Category Archives: LEDs

FEI CEO steps down


April 4, 2006

April 4, 2006 – FEI Co., Hillsboro, OR, said that its president and CEO Vahe Sarkissian has resigned, and will step down from his chairman/board position prior to the company’s annual shareholders meeting on May 11.

Raymond Link, currently CFO, will also act as interim CEO while a successor search is conducted. He joined the company in July 2005 from TriQuint Semiconductor Inc., where he was CRO and VP of finance and administration. No other executive leadership changes will be made.

“Vahe has led FEI to significant growth since he arrived at the company in 1998, and he has positioned the company as a leader in tools for growing nanotechnology markets,” said FEI lead board director William Lattin, in a statement. “With the company on track to renew its growth, now is the appropriate time for this transition. The board is looking forward to selecting a new leader to take advantage of the market and technology potential that we all see for FEI.”

With his departure, Sarkissian also receives more than $2.2 million in lump-sum payments for severance compensation, as well as accelerated stock options, according to SEC documents filed by the company. As of September 2005, he held 71,544 shares of company stock — which after his resignation was announced shot up nearly 12% to $22.09/share.

FEI has seen its stock slump in recent weeks, after the company reported a 4Q loss of $30.7 million, vs. a profit of $8.4 million a year ago, mostly in charges related to facilities closures, asset impairments, and investment writedowns. FEI also recently indicated it had terminated discussions of a possible acquisition by Carl Zeiss SMT, which it claims were initiated by the German firm.

April 3, 2006 – Veeco Instruments Inc. (Nasdaq: VECO), a supplier of epitaxial equipment used in the manufacture of high-brightness light emitting diodes, announced that it has been selected to join the Solid-State Lighting and Display Center (SSLDC) at the University of California, Santa Barbara (UCSB).

Headed by nitride researchers Shuji Nakamura, Steve DenBaars, James Speck and Umesh Mishra, the SSLDC’s mission is to develop novel materials and device technology for high efficiency solid-state lighting.

As a member company, Veeco will support research efforts in the development of new materials as well as new epitaxial growth methods for the advancement of solid-state lighting. Veeco will work in collaboration with UCSB faculty and student researchers, as well as other member companies, to address the challenges affecting the solid-state lighting industry. Since 2001 ten large solid-state lighting companies have joined SSLDC, including Veeco.

Delivering a Bright Future

BY SHATIL HAQUE, LUMILEDS LIGHTING

Power light-emitting diodes (LEDs) are beginning to deliver a bright future for solid-state lighting (SSL) in high-volume consumer markets. Though small compared to conventional lighting, by 2007 power LEDs are forecasted to become 19% of the fast-growing LED market.1 Achieving this growth will require increasing brightness and efficiency, and decreasing lifetime cost-per-lumen. Initial production and testing indicates that gold stud-bump flip chip assembly with thermosonic gold-to-gold interconnects (GGIs) will contribute to progress for power LEDs.

Providing the flash function for cell phone cameras is a challenging consumer opportunity for power LEDs. Though LEDs for liquid-crystal display (LCD) and keypad backlighting will see revenue fall >40% by 2009, high-power flash LEDs for cell phones that can produce good-quality photographs at a distance of >1 m are predicted to grow at a CAGR of 87% through 2009.2 In 2003, sales of cell phones with cameras exceeded the sales of digital-still cameras. This trend is expected to continue as high-resolution 3- to 5-megapixel (m) cell phone cameras with optical zoom and flash become common, and consumers replace digital-still cameras with cell phone cameras. Higher-resolution sensors, longer-distance photos taken by optical zoom, and fill-in flash usage all require higher light levels from the flash unit than xenon performance from a xenon flash. Today, the best available LED flash for camera phones produce illumination of 60 lux at 1 m with a 1-A (4-W) pulse. High-resolution cameras will require more than 30 lux at 2 to 3 m for good-quality photos in ambient, low-light conditions.3

One technique emerging from the lead-free quest is GGI, where gold stud bumps are connected to gold pads of the substrate/package/die using a thermo-compression – heat and pressure – or thermosonic attachment process.4 The thermo-compression, die-attach technique has been used for several years, especially for high-pin-count, LCD display-driver die attachment. However, with a cycle time of 10 to 12 seconds/die, thermo-compression bonding is a slow process, which can make high-speed thermosonic assembly of high-volume parts impractical. Thermo-compression die attach also requires temperatures higher than 300°C, which could be detrimental to sensitive chips and other packaging materials, such as plastics, laminates, and epoxies.

In recent years, by using GGI equipment, suppliers have increased bumping speeds, reducing thermosonic die-attach cycle times and improving manufacturing performance. Consequently, thermosonic GGI has found high-volume manufacturing applications such as SAW filters, hard disk drive heads, hearing aids, and RFID tags. However, those stud-bump applications are generally limited to low power, low currents, and low bump counts.

Increasing light output in a small space requires higher power and currents generating more light and heat. Current solder-bump flip chip is a poor electrical and thermal conductor. Proposed lead-free solder alloys are worse thermal conductors than lead solders. Gold is a better choice for an electrical and thermal conductor. Gold stud bumps may also be shaped to a flatter profile than solder bumps, shortening the thermal path and providing a thinner product. Figure 1 shows a photoflash unit* that is only 1-mm high, with a 2.0 × 1.6-mm footprint, and generates typically 60 lux at 1 m under a 1-A (4-W) pulse drive.


Figure 1. Photo flash unit with LED and protective diode GGI-mounted on ceramic substrate.
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While gold stud bumps meet the required physical characteristics, their value is limited unless the related manufacturing process for the specific product can support low-cost, high-volume production of reliable products. GGI packaging offers several manufacturing advantages over conventional-solder flip chip packaging.

Gold-based interconnection offers a shorter and simpler process flow than existing solder-based flip chip processes for high-power LEDs. A typical, solder-based flip chip application includes flux application before flipping the die for a high-temperature reflow. Flux requires carefully controlled application, and flux residues may require cleaning so that they will not contaminate optical surfaces. The GGI process offers flux-free assembly.

Stud bumping and thermosonic connection require processing temperatures of 150 to 160°C, which are below solder-bump reflow temperatures of 220 to 230°C. A low-temperature bumping process allows a wider selection of other packaging materials associated with package fabrication.

Proposed lead-free alloys have higher reflow temperatures than eutectic lead-tin.

Most LED packages are based on clear epoxy that cannot withstand the higher temperatures required by lead-free solders. Maintaining the present packaging system is a cost-advantage of gold bumps that avoids the materials selection challenges, manufacturability concerns, and reliability aspects of developing new LED packaging to accommodate proposed lead-free alloys.

The high thermal conductivity of gold interconnects allow higher temperature operation than conventional LED packaging. The maximum allowable junction temperature of an LED, which determines light output, will no longer be limited by the device interconnects.

Cost and Throughput

Because stud bumping is a serial process, costs depend on bumping speed and the number of bumps-per-wafer. Stud-bump bonder manufacturers have improved bumping speed and accuracy, and several offer high-speed stud bumpers that can place 20 to 30 bps. These new-generation, stud-bump bonders can run continuously in manufacturing environments, while providing accurate bump placements (±3.5 µm at ±3 σ) with controlled bump height variation (±3 µm at ±3 σ for flat bumps).


Figure 2. Cost comparison of stud bumping to other wafer-bumping methods. Courtesy of Kulicke & Soffa.
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This combination of high-speed operation and high process yield reduces the cost of stud bumping in high-volume applications. Equipment manufacturers can provide cost analysis models taking into account machine depreciation, floor space, overhead cost, and machine use. The resulting cost-of-ownership model is developed around a customer’s specific application. Figure 2 shows an example cost-comparison model of different bumping methods. Depending on number of bumps-per-wafer, bump height, and number of wafers being bumped, stud bumping can be a low-cost option.

Bumping Process Controls

Close process control of some key stud bump parameters is critical for manufacturing success and includes bump size and shape, bump placement accuracy, and bump shear strength. Similarly, stringent controls are required in assembly.

Bump Size and Shape: Bump dimensions are programmable to fit design needs. The bump layout, and size and shape test criteria are typically determined by the substrate and die-pad layout. Simple thermal modeling insures that bump designs meet required thermal-management criteria. Bump size and shape criteria include acceptable ranges of bump diameter, ball height, and bump height. Wire-tail height and curve angle might also be specified. Size and shape monitoring requires a well-designed sample plan for reliable optical inspection. Optical scanning is fast, typically accurate within ±1 µm, and can measure heights of bump arrays at several bump levels.

Figure 3 shows an optical scan of a single stud bump’s horizontal diameter, ball height to the shoulder, and overall bump height to the tip. Repeated scans of many bumps provide critical dimensions for process control calculation.


Figure 3. Stud bump size and height scan for inspection.
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Bump Placement Accuracy: Unlike solder bumps, stud bumps are not self-centering, so initial placement accuracy is critical. Monitoring bump placement accuracy maintains electrical performance and yield. Substrate metallization problems, such as pattern run-off and improper fiducial metallization, cause pattern-recognition failures, leading to off-set bumps.

Bump Shear: The robustness of a stud-bump connection is determined by the quality of gold diffusion between the gold bump and substrate. However, bump shear data alone does not guarantee successful bumping. Visual inspection of the shear mode is critical, and the sheared-bump interface must show signs of gold diffusion. Little or no trace of diffusion indicates a poor joint, which may lead to reliability failures.

Thermo-mechanical Stress Testing

Consumer applications for high power LEDs require components to pass the list of reliability stress tests shown in Table 1 without failures. The user environment also adds special testing including mechanical shock, vibration, and surviving a drop to a concrete floor. The thermal, thermo-mechanical, and cross-section test results establish that gold stud bumps provide reliable joints between the LED and the substrate.


Table 1. Reliability tests.
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Conclusion

Gold stud bumps provide a packaging solution for high-power LEDs, meeting a previously unachievable combination of requirements: 100% lead-free packaging; pulsed, high-power, and continuous operation at high LED junction temperature; and SMT assembly compatibility to withstand 3 reflows at lead-free solder temperatures.

*Lumileds GGI Photoflash Unit

Acknowledgements

The author would like to thank his colleagues at Lumileds Lighting for their contributions to this article.

References

  1. “High Brightness LED Market Review and Forecast,“ Strategies Unlimited, Report OM-26, July 2003.
  2. “Report: LED revenue to fall 41% by 2009,” EE Times, 2005/12/05.
  3. Packaging of High-power LEDs Using Au Stud Bump Interconnects,” S. Haque, M. Ng, G. Abrahamse, F. Wall, S. Rudaz, P. Martin, SMTA 2005 Emerging Technologies, September 2005.
  4. L. K. Cheah et al., “Gold to Gold Thermosonic Flip Chip Bonding,” Proc. HDI 2001, pp. 165 – 175, April 2001.

SHATIL HAQUE, Ph. D., manager, die-assembly competence group, may be contacted at Philips Lumileds Lighting Malaysia, Lebuh Kampung Jawa, Bayan Lepas FIZ-3 11900 Penang, Malaysia; 60/4-616-3262; E-mail: [email protected].

An AOI Approach

BY GEORGE T. AYOUB, MACHINE VISION PRODUCTS INC.

Wire bond technology will continue to prosper in many sectors of the electronics packaging industry well into the foreseeable future. Major trends in this industry over the years have included a continuous increase in the number of interconnections, circuit miniaturization, industry emphasis on speed of assembly, and cost reduction per interconnection. Wire-bond machines have kept up with these trends, and are sophisticated, reliable, fast, and accurate. However, wire-bond inspection lacks the means to automate inspection and ensure the integrity of wire-bond interconnections, which directly impact the quality of the end product. As the number of interconnections increases, the opportunity to produce a defective component multiplies. Because wire bonding takes place at the end of production, the cost of a bad interconnection is high relative to a defect that can be detected and corrected at the beginning of the process. Therefore, a bad interconnection is a risk that impacts cost and quality of the product.

Currently, most inspection methods for wire bond are manual, and use visual check with a microscope, contact inspection, or semi-automated inspection assisted by an optical or X-ray imaging sensor. These inspection methods are slow, labor-intensive, and costly. Because of these limitations, they are often used to test the product on a sample basis. Manual methods – both visual and those assisted by a sensor – are far from perfect and suffer from the inherent variability of human inspection. Due to the lack of automated measurements, they are subjective and dependent on the operator. Contact inspection tests the security of the wire bond by means of physical contact. This method is slow and risks physical damage due to contact or potential electrostatic damage. All these methods are limited to wire-bond inspection, which is another drawback. Inspection tool capabilities should encompass measurement of die placement and inspect for solder joint quality of other components in the vicinity of the wire bonds. There is an urgent need today for an efficient and reliable method of inspection that is effective, safe, dependable, measurement-driven, capable of inspecting all wire-bond failure modes, versatile enough to include measurement and inspection of other electronic components, and fast enough to keep up with the production while inspecting 100% of the products.

Parallel to development in the packaging industry, rule-based automated optical inspection (AOI) has emerged as an effective inspection and measurement method for all process steps in PCB assembly. AOI has become a proven, reliable tool for inspecting solder paste, component placement, and solder joint inspection, and has been widely used to improve quality and reduce assembly costs. Notable advances in AOI have been driven by advances in camera technology and by the availability of fast and economical computing platforms. Today’s AOI uses fast, sensitive camera sensors and a multitude of programmable LED illuminators powered by sophisticated algorithms for inspection and measurements, and are able to meet requirements for 100% inspection at production line speed. This has resulted in increased defect coverage, higher inspection speed, and lower false accepts and rejects. The programming aspects of this technology have also become easier over the years, contributing significantly to its widespread use. The question naturally arises: can AOI technology provide a basis to meet the stiff demands for post-wire-bond inspection?

The answer to this question is “yes.” In the past, the AOI industry fell short of meeting the requirements presented by post-wire-bond inspection. Until recently, there was no universal equipment capable of meeting all these requirements. Now, a tool has been introduced that provides a useful solution for many aspects of post-wire-bond inspection.

The ability to extract the wire from the complex varying background between die and pad is an important aspect of post-wire-bond inspection. Accomplishing this task requires smart illumination and inspection algorithms to work together, increasing the signal-to-noise ratio between the wire and its surroundings. The inspection tool uses a large color camera sensor and custom-built, programmable colored LED illuminators at different angles, with respect to the wire bond. The wire’s metallic surface reflects the light and can appear black or white with respect to the background, depending on the height of the illuminator angle. The key to increasing the signal-to-noise ratio is to use all the angles of light to better extract the wire from the background. This task is accomplished with proprietary sophisticated algorithms that work hand-in-hand with the illuminator. The algorithm checks if the wire is registered in the right region on the die and pad. Then, it assesses the quality of the connection with the die and pad, and checks for scratches in these regions. Next, the wire is traced and examined for continuity, straightness, and maximum deviation from a straight-fitted line. The loop height is checked to verify that it conforms to a given tolerance by the wire reflection at different lighting illumination angles. All the algorithms use digital filters in a sequential manner to extract features and examine signatures using measurements at each step.

Die translation and rotation with respect to its ideal position is measured in sub-pixel accuracy using many windows around the edges to minimize errors. Registration of the die relies on the stage accuracy, as well as accurate fiducial and CAD information. The tool is also able to measure the position of other components in the circuit, and ascertain the quality of the solder joints, flagging any defects.

The large format sensor and the proprietary frame grabber allows images to be captured “on the fly” while the camera is moving, meeting resolution and speed requirements. The field-of-view is small to ensure an adequate number of pixels on target. Moreover, the system is equipped with an illuminator to ensure image quality and depth of focus. The illumination and algorithm approach is the same for thin and thick wires; however, the resolution of the camera, measured in µm/pixel, is different in each case to optimize speed of inspection (Figures 1 and 2).


Figures 1 and 2. Both thin (Figure 1, above) and thick (Figure 2, below) wires can be inspected with a simple change in camera resolution. Because the camera resolution is measured in µm/pixel, optimizing the overall inspection speed is different in each case.
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The tool goes beyond the detection of pass/fail defects, and assists in enhancing yield through statistical process control (SPC) techniques on both attribute and measured variables. The SPC package is an integral part of the tool and tracks any measurement in real time, allowing the operator to take control actions if limits exceed normal expectancy. Preventing defects is critical in keeping the process under control. Depending on the alarm setting, the system is able to stop the line and turn on a yellow or red light for visual feedback to the operator.


Figure 3. A high-precision AOI machine.
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Preliminary results show the tool’s capability to trace wires with thicknesses varying between 0.5 to 10 mils, with success against complex backgrounds. The numbers reported for measurement accuracy and repeatability show that die translation can be measured accurately to <10 µm at three standard deviations, and its rotation to <0.05°.

This innovation is a first attempt to meet the challenge of post-wire-bond inspection. Future work will continue to enhance the signal to noise ratio, to extend the defect coverage for post-wire-bond to multiple layers, and to increase the speed of inspection.

GEORGE T. AYOUB, Ph.D., president and CEO, may be contacted at Machine Vision Products Inc., 5940 Darwin Ct., Carlsbad, CA 92008; 760/438-1138; E-mail: [email protected].

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Mar. 22, 2006 – As MEMS-based products make their way into the consumer electronics market, one promising application is a device a reviewer dubbed the “remote control bagel.”

Hillcrest Labs, a startup from Rockville, Md., generated considerable buzz at the January Consumer Electronics Show in Las Vegas with its “Loop” air mouse for televisions. It holds out the promise of replacing clunky 50-button remote controls with a device that has just two buttons and a scroll bar.

But the MEMS-based free-space pointing device is only part of Hillcrest’s offering. The company also has created an on-screen navigation system that abandons the TV Guide-style grid for zoomable visual directories. For instance, users can choose videos from a full-screen mosaic of movie covers. This system, “Spontaneous Navigation,” is key to handling the growing number of media offerings, according to Andy Addis, Hillcrest’s executive vice president and a former Comcast executive.

“People translate visual information 60 times faster than textual information. As the number of offerings grows, presenting things visually offers greater scalability,” he said. “With a grid-based guide, if you have 20,000 media choices, that’s 4,000 page-down pushes on your remote. It just doesn’t work.”

Addis stressed that the Loop and navigation system go hand in hand. “When the mouse was invented, there wasn’t really any application until Apple developed the graphical user interface,” he noted. “It was a pointing device with nothing to point at.” The Loop itself would be the same today without the navigation system, he said. “We think we’ve developed the mouse and Windows for your TV.”

Founded in 2001 and backed by more than $30 million in venture capital, Hillcrest at first focused on the pointing device. Founder and Chief Executive Dan Simpkins had previously led SALIX Technologies, a developer of voice switches that was acquired by Tellabs in 2000. In developing ideas for the Loop, Simpkins and a team of Hillcrest engineers “studied every input device known to man,” Addis said.

He said one-third of the company’s patent filings are related to the Loop itself, which has sophisticated digital signal processing technology built in. Unlike the Gyration Air Mouse, he stressed, the pointer technology is not based on a gyroscope. Addis was reluctant to talk about the inner workings of the Loop or the MEMS component. “Suffice it to say that we leverage multiple low-cost sensors,” he said.

Hillcrest has succeeded at generating a wow factor among consumers and industry analysts, but getting its innovation deployed in a challenging market for startups will be more difficult. As Forrester Research analyst Josh Bernoff wrote last May, although the system looks promising, it has yet to be used anywhere. “It’s still enabling technology that must be built into set-top boxes or consumer electronics devices.”

Hillcrest is talking to companies in the consumer electronics, PC, telecommunications, satellite and cable markets. Addis said its first deals, to be announced later this year, would likely be with consumer electronics companies because that market moves the fastest. The technology may appear first in products such as digital video recorders and game consoles. The cable and telecom companies will be the toughest sell, he admitted.

“The trick is they are trying to sell into companies that do not do revolutions,” said Danny Briere, CEO of telecommunications consulting firm TeleChoice, in Mansfield Center, Conn. “The cable companies are protecting a bunch of paradigms that Hillcrest is blowing away. With Hillcrest’s product, you pick it up and instantly know how to use it. You don’t have to learn how to use it or remember how to use it.

“It’s just a matter of time before the cable companies come around to graphical menus and pointing devices, Briere said. “The cable companies realize that to generate more revenue, they have to become a portal to other media, gaming, and e-commerce, and they run up against a wall really fast in the two-dimensional environment.”

Briere, whose clients include large phone companies, said all the major players are interested in Hillcrest. “It’s a huge competitive advantage for whoever partners with them first. The migration path to this will be insane.”

Forrester’s Bernoff predicted that new navigation products like Hillcrest’s are likely to change the face of TV by 2008.

By Candace Stuart

Mar. 17, 2006 – Vicki Colvin has a question for colleagues who study nanoparticles and how they may affect people and the environment. “Exactly what do you mean by size?”

When chemists, toxicologists or other researchers report the dimensions of an engineered nanoparticle, are they measuring the core, the core plus a coating, or perhaps the core, a coating and attachments that help nanoparticles adhere to cells? What happens after exposure to water, or to blood?

“We want to know how particle size changes as it marches through the body,” Colvin said at a workshop designed to identify roadblocks to nanobiotech commercialization. Size, composition, shape and other characteristics help distinguish the scores of different engineered nanoparticles that exist today. They also help determine their wanted — and unwanted — properties. “Can I take a material that is active (potentially harmful) and make it safe?” she asked. “How can I engineer a safe nanoparticle?”

Colvin, a chemistry and chemical engineering professor and director of the Center for Biological and Environmental Nanotechnology at Rice University, is not alone in her quest. The federal agencies that may decide to impose environmental, health and workplace regulations on industry face a mishmash of toxicological data that often lacks basic information about nanoparticle size, surface area and other characteristics.

Toxicologists and other scientists studying nanomaterials say these gaps make it difficult if not impossible to compare studies and get an accurate picture of how nanoparticles interact with the body.

Reporting basics like size will go a long way toward ensuring that regulations are based on sound rather than spotty science, they say. Scientists will be able to see the relationships between a nanoparticle’s size or surface area or charge, for instance, and how it behaves in the body to predict which traits could be harmful. That knowledge may help them design benign nanoparticles.

“It was kind of where dioxins and PCBs were in the ’60s,” said Nigel Walker, a staff scientist with the National Toxicology Program (NTP) of his initiation into nanotechnology about three years ago. NTP, part of the National Institutes of Health’s environmental sciences division, has launched a program to evaluate potential health hazards of nanomaterials. Dioxins, a byproduct of combustion processes, and polychlorinated biphenyls, an industrial chemical, were found to be cancer-causing pollutants that required costly cleanups once their toxicity was discovered.

“We introduced a technology without understanding the implications and then spent 30 years trying to eliminate or reduce the risk,” Walker said. He recognized that with nanotechnology he and other scientists had an opportunity to spot troublesome nanoparticles early in the commercial process, before they cause damage. “Now we can make sure we can prevent that. We can choose the kinds of experiments that reduce the risk. We can be at the forefront.”

Their size makes nanoparticles promising candidates for medical applications. They are small enough to fit within cells and also can roam undetected by biological sentries such as the blood-brain barrier or the liver, according to Scott McNeil, director of the National Cancer Institute’s Nanotechnology Characterization Laboratory. As coordinator of pre-clinical characterization of nanomaterials, McNeil is helping the NCI in its goal of developing nano-based therapies and diagnostics for cancer.

His team has already begun tests on gold nanoparticles, liposomes, dendrimers and buckyballs. Each nanoparticle offers benefits: Branch-shaped dendrimers and spherical liposomes can transport drugs into cells. Contrast agents can be put in the hollow centers of buckyballs for tumor imaging. Gold particles known as nanoshells can attach to cancer cells, and when exposed to harmless near ultraviolet light, heat up and kill the cells.

“These can leach into tumors because they are smaller than the pores of the blood vessel wall,” McNeil said. Nanoparticles are also smaller than the filter mechanisms in the spleen and liver that capture and eliminate other foreign matter. That leaves nanoparticles free to circulate until they find their cancer target.

Nanoparticles pose a risk, though, if they are or become toxic and the body’s defense systems can’t detect and eliminate them, McNeil and Walker pointed out. For medical applications — where tissue is deliberately exposed to nanoparticles — it is critical to understand how cells react to the presence of various types and forms of nanoparticles during various stages of exposure. Unintended exposure through the skin, lungs and other pathways also needs to be considered.

“Size will be a critical component for toxicology,” Walker said. Studies on ultrafine particles, which are typically a byproduct of combustion, suggest a link between particle size and toxicity, for instance. “But size is contextual. How do you report size? What kind of methodology do you use? What is the tool?”

The Nanotechnology Characterization Laboratory is collaborating with the Food and Drug Administration and the National Institute of Standards and Technology to find methods for analyzing nanomaterials in various stages: before exposure to any biological environment, exposure in test tubes and other in vitro environments, and exposure within living organisms, or in vivo environments. They accept applications for materials from manufacturers on a quarterly basis, but will only take materials that can be produced in sufficient quantities.

“We don’t accept material for characterization unless they can produce a gram of material. We don’t want to have multiple industrial batches,” McNeil said. Batches can vary in purity, for instance. “We want to make sure we have the same stuff in the lab as in the animal.”

McNeil’s team follows a methodical system to plot the physical attributes of each type of nanoparticle. But nanoparticles rarely are used in their natural, or “naked,” form. Many nanomaterials that function in the dry world of chemistry need to be “dressed” to work in the wet world of biology. They also often have antibodies or other biomolecules attached to their surface that complement molecules on a cancer cell’s surface. The attachments help the nanoparticles latch onto target tumor cells.

“We attempt to have a baseline characterization so we can have some familiarity with that category of nanoparticle,” McNeil said. Each time it is dressed, or functionalized, it is studied again. “Each one would be unique in its behavior. Functionalizing it changes its properties.”

Designers can use the ability to alter properties in their favor. A nanoparticle’s surface charge can make it less biocompatible, for instance. Adding a coating that neutralizes charge may solve the problem, though. In what McNeil characterizes as a possible trend, his team noticed naked gold nanoparticles get larger when placed in plasma. To better understand gold nanoparticles’ blood-contact properties, they plan to add molecules that could stop proteins from absorbing on the surface. That also may be a way to keep the gold nanoparticles from growing larger.

The National Toxicology Program is studying buckyballs and carbon nanotubes, semiconductor nanocrystals called quantum dots and metal oxides such as the sunscreen ingredient titanium dioxide. It is developing a program based on dendrimers, too. NTP, which agreed to take on the initiative at Colvin’s request, allocated between $1.5 million and $2 million in the past year for the program, Walker said.

Walker said the NTP is more or less starting from scratch after scouring the toxicology literature and finding it lacking. But accurately measuring nanoparticles in their various states may prove difficult. Microscopy tools for measuring an electron-dense nanoparticle may not be as suitable for gauging less electron-dense coatings or attachments. Tools using probes may compress flexible structures.

Craig Prater, a fellow at Veeco Instruments who has been integral in the commercialization of several of its microscopy products, said today’s tools can adequately measure nanoparticle size, even in the wet world of biology. Prater helped launch Veeco’s nanobio atomic force microscope, the BioScope. The BioScope II, introduced in December, can be used to image molecules within living cells.

He’s also involved in a project with Dow Chemical Co. to develop ways to better understand nanoparticles’ structure-function relationships. The goal of the Veeco-Dow partnership is to provide a predictive mechanism that will allow manufacturers to efficiently design nanoparticles that perform exactly as desired.

“If we can understand the structure-function and surface chemistry connection to toxicity, that will help us accelerate the design of consistently safe nanoparticles,” Prater said. “All of the chemical companies and scientists take that responsibility seriously.”

But reliable predictions depend on sound data, and scientists like Walker, McNeil and Colvin warn that, for the most part, good fundamental information is not available now. The haphazard reporting of basic characteristics like size threatens to hamper commercialization. “We need to do a better job of describing material,” Walker said. “This will be a roadblock.”

In an effort to get consistency in nanoparticle reporting, Walker contacted funding agencies and editors of key scientific journals and asked that grants or acceptance of a paper be contingent on reporting basic information such as size and methodology. Colvin has been prodding the academic research community to agree to some accepted norms. McNeil hopes to develop voluntary standards for industries and toxicologists based on a consensus process. It’s the chance to avoid another dioxin or PCB incident.

“If we could provide the structure-activity tools,” Walker said, “then we could say (to nanoparticle designers), ‘You really don’t want to go there with this one.’ They could make an informed decision. The further we can get to providing that assessment upfront, the better it will be for everybody.”

(March 13, 2006) Munich, Germany &#8212 SUSS MicroTec and Instrument Systems have formed a strategic partnership to develop a next-generation, high-throughput test system for LED devices at wafer-level that tests up to 70,000 LED dies per hour.

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Mar. 10, 2006 – The Safer Nano 2006 symposium held in Beaverton, Ore., on Monday and Tuesday looked at best practices and regulatory activities being developed to ensure “Nano for a Safer World.”

The Oregon locale was a logical choice, a state whose green credentials are impeccable as the home of environmental activism, the nation’s first bottle bill, and state laws requiring reforestation and salmon restoration projects.

“This is a unique meeting in the country,” said Skip Rung, executive director of Oregon Nanoscience and Microtechnologies Institute (ONAMI), which sponsored the event along with FEI Co., Oregon Health & Science University’s OGI School of Science and Engineering, and Kennedy/Jenks Consultants.

The latest state environmental initiative is ONAMI’s Safer Nanomaterials and Nanomanufacturing Initiative (SNNI), led by University of Oregon’s Jim Hutchison. Oregon academics are aiming to get a head-start on developing a niche for their nanotech funding.

Hutchison and Peter Mirau and Rajesh Naik, of the Air Force Research Lab in Ohio, said their goals are to enhance integration of SNNI activities and identify and explore areas of mutual interest between the two efforts.

“One of the things the Air Force does is put things into the air,” Mirau noted. Nanocomposites and interfaces can help reduce weights of materials, though researchers are still in the fundamental research stage.

Hutchison’s green approach is to test properties of various nanoparticles, then take that information and feed it back into product design repeatedly, while watching out for waste, toxicity and other environmental hazards.

Barbara Karn, currently at the Wilson International Center for Scholars during a sabbatical from her position at the U.S. Environmental Protection Agency, and Sean Murdock, executive director of the NanoBusiness Alliance, described problems and principles of green nano.

“Today we are attempting to look at risks proactively,” said Karn, a chemist and marine ecologist. She advised workers in nanotech to consider risk, both real and perceived; governance of risk; effects of nanotech research on the environment; and ways to prevent harm.

Governance of risk is a regulatory matter, she said, requiring careful definitions, measurements and even names for the new nanomaterials. Are they chemicals, or products? Who does the regulating? What is new? What standards should be adopted? Are they harmful or beneficial?

Questions that need to be addressed include, how do you characterize risk? Under the 30-year old Toxic Substances Control Act (TSCA), the EPA tracks more than 75,000 industrial chemicals, Karn said, although not all are toxic.

Karn is concentrating on a green nanotechnology framework, looking for products that don’t hurt the environment and ones that can help it in areas like remediation, energy conservation and waste reduction.

The EPA began to devise a plan for dealing with existing or future problems associated with nanotech six years ago. They have looked at green energy and manufacturing, toxicology, life cycle aspects, and biological actions, such as accumulation and availability.

EPA screens pre-manufacturing notices required under the TSCA, which has exemptions for very small volumes of materials. This applies to nanomaterials. “The EPA is trying to get around this, so they can look at nanomaterials, too,” she said.

Regulators want to establish a voluntary program for corporations that don’t fall under TSCA. “This can help EPA conduct a risk assessment and develop a permanent and mandatory program,” Karn said. “Nobody knows enough to do this yet.”

The alternative isn’t pleasant. Some alarmists are suggesting banning nanomaterials, others are asking for labeling regulations.

Work on environment, health and safety (EHS) issues has been done at the federal level, chiefly during a Congressional subcommittee hearing on the topic, but most state level nanotech projects aren’t singling out these issues for special attention.

Chief among EHS problems that need to be solved on the local research and industrial level are hundreds of unanswered questions relating to new nanoparticles and materials, a point made by speaker after speaker during the symposium. A second issue for the field is that two different approaches are being proposed, Rung said.

He noted that some critics advocate new laws and regulations, because they say nanoparticles are different from other materials. However, he and others believe current regulations are flexible enough to cover nanotechnology impacts.

Concentrating on safety and health provides opportunities to lower materials used in various processes, the NanoBusiness Alliance’ Sean Murdock said.

“Using nanomaterials to impart new properties to materials is not new, but the ability to control those properties by controlling the composition, size and spacing of nanoparticles is new.” He noted that the EPA is the most likely nanotech regulator, though OSHA rules protect workers and FDA protects consumers.

“This meeting is a telling example of how things are different” today from the past, he said, allaying fears that nanoparticles could be the next asbestos or genetically modified organisms. “The apparatus is already in place, although we lack resources and data” to devise specific regulations.

March 9, 2006 – Süss MicroTec and Instrument Systems say they’ve developed a new high-throughput test system for LED devices at wafer level that can handle up to 70,000 LED dies/hour, to help prevent the costly mistake of packaging bad devices.

The semiautomatic system (upgradeable to fully automatic in the field) will integrate Süss’ BlueRay probe system with Instrument Systems’ high-precision optical measurement equipment. A prototype is being shown at Semicon China later this month.

Startup expects to sign deals for Loop, navigation system

By David Raths

As MEMS-based products make their way into the consumer electronics market, one promising application is a device a reviewer dubbed the “remote control bagel.”

Hillcrest Labs, a startup from Rockville, Md., generated considerable buzz at the January Consumer Electronics Show in Las Vegas with its “Loop” air mouse for televisions. It holds out the promise of replacing clunky 50-button remote controls with a device that has just two buttons and a scroll bar.

But the MEMS-based free-space pointing device is only part of Hillcrest’s offering. The company also has created an on-screen navigation system that abandons the TV Guide-style grid for zoomable visual directories. For instance, users can choose videos from a full-screen mosaic of movie covers. This system, “Spontaneous Navigation,” is key to handling the growing number of media offerings, according to Andy Addis, Hillcrest’s executive vice president and a former Comcast executive.

“People translate visual information 60 times faster than textual information. As the number of offerings grows, presenting things visually offers greater scalability,” he said. “With a grid-based guide, if you have 20,000 media choices, that’s 4,000 page-down pushes on your remote. It just doesn’t work.”

Addis stressed that the Loop and navigation system go hand in hand. “When the mouse was invented, there wasn’t really any application until Apple developed the graphical user interface,” he noted. “It was a pointing device with nothing to point at.” The Loop itself would be the same today without the navigation system, he said. “We think we’ve developed the mouse and Windows for your TV.”


The Loop, a pointer-based remote control, uses two buttons and a scroll bar for navigating TV options. Photo courtesy of Hillcrest Labs
Click here to enlarge image

Founded in 2001 and backed by more than $30 million in venture capital, Hillcrest at first focused on the pointing device. Founder and Chief Executive Dan Simpkins had previously led SALIX Technologies, a developer of voice switches that was acquired by Tellabs in 2000. In developing ideas for the Loop, Simpkins and a team of Hillcrest engineers “studied every input device known to man,” Addis said.

He said one-third of the company’s patent filings are related to the Loop itself, which has sophisticated digital signal processing technology built in. Unlike the Gyration Air Mouse, he stressed, the pointer technology is not based on a gyroscope. Addis was reluctant to talk about the inner workings of the Loop or the MEMS component. “Suffice it to say that we leverage multiple low-cost sensors,” he said.

Hillcrest has succeeded at generating a wow factor among consumers and industry analysts, but getting its innovation deployed in a challenging market for startups will be more difficult. As Forrester Research analyst Josh Bernoff wrote last May, although the system looks promising, it has yet to be used anywhere. “It’s still enabling technology that must be built into set-top boxes or consumer electronics devices.”

Hillcrest is talking to companies in the consumer electronics, PC, telecommunications, satellite and cable markets. Addis said its first deals, to be announced later this year, would likely be with consumer electronics companies because that market moves the fastest. The technology may appear first in products such as digital video recorders and game consoles. The cable and telecom companies will be the toughest sell, he admitted.

“The trick is they are trying to sell into companies that do not do revolutions,” said Danny Briere, CEO of telecommunications consulting firm TeleChoice, in Mansfield Center, Conn. “The cable companies are protecting a bunch of paradigms that Hillcrest is blowing away. With Hillcrest’s product, you pick it up and instantly know how to use it. You don’t have to learn how to use it or remember how to use it.”

It’s just a matter of time before the cable companies come around to graphical menus and pointing devices, Briere said. “The cable companies realize that to generate more revenue, they have to become a portal to other media, gaming, and e-commerce, and they run up against a wall really fast in the two-dimensional environment.”

Briere, whose clients include large phone companies, said all the major players are interested in Hillcrest. “It’s a huge competitive advantage for whoever partners with them first. The migration path to this will be insane.”

Forrester’s Bernoff predicted that new navigation products like Hillcrest’s are likely to change the face of TV by 2008.