Category Archives: LEDs

by James Montgomery, News Editor, Solid-State Technology

A technique pioneered for drug discovery has successfully been adopted for materials research, to speed up the process for finding and characterizing new structures. Early adopters of this method are realizing “powerful, sustainable competitive advantages” in terms of R&D speed and efficiency, according to Isy Goldwasser, president/COO of Symyx Technologies, speaking to a ConFab audience on Wednesday about “Lessons Learned from Other Industries.”

The process of “combinatorial chemistry”, which screens thousands of compounds for specific properties, has been used for years in drug discovery, but only in the past decade have other industries including materials and electronics looked to it to help them with R&D. Essentially, this method can help speed up the process for finding and characterizing new structures — e.g. which ones have specific magnetic, conducting, or optical properties — and increase materials discovery rate by factors of 1000 or more, Goldwasser explained.

Well-defined R&D projects go through three phases, he explained: synthesis, testing, and informatics, resulting in a step-change R&D execution (i.e., more commercial outcomes in significantly less time). High-throughput research, mainly a systems problem (only 25% of this method involves hardware), requires an informatics-driven culture and mindset, with sustained investment and specialization, he noted. In every case where the method has been applied, Symyx was told it was impossible to break R&D down into small-scale experiments and parallelize them. But it has always proved feasible.

R&D execution value drivers include increasing experimental throughput (by 10x-100x), reducing cost/experiment, integrating/automating complete R&D tasks and procedures, and enabling enterprise-wide access and reutilization of scientific information. Inputs must be intelligently selected, and analysis and evaluation must also be expertly structured.

This high-throughput research methodology has been applied in numerous areas by Symyx and partners, including workflows for process optimization, electrochemistry, gas phase heterogeneous catalysis, and pigments, Goldwasser showed. He also laid out a map for enterprise-wide efforts to deliver step-change R&D execution, including integrating, linking, and visualizing R&D data from the lab to plants, and forming solid alliance structures (e.g., Symyx with Dow Chemical and ExxonMobil) with collaborative, strategic R&D programs that transfer best practices and know-how. Small incremental R&D projects are done rapidly in parallel with data analysis to select the most promising candidates. The key is process sequence integration rather than material science, so that thousands of small-scale experiments can be performed quickly and at low cost/experiment.

Goldwasser described several case studies highlighting four areas of improvement: new product development, controlling product costs, building volume with existing yield assets, and improving chemical processes by analyzing existing feedstocks. He cited work with Dow to squeeze higher value products from existing operations, which resulted in the commercial launch of a new product family of plastomers and elastomers. The two firms also paired to push through what he termed a “rapid” R&D cycle for a new line of specialty olefin copolymers.

Providing more specific numbers to back the case for a high-throughput (HTR) R&D model, Goldwasser cited optimization of a portfolio of 100 formulation products (4-6 components per formulation), where HTR shortened the project length from an “impractical” three years to six months, and generated 1%/year reduction of the total portfolio’s $300M cost of goods sold.

Finally, targeting a commodity chemical process, Goldwasser noted that a partner took 10 years to see just incremental improvements in raising yields for a core product, without reaching commercial performance targets — but incorporating HTR by working with Symyx met technical targets after hundreds of thousands of experiments, and achieved more progress in the first two years than in previous 15 years. — J.M.

by James Montgomery, News Editor, Solid-State Technology

Three key approaches have helped Dow Chemical launch nearly 20 products over the last decade, rethink how effective R&D is done, and generate significant improvements in cycle times. These factors include a molecular architecture approach, a focus on “speed-based development,” and adoption of high-throughput technology, noted Kurt Swogger, VP of PP&C business development, in his Wednesday presentation at the ConFab in Las Vegas, NV.

Back in the mid-90s, Dow’s vision for success was not to do interesting science, Swogger explained, but rather to convert interesting science into good science — and, of course, make more money. Faced with a projected next cyclical bottom in 1999-2000, and normal product launch times approaching a decade or more, Dow wanted to shift its focus to higher-volume, higher-value specialty products (with the goal of making these products 20% of the company’s 1991 volume).

To achieve this involved adopting several approaches. Swogger discussed the hierarchy of Dow’s Insite technology platform, a molecular architecture approach supported by “wisdom, luck, or outside Dow sources.” A key advance was the ability to model molecular kinetics, which could help define final properties as well as provide solid data for scaling up processes from the lab to large reactors. This multipronged Insite approach was used to launch 10 products from 1993-2001, and another eight products over the past five years, a range of materials and chemicals including plastomers/elastomers, adhesives, polymers, and fibers. For polyolefins property relationships are structured by building molecular models from many (500-600) subroutines. The goal depends on the properties needed. This is being expanded to epoxies, urethanes, and water-based products (cellulosics).

Another key to the Insight strategy is “speed-based development,” defined as a practical philosophy for quickly converting science and technology into value. This is a concept applicable to any product in any market, ranging from architecture to autos to semiconductors, Swogger noted. Think of it as a five-pronged star of “rights,” he explained — the right leadership overseeing the right people, on the right projects, with the right information, and right execution.

The right leadership means creating and selling a vision that delivers. Using the right people means, for example, a scientist/manager partnership to lead development, and using a flexible allocation of resources. Also, projects must be selected with an eye toward “net present value,” and link business strategy to individual results, involving marketing early in the process. The right information means using science, involving customers early and utilizing experts (internal, consultants, etc). Performance requirements should be used for application development, and should link to prior experience to help avoid mistakes, he said.

All these add up to execution, governed by Six-Sigma methodology, Swogger noted, adding that other keys include making and delivering commitments, emphasizing decision making, and using a parallel process.

Swogger also discussed “high-throughput” research, which he described as a system of hardware, informatics, workflows, and researchers. He explained how a “high-throughput” catalyst development has accelerated Dow’s discovery rate, citing work with Symyx as an example, which started with polyethylene catalyst development and then pursued polypropylene. This approach is now being transferred across the company for formulations, material science, and chemistry workflows, and even licenses for new devices.

Combining speed and molecular architecture, Dow has seen cycle times drop from years to months for new product lines and from 6-24 months to 2-3 months for product extensions. Further, 17 of 19 new products under these strategies have been deemed “successful,” with eight out of 10 successful product extensions instead of one out of three. — J.M.

The large-area printed photodetector array (Photo: Business Wire)

May 22, 2007 — NANOIDENT Technologies AG of Linz, Austria, says it has delivered the world’s largest printed semiconductor-based photodetector array on a flexible PET foil substrate. The array, which converts light into electrical signals, was developed with the NANOIDENT Semiconductor 2.0 platform and manufactured at the NANOIDENT Organic Fab (OFAB). NANOIDENT says its OEM partners can now realize application-specific, cost-effective, printed semiconductor-based photodetector arrays that eliminate the need for costly optical filters and can be used in a wide variety of new industrial, medical and security applications.

The NANOIDENT Semiconductor 2.0 platform serves as the core technology foundation for a range of application-specific printed semiconductor platforms and products. With its platform, NANOIDENT was able to manufacture a large-area photodetector array by depositing thin layers of conducting and semiconducting “inks” onto a plastic foil substrate using state-of-the-art printing techniques. By using printed semiconductor-based technology—which enables unique mechanical, electro-optical and structural properties—the company was able to deliver an array 18 x 12cm in size, and says it could easily produce detectors up to 50 x 50cm or larger. With large-area, ultra-thin, flexible devices that incorporate application specific spectral properties, customers are able to eliminate expensive optical filters and develop an entirely new class of application types. Sample applications for large-area photodetector arrays include industrial measurement and test, medical imaging and security screening.

“One of our industrial customers came to NANOIDENT requesting a radical new photodetector array design for a specific industrial application that could not be delivered with silicon,” said Klaus Schroeter, CEO of NANOIDENT. “Working together, we were able to deliver the industry’s first large-area array on a flexible substrate that includes specific spectral sensitivity and meets other application-specific requirements. We are excited to deliver this solution, which will transform existing test processes as well as create an entirely new application for the industrial market.”

NANOIDENT’s Semiconductor 2.0 platform is the core technology for all NANOIDENT vertical market platforms and is comprised of four core intellectual property (IP) elements, which include liquid conductive and semiconductive materials IP, design and simulation IP, production processes and quality assurance IP and functional component IP. The Semiconductor 2.0 platform enables the design and mass production of printed semiconductor-based functional components, such as photo detectors, light emitting diodes, transistors, resistors, capacitors and interconnects. With NANOIDENT’s new printed semiconductor production process, devices can also be manufactured in hours rather than weeks.

by Debra Vogler, Senior Technical Editor

Flash memory manufacturer Spansion is the outgrowth of the successful AMD/Fujitsu joint venture, so Spansion EVP & COO James Doran brought solid experience to bear on the topic explored at Monday’s ConFab session on how to manage successful manufacturing alliances. “Manufacturing alliances work best when each partner provides something the other partner needs, and both partners, together, benefit from the outcome,” Doran said, adding that the greater the degree of dependence each alliance partner has on the result of the alliance, the greater is the likelihood of success.

“None of the companies in an alliance will be successful unless all involved have ‘skin in the game,'” Doran explained. “I think the more you can evolve that over time — and reach a point where the relationship is open, there’s trust, people are contributing, and all realize they aren’t going to make it unless the alliance makes it — then you’ve got the key to a successful joint venture.”

Asked to comment on the tension between partners that can exist in the new process-lite/fab-lite world, where foundries tend to want captive customers and customers may lean toward having multiple sources, Doran pointed to the example of the joint venture (JV) between AMD and Fujitsu, that led to Spansion. (FASL LLC, formed in April 2003, replaced the two firms’ previous 50-50 JV, Fujitsu-AMD Semiconductor Ltd, and officially changed its corporate name to “Spansion LLC” in 2004 to leverage the name-branding of its memory devices.) One of the rules of engagement governing the Fujitsu-AMD manufacturing alliance for flash memory was that each company could only have their flash memory built within that alliance, explained Doran. “And frankly, I think that was one of the reasons it worked so well. We deliberately set it up so that we didn’t have any second source agreement,” he noted in an interview. — D.V.

FDA News
Consumer Inquiries: 888-INFO-FDA

Glycerin contaminated with diethylene glycol (DEG) remains a potential health hazard to consumers

May 7, 2007 — /FDA News/ — The U.S. Food and Drug Administration (FDA) is warning pharmaceutical manufacturers, suppliers, drug repackers, and health professionals who compound medications to be especially vigilant in assuring that glycerin, a sweetener commonly used worldwide in liquid over-the-counter and prescription drug products, is not contaminated with diethylene glycol (DEG). DEG is a known poison used in antifreeze and as a solvent. Today, the agency is issuing guidance to industry recommending methods of testing glycerin and other controls to identify any contamination with DEG before use in the manufacture or preparation of pharmaceutical products.

At the present time, FDA has no reason to believe that the U.S. supply of glycerin is contaminated with DEG, though the agency is cognizant of reports from other countries over the past several years in which DEG-contaminated glycerin has caused human deaths. FDA is emphasizing the importance of testing glycerin for DEG due to the serious nature of this potentially fatal problem in combination with the global nature of the pharmaceutical supply chain and problems that continue to occur with this kind of contamination in some parts of the global supply of glycerin.

DEG poisoning is an important public safety issue and FDA is exploring how supplies of glycerin become contaminated. In addition, FDA is working with a variety of manufacturing and pharmacist organizations to raise awareness of this risk and to put into place controls to ensure that this problem does not happen in the U.S. or elsewhere.

The most recent incident occurred in Panama in September 2006 and involved DEG-contaminated glycerin used in cough syrup, which resulted in dozens of hospitalizations for serious injury and more than 40 deaths. In late 1995 and early 1996, at least 80 children died in Haiti due to DEG-contaminated glycerin in acetaminophen syrup. Between 1990 and 1998, similar incidents of DEG poisoning reportedly occurred in Argentina, Bangladesh, India, and Nigeria and resulted in hundreds of deaths. In 1937, more than 100 people died in the United States after ingesting DEG-contaminated Elixir Sulfanilamide, a drug used to treat infections. This incident led to the enactment of the Federal Food, Drug, and Cosmetic Act, which is the nation’s primary statute on the regulation of drugs.

FDA reminds pharmaceutical manufacturers, compounders, repackers, and suppliers, as well as brokers and distributors, that all pharmaceutical manufacturing operations, including the re-packaging and re-labeling of ingredients like glycerin, must conform to current good manufacturing practice (CGMP). The guidance provides recommendations for complying with CGMP and is intended to help manufacturers, compounders, repackers, and suppliers avoid the use of glycerin that is contaminated with DEG and prevent incidents of DEG poisoning. For a copy of the guidance, go to http://www.fda.gov/cder/guidance/7654fnl.htm.

Investments to equip fabs will slow to just 3% growth this year, down from a 25% surge in 2006. Fab construction investments also are seen in the low single digits (4%-5%) this year — but both areas are expected to pick up again in 2008, according to a new report from SEMI.

Memory fab capacity will expand at double the rate of the rest of the industry this year (33% vs. 16%), with the industry’s top expanders led by Samsung and Hynix, as well as Intel and Micron. SEMI’s report also notes that 85% of all fab spending this year will go to 300mm activities, to increase 300mm capacity by 50% this year.

More than 30 major fab construction projects are taking place this year, soaking up $8 billion in investments ($10 billion for total construction by the end of 2008, when most of them will be online). Another 30 fabs will start volume production this year, with 16 fabs ramping in 1Q08-3Q08.

Geographically, spending is spread out fairly evenly. Taiwan and Japan each represent about 20% of all spending on equipping fabs, SEMI notes, while the US and South Korea make up about 18% each. Excluding Japan, the Asia-Pacific region is expected to account for more than half (53%) of fab equipment spending in 2007, surpassing $20 billion.

Within that A-P number is a big push from Singapore, where companies including Chartered, Qimonda, and the Tech Semiconductor and Intel/Micron JVs, will push domestic spending from $1.8 billion worth of equipment installations this year to about $3 billion in 2008.

The reports, including “FabFutures” and “Fab Capacity Report” as well as other related reports, were acquired earlier this year by SEMI from Strategic Marketing Associates.

May 15, 2007 — Multinational chemical giant BASF has announced the opening of a $2.6 million (S$4 million) R&D center for organic electronics in Singapore that will focus on nanotechnology and energy management, two important growth clusters for the company. The opening is part of BASF’s plan to expand global research activities and investments, especially in Asia Pacific.

The new center augments the April 2006 opening of BASF’s first nanotechnology research center in Asia, the Competence Center for Nanostructured Surfaces.

The total research expenditure for both centers between 2006 and 2009 is expected to be $19.8 million (S$30 million). BASF plans to hire a total of 40 employees for both research centers by end 2007.

BASF has embarked on a new project on organic photovoltaics with the Institute of Materials Research and Engineering (IMRE) in the center.

The organics electronics lab is a shared technology platform that cuts across BASF’s growth clusters energy management and nanotechnology. it will undertake research activities in the areas of printed electronics, OLEDs (organic light emitting diodes), organic biosensors and organic photovoltaics.

Palomar Microelectronics’ services include process development, prototyping, volume assembly, and test. (Photo: Palomar)

May 15, 2007 — Palomar Technologies, provider of precision automation equipment and process development for microelectronic assembly, now offers microelectronic packaging services through Palomar Microelectronics. This new segment of the company was inspired by growing demand for quick-turn product development, prototyping, test, and assembly services.

Palomar’s microelectronic assembly processes include advanced wire bonding, gold ball bumping, and precision component placement for semiconductor packages, high power LEDs, MEMS devices, microwave and RF components, optoelectronic packages, multichip modules, and hybrids.

Palomar Microelectronics will operate from Palomar’s headquarters in Carlsbad, California. Services include process development, prototyping, volume assembly, and test. Processes are developed by Palomar’s design, applications, and process engineers and validated on Palomar’s automated precision microelectronic assembly equipment. Once a process is refined and optimized, volume production is performed by Palomar Microelectronics.

“As an established manufacturer of capital equipment with thousands of systems operating in the field, Palomar is naturally positioned to support the scalable production of complex microelectronic devices at our own facility,” says company president Bruce Hueners.

May 14, 2007 – Cypress Semiconductor says it will sell its pseudo static random access memory (PSRAM) product line, including IP, photomasks, and probe card assets, to Taiwan’s Elite Semiconductor Memory Technology Inc. (ESMT) for an undisclosed amount.

“The divestiture of the PSRAM business is consistent with Cypress’s new strategic direction,” noted Ahmad Chatila, EVP of Cypress’s memory and imaging division, in a statement.

That new direction has led to a number of moves, notably a pullback from leading-edge chip development. In recent months, Cypress has sold its ownership in the Silicon Valley Technology Center to private equity investors, citing that its products no longer rely heavily upon leading-edge process technology such as the 65nm R&D center operates.

The company also has sold its automotive image sensor subsidiary to Sensata Technologies Inc., and announced it will begin using Taiwan foundry United Microelectronics Corp. (UMC) to produce its next-generation flagship SRAM products.

The Taiwan Economic News had earlier reported that ESMT, whose product lines include SRAM and NOR flash chips, was integrating its NOR flash chips with Cypress’ PSRAM chips for handset memory in a deal reportedly worth $15 million, and an Elite spokesperson told the paper that though he had no knowledge of that deal, Elite was eager to break into that market and chip away at the huge market dominated by Spansion and SST to support cell-phone makers.

“We believe that this transaction will not only boost ESMT’s revenue significantly, but that it will also enable the company to quickly cut into the supply chain of major cellular phone makers, since Cypress is one of the world’s top-tier PSRAM suppliers,” said Hsing-Hai Chen, ESMT chairman, in a statement.

With Cypress’ PRAM product additions, ESMT extends its lower-power SDRAM offerings (16, 32, 64, and 128-Mbit) for handhelds into lower-density memory products (2, 4, 8, 16, and 32-bit PSRARM). Chen noted that low-power memory chips are key components in mobile communications, a market that ESMT has been “aggressively pursuing” since it is a significant driver in consumer electronics.

May 11, 2007 — Endevco Corp., known for its vibration, shock, and pressure sensors, is now part of Meggitt PLC’s new Meggitt Sensing Systems (MSS) division. The division has been formed by merging the Meggitt Aerospace Systems and Meggitt Electronics groups into an entity that aligns some of the most notable sensor companies with related products, services, and applications.

With centers of excellence in France, Switzerland, Spain, the U.K., and the U.S., Meggitt Sensing Systems promises to deliver more sensing solutions into the aerospace, energy, medical, industrial, and automotive sectors. The new division will be led by Dr. Richard Greaves, a 30-year industry veteran and most recently the Managing Director of Meggitt Aerospace Systems.

Endevco, which specializes in advanced accelerometers, transducers, microphones, is celebrating its 60th anniversary in 2007.

Meggitt produces sensors for measuring virtually every physical parameter — acceleration, speed, pressure, force, temperature, distance, position, vibration and level – in a wide variety of applications. The company is investing substantially in MEMS.