Category Archives: MEMS

February 10, 2011 — Capitalizing on their design wins in Apple Inc.’s iPhone 4 and iPad, semiconductor suppliers STMicroelectronics and TriQuint in 2010 achieved industry-leading growth in the global market for microelectromechanical systems (MEMS) in consumer electronics and mobile devices, new IHS iSuppli research indicates.

TriQuint’s revenue in this area expanded by 778.6% in 2010, with its consumer and mobile MEMS revenue amounting to $74.7 million in 2010, up from a negligible $8.5 million in 2009. This propelled TriQuint to the No. 8 ranking in the market, up from 16th place in 2009. STMicroelectronics posted the second-highest growth rate among the Top 10, with its revenue rising by 63.5%. The company’s revenue amounted to $353.6 million, up from $216.3 million in 2009, allowing it to expand its leadership in global consumer and mobile MEMS sales.

Read iSuppli’s report about MEMS in the iPhone

The iPhone 4 includes five separate MEMS devices, plus a third MEMS microphone in the headset, up from two in the iPhone 3GS.

The iPad 3G contains three MEMS devices.

The iPhone 4 and iPad 3G integrated TriQuint’s TQM666092 transmit module for the WCDMA band 2, which consist of a single-band power amplifier, a bulk acoustic wave (BAW) duplexer and a surface acoustic wave (SAW) interstage filter. The company launched its MEMS BAW filter technology early in 2009 and by 2010 managed to grab 26% of the global BAW market from Avago.

The iPhone 4 also includes STMicroelectronics’ LIS331DLH MEMS accelerometer, and its L3G4200D MEMS digital three-axis gyroscope.

The gyroscope design win in the iPhone 4 played an important role in STMicroelectronics’ massive revenue increase in 2010, serving as a new growth market for the company’s MEMS line.

STMicroelectronics accounted for 50% of global accelerometer revenue during the past two years, and its share is not likely to rise significantly in the future. Meanwhile, growth is slowing in the accelerometer market.

Because of this, STMicroelectronics has sought new growth drivers, investing heavily in gyroscope development in 2008 and 2009. This paid off in 2010 as gyroscopes brought in $117 million of revenue for the company and contributed to 85% of STM’s consumer MEMS revenue growth. The IHS iSuppli Teardown Analysis Service also identified STMicroelectronics’ 3-axis gyroscope in the iPad, the fourth-generation iPod Touch, the Samsung Galaxy Tab and the Sony Move controller.

The company is paving the way for its next growth engines by offering MEMS microphones and MEMS pressure sensors for handsets and tablets, which should contribute to revenue starting this year.

Read more…

Follow Small Times on Twitter.com by clicking www.twitter.com/smalltimes. Or join our Facebook group

February 10, 2011 – Marketwire — SPP Process Technology Systems (SPTS), plasma etch, deposition, and thermal processing equipment manufacturer for the micro-device industry, completed the acquisition of deep reactive ion etch (DRIE) technology and certain related assets from Tegal Corporation. In addition, the deal includes the transfer to SPTS of the capital stock and operations of Tegal France SAS, a wholly-owned Tegal subsidiary formed by Tegal’s acquisition of Alcatel Micro Machining Systems’ DRIE assets in September 2008.

SPTS’ acquisition will include the Tegal DRIE product line (including 200, 110, 3200, and 4200 series), along with the Compact and Pluto development assets, intellectual property (IP) and process know-how. SPTS will provide continued global support to existing Tegal DRIE customers, and will integrate these technologies into its SPTS’ broad range of product offerings in etch, deposition and thermal technologies. SPTS just days ago acquired the etch portfolio of Primaxx from its parent company.

"The sale of the Tegal DRIE assets to SPTS secures our technology, team members, active joint development projects in France, and ensures continuation of our commitments to customers globally," said Thomas Mika, president and CEO, Tegal Corporation. "This event represents another major step in Tegal’s transformation from semiconductor capital equipment supplier to its new role in providing green energy." Tegal recently announced participation in the formation of sequel Power, a company engaged in large scale photovoltaic (PV)-based solar utilities.

SPP Process Technology Systems was established in October 2009 as the vehicle for the merger of Surface Technology Systems and acquired assets of Aviza Technology. The company is a wholly-owned subsidiary of Sumitomo Precision Products Co., Ltd., and designs, manufactures, sells, and supports advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets. These products are used in a variety of market segments, including R&D, data storage, MEMS and nanotechnology, advanced 3-D packaging, LEDs, and power integrated circuits for communications. For more information about SPTS, please visit www.spp-pts.com.

Tegal is dedicated to the development and application of both proven and emerging technologies in the field of green energy. Tegal is engaged in the promotion of solar power plant development projects worldwide, the development of self-sustaining businesses from such projects, including supporting, developing, building and operating solar photovoltaic fabrication facilities and solar farms and other non-PV based renewable energy projects. Learn more at www.Tegal.com.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Solid State Technology on Twitter.com via editors Pete Singer, twitter.com/PetesTweetsPW and Debra Vogler, twitter.com/dvogler_PV_semi.

Or join our Facebook group

February 10, 2011 – Marketwire — SPP Process Technology Systems (SPTS), plasma etch, deposition, and thermal processing equipment manufacturer for the micro-device industry, completed the acquisition of deep reactive ion etch (DRIE) technology and certain related assets from Tegal Corporation. In addition, the deal includes the transfer to SPTS of the capital stock and operations of Tegal France SAS, a wholly-owned Tegal subsidiary formed by Tegal’s acquisition of Alcatel Micro Machining Systems’ DRIE assets in September 2008.

SPTS’ acquisition will include the Tegal DRIE product line (including 200, 110, 3200, and 4200 series), along with the Compact and Pluto development assets, intellectual property (IP) and process know-how. SPTS will provide continued global support to existing Tegal DRIE customers, and will integrate these technologies into its SPTS’ broad range of product offerings in etch, deposition and thermal technologies. SPTS just days ago acquired the etch portfolio of Primaxx from its parent company.

"The sale of the Tegal DRIE assets to SPTS secures our technology, team members, active joint development projects in France, and ensures continuation of our commitments to customers globally," said Thomas Mika, president and CEO, Tegal Corporation. "This event represents another major step in Tegal’s transformation from semiconductor capital equipment supplier to its new role in providing green energy." Tegal recently announced participation in the formation of sequel Power, a company engaged in large scale photovoltaic (PV)-based solar utilities.

SPP Process Technology Systems was established in October 2009 as the vehicle for the merger of Surface Technology Systems and acquired assets of Aviza Technology. The company is a wholly-owned subsidiary of Sumitomo Precision Products Co., Ltd., and designs, manufactures, sells, and supports advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets. These products are used in a variety of market segments, including R&D, data storage, MEMS and nanotechnology, advanced 3-D packaging, LEDs, and power integrated circuits for communications. For more information about SPTS, please visit www.spp-pts.com.

Tegal is dedicated to the development and application of both proven and emerging technologies in the field of green energy. Tegal is engaged in the promotion of solar power plant development projects worldwide, the development of self-sustaining businesses from such projects, including supporting, developing, building and operating solar photovoltaic fabrication facilities and solar farms and other non-PV based renewable energy projects. Learn more at www.Tegal.com.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Solid State Technology on Twitter.com via editors Pete Singer, twitter.com/PetesTweetsPW and Debra Vogler, twitter.com/dvogler_PV_semi.

Or join our Facebook group

February 9, 2011 — SPP Process Technology Systems (SPTS), plasma etch, deposition, and thermal processing equipment manufacturer for the semiconductor industry, received a follow-on purchase order from CEA-Leti for its Sigma fxP physical vapor deposition (PVD) system. The 300mm system will be used for advanced through-silicon via (TSV) development at Leti’s new 300mm fab extension in Grenoble, France.

In October 2010, Leti and SPTS agreed to collaborate on creating next-generation high-aspect ratio TSVs. The new Sigma system will join SPTS’ silicon etch and dielectric deposition systems previously selected for this new line.
 
Leti’s integration line features a complete suite of the equipment required for research and development on advanced 3D IC single processes and integration. The Sigma fxP will deposit the diffusion barrier and seed metal layers prior to the final Cu electroplating via fill process. Using SPTS Advanced Hi-Fill (AHF) technology, ionized PVD deposition techniques will maximize metal coverage in the via, creating an environment for cost-effective via fill fin high aspect ratio architectures.
 
"We are working closely with SPTS on next-generation 3D IC developments, and their metal deposition capability forms an integral part of our development process," said Dr. Laurent Malier, CEO of CEA-Leti, adding that SPTS has integration expertise in all three areas of deep reactive ion-etching (DRIE), dielectric deposition, and metal seed deposition.

SPTS participated at Leti’s Inauguration Day activities in January, and presented on future TSV trends and technical requirements in advanced 3D-IC manufacturing.
 
The Sigma fxP system is a single-wafer cluster tool designed for high-volume PVD processing, offering excellent process control with high throughput. It is a flexible system supporting various process chamber configurations and combinations to address specific applications. Deposition process modules are based on a standard design that enables simple technology upgrades and wafer size conversions. Key applications for the Sigma fxP include very thick Al alloys for power device and next generation CMOS bondpads, ionized and conventional PVD for 3D-IC and wafer level packaging (WLP) as well as highly uniform aluminium nitride (AlN) for RF MEMS devices.

SPP Process Technology Systems was established in October 2009 as the vehicle for the merger of Surface Technology Systems and acquired assets of Aviza Technology. The company is a wholly-owned subsidiary of Sumitomo Precision Products Co., Ltd., and designs, manufactures, sells, and supports advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets. For more information on SPTS, visit www.spp-pts.com

CEA is a French research and technology public organization, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. For more information, visit www.leti.fr.

February 9, 2011 – BUSINESS WIRE — Sand 9, Inc., is planning volume launch of its MEMS oscillator technology for wireless applications. The company appointed Skyworks EVP Greg Waters to their Board of Directors, using his experience in wireless communications to help Sand 9 manage the transition from development to volume production.

Sand 9 is introducing a temperature compensated MEMS oscillator (TCMO), a MEMS timing device that achieves the performance required for wireless applications such as 3G/4G cellular and GPS. "Sand 9’s breakthrough technology has the potential to be truly disruptive in the wireless communications market," said Waters.

Waters is executive vice president and general manager, front-end solutions, for Skyworks Solutions, Inc. He joined the company in April 2003. Prior to joining Skyworks, Waters served as senior vice president of strategy and business development at Agere Systems, and previously held positions there as vice president of the Wireless Communications business, and vice president of the Broadband Communications business.

Sand 9 is a venture funded company dedicated to the design of precision timing technology that will dramatically improve the capabilities of electronic devices. The company’s investors include Commonwealth Capital, Flybridge Capital Partners, General Catalyst and Khosla Ventures. For more information, visit www.sand9.com.

Follow Small Times on Twitter.com by clicking www.twitter.com/smalltimes. Or join our Facebook group

February 8, 2011 – BUSINESS WIRE — Bruker announced the North American launch of its compact, fully automated and fast toxin identification system, pTD, or portable Toxin Detector. The benchtop, push-button pTD system is intended for smaller, field, and mobile laboratories for use by non-expert operators in homeland security applications.

The Bruker pTD system simplifies and accelerates detection of potential biological terror attack using toxins. The pTD system uses a lab-chip-based, fully automated enzyme-linked immunosorbent assay (ELISA) process that allows the simultaneous identification of five toxins with an order of magnitude better sensitivity than traditional techniques. The fully automated pTD includes controls to minimize false positive or negative alarms. Toxin identification and quality control take place in less than 30 minutes. Traditional PCR-based or proteomic fingerprinting identification technologies for the detection and identification of toxins in the field are insensitive and slow, or involve complicated sample preparation in specialized laboratories, according to Bruker.

The pTD system accepts liquid and solid samples and does not require any external sample preparation steps. Every sample is automatically checked for five toxins simultaneously using multiplexed, proprietary lab chips. Toxin identification is based on ELISA using highly specific antibodies, combined with an electrochemical readout. All sample preparation steps are performed automatically inside the lab chip, and the results are displayed on the control computer. Before shutdown, the system automatically decontaminates itself internally.

The pTD system, which has been co-developed with Analytik Jena AG, identifies the five toxins Botulinum Toxin A, B and E, as well as Ricin and Staphylococcus enterotoxin B on one chip. Additional toxin ID chips are under development.

Bruker Detection provides ruggedized, field analytical systems for chemical, biological, radiological, nuclear and explosives (CBRNE) detection. For more information on Bruker Detection Corporation and Bruker Corporation (NASDAQ: BRKR), please visit www.bruker.com

Other lab-on-chip news:
Personalized medicine: Imec proposes lab-on-chip for SNP detection in DNA 
Lab-on-chip project aims to diagnose cancer faster 
Lab-on-chip system could provide fast detection of single nucleotide variations in DNA

Follow Small Times on Twitter.com by clicking www.twitter.com/smalltimes. Or join our Facebook group

February 7, 2011 — SPP Process Technology Systems (SPTS), plasma etch, deposition, and thermal processing equipment supplier for the semiconductor industry, completed the transfer of ownership of Primaxx Inc. from SPTS’ parent company, Sumitomo Precision Products (SPP) to SPTS in December 2010. The transfer strengthens SPTS’ etch technology portfolio that includes deep silicon etch, dielectric etch, inductively coupled plasma (ICP) etch, and now hydrogen fluoride (HF) vapor oxide etch. Primaxx provides residue-free micro electromechanical systems (MEMS) dry etch release products, and is based in Allentown, PA.

Primaxx’s patented HF vapor oxide etch technology uses a reduced pressure, gas phase, controlled anhydrous HF/alcohol process to deliver residue-free "etch release" to remove the sacrificial silicon oxide layers used in MEMS manufacturing. Using HF, the sacrificial layer is etched with high selectivity relative to the structural layer.

"Considering the complementary products and synergies that already exist within both companies, bringing the Primaxx range of products and services into the SPTS family expands our customer offerings. It allows SPTS to provide an expanded manufacturing portfolio to our MEMS customers," said William Johnson, president and CEO of SPTS. "In the long-term, SPTS will also explore opportunities to provide more integrated process schemes related to HF release technologies."
 
Paul Hammond, president and CEO of Primaxx echoed the sentiment that with the transfer of ownership, Primaxx customers now benefit from the expanded service, support and distribution infrastructure of SPTS — with one consolidated contact point. "Through our parent company, Primaxx has already been working closely with SPTS; the acquisition is a natural progression in the relationship that immediately augments Primaxx’s sales and marketing capabilities," said Hammond.
 
The Primaxx brand is planned to remain unchanged, while current process modules will eventually be consolidated with SPTS’ production-proven fxP wafer transport and control system. 

SPP Process Technology Systems (SPTS) is a manufacturer of plasma etch and deposition and thermal processing equipment for the semiconductor industry. Learn more at http://www.spp-pts.com/

Follow Small Times on Twitter.com by clicking www.twitter.com/smalltimes. Or join our Facebook group

February 7, 2011 — Sandia National Laboratories will help Mexican engineering students learn to design microelectromechanical devices (MEMS), according to a memorandum of understanding (MOU) between Sandia and the University of Guadalajara.

Click to Enlarge
10 Mexican professors and 3 Sandia researchers at a SUMMit design course for MEMS devices held at Sandia in December 2009. Ernest Garcia is third from right. (Photo courtesy of Universidad Autonoma de Ciudad Juarez)

The rationale for the agreement is that the economic well-being of Mexico is a national security issue for the United States, said Sandia project lead Ernest Garcia.

Sandia’s SUMMiT V fabrication process will permit students to design MEMS devices that employ five layers of silicon. Each layer adds another level of complexity to the design. SUMMiT V permits advanced systems created on moveable platforms to be taller (up to 12 micrometers high), stiffer, and more mechanically forceful and robust than those created by earlier processes.

"The University of Guadalajara is like the state of California’s higher education system," Garcia said. "It supports a number of universities throughout the Mexican state of Jalisco. Its leadership wants to use SUMMiT as the basis for a future graduate program in MEMS."

"MEMS manufacturing will leverage many of Mexico’s traditional strengths in electronic manufacturing," Herrera said. "Sandia is in a position to help the University of Guadalajara system migrate to a state-of-the-art MEMS design capability."

"If we could help Mexico improve its research and development capabilities, it would help stabilize its economy," he said. Garcia sees the new collaboration with the U. of Guadalajara as a long-term investment in the future of the Mexican economy. "It’s not a sprint, it’s a marathon," Garcia said, mentioning potential barriers like U.S. controls on exporting technology and intellectual property (IP) to foreign countries.

Click to Enlarge
A student in a clean room at the Universidad Autonoma de Ciudad Juarez, which has an ongoing arrangment with Sandia National Labs. Sandia’s MOU with the U. of Guadalajara will open MEMS education to more Mexican students. (Photo courtesy of Universidad Autonoma de Ciudad Juarez)

"Ultimately, the U.S. may be the biggest beneficiary if the MOU contributes to the vitality of the Mexican economy and thereby the stability of the U.S.-Mexican border," said Gil Herrera, director of Sandia’s Microsystems Science, Technology and Components Center. "We believe that Sandia will also benefit from the relationship, as we will have new minds challenging the design envelope of our SUMMiT MEMS technology." Herrera is in charge of Sandia’s activities in support of the collaboration.

Steve Rottler, Sandia’s vice president for basic technologies, signed the agreement for Sandia. He said, "The commitment and enthusiasm of the University of Guadalajara faculty and leadership will greatly help this collaboration to advance technologies vital to the economies and security of both countries."

Similar efforts by Sandia are also underway at Mexican universities in Juarez, Veracruz and Mexico City, as well as the Puebla-based National Institute of Astrophysics, Optics, and Electronics (INAOE).

The agreement extends earlier work by Sandia that played a role in creating a Bi-National Sustainability Laboratory at Santa Teresa, NM, near the border between the United States and Mexico. That effort was intended to examine problems on both sides of the border, such as water rights. The initial goal of the Sustainability Laboratory was to foster research efforts that could ultimately create border industries and jobs to staunch the one-way flow of workers from Mexico to the United States. That effort is now directed by an independent nonprofit corporation supported by a variety of national, state, and corporate sponsors.

The Guadalajara program is expected to expand an existing Sandia-led national MEMS project for Mexico. That country has spent $2 million to fund the project. "Last December, a number of Mexican professors took our MEMS course, licensed our design software, and purchased 100 silicon chips with their MEMS designs," Garcia said.

The Guadalajara agreement is different, Garcia said, because it (and Sandia efforts with other Mexican universities) are in the interior of Mexico rather than near the border.

"We hope eventually to have Mexican universities compete in Sandia’s University Alliance annual MEMS competition for the most imaginative or practical designs," Garcia said. The high-spirited contest, open to institutional members of the Sandia-led MEMS University Alliance program, provides an arena for student engineers to hone their skills in designing and using microdevices. Student contest winners get to see their designs become reality when they are fabricated at Sandia’s MEMS facilities.  Last year’s winners were Texas Tech and the University of Utah for creating, respectively, the world’s smallest chess set and a micro barber shop that serviced  a single human hair.

A delegation of Mexican professors from Guadalajara will visit Albuquerque in spring 2011 to confer with researchers at Sandia and possibly the University of New Mexico. The trips will be funded by state of Jalisco’s technology office. Albuquerque and Guadalajara are sister cities.

Sandia National Laboratories is a multiprogram laboratory operated and managed by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. Department of Energy’s National Nuclear Security Administration. With main facilities in Albuquerque, N.M., and Livermore, Calif., Sandia has major R&D responsibilities in national security, energy and environmental technologies, and economic competitiveness. Learn more at www.sandia.gov

Follow Small Times on Twitter.com by clicking www.twitter.com/smalltimes. Or join our Facebook group

 

By Debra Vogler, senior technical editor

February 7, 2011 — Researchers at imec — Danae Delbeke, photonics technology developer, INTEC (imec’s associated laboratory at Ghent U.) and Francesco Pessolano, manager, NVISION Program, imec — discuss announcements made in conjunction with Photonics West (January 25-27, 2011, San Francisco, CA) regarding the research consortium’s NVISION program (for advanced imaging solutions) and silicon.

Listen to the interviews here: Download (iPhone/iPod users) or Play Now

Pessolano describes the NVISION Program (announced 6 months ago) and explains in detail some of the changes that had to be made to standard CMOS processing to accommodate the requirements for hyperspectral imaging and smart lenses. For example, imec uses the Fabry-Perot effect instead of the complex optics (i.e., splitting light using prisms) used in conventional hyperspectral imaging; the result is a more cost-effective solution that is easily integrated. Pessolano said that the new imaging solution is 100× cheaper and 10-60× faster than the conventional imaging system.

 Click to Enlarge  Click to Enlarge

Figure 1. Cross-sectional view of integrated micro-mirror array, showing the mirrors (SG1 electrode and SG2 structural layer) on top fo the 6 layers (M1-M6) of Al interconnect. SOURCE: imec

Figure 2. Top view of individual mirror, size 7.7µm, spacing 300nm, hinge width 350nm, phase step in center. SOURCE: imec

Imec’s MEMS-based solution for smart lenses (two mirrors that deform to accomplish the zoom function) uses micro-mirrors (Figs. 1, 2). Pessolano discusses why it is necessary to control the tilt angles in an "analog" manner rather than digital. He also explains the materials selection and other factors (such as fill factor, and space constraints) important to the solution. The changes required a complete redesign of the micro-mirror topology, taking about 18 months for the redesigned MEMS-based device.

 Click to Enlarge  Click to Enlarge

Figure 3. Advanced passive silicon photonics processes. SOURCE: imec

Figure 4. Highly efficient grating couplers realized by amorphous silicon deposition.

Imec’s silicon photonics platform allows for the miniaturization of complex photonic functions on a single chip, i.e., a dense integration of photonics and electronics (Figs. 3, 4). Delbeke observes that reusing the wafer scale processes for silicon photonics, especially if the volumes are high, is cost-effective. Imec has also been standardizing the main optical building blocks for additional cost efficiency.

Follow Small Times on Twitter.com by clicking www.twitter.com/smalltimes. Or join our Facebook group

February 4, 2011 — Apple’s iPad and the Android-based tablets, along with other media tablets, make up the fastest growing microelectromechanical system (MEMS) sector in the consumer electronics and mobile segments, says IHS iSuppi researcher Jérémie Bouchaud. MEMS sales for tablet use is predicted to increase nearly 400% YOY. Cell phones remain the largest sector for MEMS adoption, however.

Click to Enlarge

Sales of MEMS for use in tablets will rise to $140.4 million this year, up 373% from a mere $29.7 million in 2010. By 2014, tablets will become the second-largest application for MEMS sensors in the consumer and mobile space after cell phones, with revenue of $280 million.

"With their focus on providing compelling user interfaces, tablets are emerging as a major growth area for MEMS," said Jérémie Bouchaud, principal analyst for MEMS and sensors at IHS. "MEMS accelerometers and gyroscopes play a key role in tablets, utilized not only for automatic screen rotation and tilt compensation for the compass but also for motion-based user interfaces. MEMS filters such as bulk acoustic wave duplexers are also used in 3G tablets, and pressure sensors and MEMS microphones likewise will join the fray in 2011. All this will result in the expansion of MEMS sales in tablets and help drive the growth of the overall market for MEMS consumer electronics devices and mobile devices."

The consumer electronics and mobile market for MEMS in 2011 will grow by more than 25%. This will nearly equal the growth rate of 2010, when the industry recovered robustly following the economic crisis of 2009.

Revenue in 2011 for MEMS sensors and actuators used in various consumer and mobile devices — including cell phones and tablets — will reach $2.07 billion, up 26.2% from $1.64 billion last year. The growth will continue the 27.1% expansion of 2010 after the market retreated to single-digit growth in 2009 given the economic slowdown. The five-year market prospects call for growth by a factor of nearly three to $3.71 billion in 2014, up from $1.13 billion in 2009, translating into a solid compound annual growth rate (CAGR) of 23.6% during the time period.

Among consumer and mobile devices, cell phones will command the largest share of MEMS use in 2011, projected to reach $1.1 billion. Cell phone sales will continue to expand during in the years to come, and both conventional handsets as well as smart phones will employ an ever-larger number of MEMS devices.

Video gaming, while still the second-largest application for consumer MEMS this year at $229.7 million, is on a path of steady decline because of market saturation and declining prices for MEMS devices for the sector. Revenue will rebound in 2014 when next-generation gaming platforms are introduced, breathing new life into the segment.

Other important markets for consumer MEMS in 2011 are cameras, projectors, laptops, MP3 players and televisions.

Top MEMS devices

Utilized in devices like mobile phones and tablets but also in gaming, cameras, laptops and remote controls, accelerometers this year will continue to hold the pole position among all consumer MEMS devices. Revenue from accelerometers in 2011 will exceed $500 million, with cell phones accounting for the majority of accelerometer shipments from now until at least 2014.

Catching up fast to accelerometers are 3-axis gyroscopes, in second place this year with revenue also in excess of $500 million, thanks to their use in the iPhone 4 from Apple and the PlayStation Move game controller from Sony Corp as well as in handheld game players, e.g. the Nintendo 3DS and the new PSP from Sony. By 2014, accelerometers and gyroscopes will figure in a neck-and-neck finish, with the combined market for both devices reaching a market-commanding $1.6 billion.

Other best-selling MEMS devices in 2011 will include bulk acoustic wave filters, which will benefit from the increasingly widespread use of next-generation 4G wireless technology; MEMS microphones, predominant in noise-suppression technology made popular by the Droid smart phone from Motorola Corp as well as the iPhone 4; and digital light processing (DLP) chipsets, currently enjoying a renaissance with the advent of tiny pico projectors.

Read "Consumer MEMS: The Sky is the Limit!" at http://isuppli.com/MEMS-and-Sensors/Pages/Consumer-MEMS-The-Sky-is-the-Limit.aspx?PRX

IHS iSuppli technology value chain research and advisory services range from electronic component research to device-specific application market forecasts, from teardown analysis to consumer electronics market trends and analysis and from display device and systems research to automotive telematics, navigation and safety systems research. More information is available at www.isuppli.com. IHS (NYSE: IHS) is a source of information and insight in energy, economics, geopolitical risk, sustainability and supply chain management.

Follow Small Times on Twitter.com by clicking www.twitter.com/smalltimes. Or join our Facebook group