm. The system incorporates an interactive graphical user interface (GUI) that provides ease of use for diverse multi user environments.

IMEL is the top research provider of its type in Greece, noted Rainer Schmid, GM at Vistec Lithography, adding that the EBPG5000plusES 100kV system will allow the institute to maintain a leading role in national nano-research, European research projects, networks of excellence, and technology platforms.

NCSR Demokritos is a multidisciplinary Research Center located close to Athens. Its activities are performed in 8 Institutes and are concentrated in the areas of nanosciences & micro-nanotechnology, new materials, energy, health, environment, informatics & telecommunications and cultural heritage.

IMEL is one of the 8 Institutes of NCSR Demokritos with a mission to perform medium- to long-term research in micro and nanotechnology. The Institute supports educational activities in Greece and offers services to external users.

The Vistec Electron Beam Lithography Group is a global manufacturer and supplier of e-beam lithography systems with applications ranging from nano and bio-technology to photonics and industrial environments like mask making or direct writing for fast prototype development and design evaluation.

The Vistec Electron Beam Lithography Group combines Vistec Lithography and Vistec Electron Beam. Vistec Lithography develops, manufactures, and sells electron-beam lithography equipment based on Gaussian Beam technology. Vistec Electron Beam provides electron-beam lithography equipment based on Shaped Beam technology.

Learn more at www.vistec-semi.com

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March 3, 2011 – MARKET WIRE — MSGI Technology Solutions Inc. (OTCBB: MSGI), a provider of proprietary solutions to commercial and government organizations, provided a science and technology update to its investors on its lab-on-chip chemical sensing technology being developed for NAsA.

Click to EnlargeAs part of MSGI Space Act Agreements with NASA, a handheld diagnostic device has been developed with medical and environmental testing applications. The new device plugs directly into an iPhone and can collect and analyze chemical data in real time. The device senses chemicals in the air using a sample jet and a multi-channel silicon-based sensing chip with a variety of nanomaterials.

The device consists of 256 nanosensors on the chip and uses a pattern recognition algorithm to identify the ‘finger print’ of the analyte of interest. The sensing device effectively learns the response pattern from changes in resistance correlated to concentration levels of certain target chemicals and gases.

This research has been conducted with support from the US Dept of Homeland Security, US Department of Defense, and MSGI using breakthroughs in nanotechnology and chemical sensing.

Click to EnlargeWithin the medical diagnostic field, the sensor will extract and test breath for a variety of biomarkers indicating various stages of a life-threatening disease. The first such chemical sensor will be used as a non-invasive bloodless test for diabetes. Environmental diagnostic applications include testing the air in a burning building for levels of carbon monoxide and other dangerous or toxic gases, screening for attempts of bio-terrorism.

Jeremy Barbera, CEO of MSGI Technology Solutions, commented, "Alongside our NASA partners, we have been making great technological strides in the areas of chemical sensing and solar energy. Our innovative technology has the ability to improve many facets of society including homeland security, environmental testing, diagnostic testing, energy conservation and much more."

MSGI Technology Solutions Inc. (OTCBB: MSGI) is a provider of proprietary solutions to commercial and government organizations. MSGI has executed several Space Act Agreements with The National Aeronautics and Space Administration (NASA), forming a partnership between MSGI and the NASA Ames Research Center for the purpose of research and development, technology transfer and near-term commercialization of NASA inventions.

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March 2, 2011 – Marketwire — ALLVIA, through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the IMAPS Conference on Device Packaging in Scottsdale, AZ, March 9. Dr. Sergey Savastiouk, CEO at ALLVIA, will present "Silicon Interposers Enable High Performance Capacitors."

The data presented in this paper will show that, after several thermal cycles, planar capacitors on silicon result in stable, reliable capacitors operating at very high frequencies. Planar capacitors in interposers don’t exhibit parallel resonance, an issue seen with chip capacitors. ALLVIA, on behalf of its foundry customers, has been conducting studies of various capacitors on silicon interposers.

Thin film capacitors without TSVs have been used previously. However, with high interconnect inductance, benefits of thin film capacitors have not been fully realized. TSV interposers with embedded capacitors provide the shortest electrical path between devices and power supply decoupling capacitors. TSVs provide very low inductance interconnects, enabling high electrical performance when integrated with embedded thin film capacitors.

ALLVIA has integrated embedded capacitors on silicon interposers, a key interface between a silicon device and an organic substrate needed for managing high interconnect densities. 3D integration with ALLVIA’s through silicon via technology allows much closer access to high value capacitors than previously possible, leading to a much higher level of electrical performance.

The International Microelectronics And Packaging Society (IMAPS) is the largest organization dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. IMAPS Device Packaging conference will be held at the Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, AZ, March 8-10, 2011.

ALLVIA is a through silicon via (TSV) foundry offering prototyping and full volume production of both front side and back side TSVs to the MEMS and semiconductor industries as well as silicon etching, copper plating, photolithography, CMP, etc. www.allvia.com

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