Category Archives: LEDs

Mar. 10, 2008 – WiSpry, a developer of programmable radio frequency (RF) semiconductor products, says it has tacked on another $7M to its Series B round of funding, for a total of $18M raised in the round. The funds will be used to transition from technology development into product qualification, the company noted in a statement.

Current company investors American River Ventures, Blueprint Ventures, and L-Capital Partners led the round, with existing investors Hotung Capital Management, In-Q-Tel, and Shepherd Ventures, and participation from new investors DoCoMo Capital and Arkian, WiSpry’s Korean sales representative. Other potential investors are still completing diligence and could be added to the Series B round in the next 60 days, the company noted.

“With the continuing growth in complexity of consumer-based wireless terminals the demand for digitally programmable RF continues to grow,” stated Russ Garcia, WiSpry president and CEO. “The capability we are bringing to market with the tunable digital capacitor enables product solutions that significantly enhance performance in a cost effective manner, thereby bringing substantial value to both carriers and handset manufacturers.”

“We believe that WiSpry’s tunable RF product technology will be revolutionary for the wireless market place and will enable a new generation of mobile devices with better power efficiency, smaller form factor and superior RF performance that are able to seamlessly support multiple mobile communication standards and worldwide frequency bands,” added Nobuyuki Akimoto, president and CEO of DoCoMo Capital.

Mar. 3, 2008 – Qcept Technologies, an Atlanta, GA-based developer of surface inspection systems for semiconductor manufacturing, has raised another $9.5M in a Series C round of funding, led by previous investors (Siemens Venture Capital, along with Pittco Capital Management and others), bringing the overall total financing raised to roughly $25M.

The new funds will be used to support expansion of operations, “to speed delivery of our ChemetriQ inspection solutions to help customers with their growing NVD-related yield issues,” said David Lam, chairman of Qcept, in a statement.

Qcept, a participant in the 2005 SEMICON West Technology Innovation Showcase, says it now has multiple systems at customer fabs for process development and pilot and volume production. Its technology uses electrical field gradients or contact potential differences between the probe and the surface as it scans across the wafer, detecting the different work functions of the different materials on the surface, to make a map of the chemical nonuniformities across the wafer that cannot be seen with optical tools.

The company claims its tools can nondestructively detect nonvisual defects in 4min vs. 6hrs via other analytical methods, and are sensitive to 5E9 atoms/sq. cm (1/20,000 atoms per sq. cm), exceeding ITRS requirements for metallic contamination detection down to the 22nm node.

Qcept closed its initial $4.0 million Series B round of funding in May 2004, and an add-on of $3.25 million in funding in Dec. 2005, also led by Siemens Venture Capital. A follow-on Series B round closed in April 2006 netting additional undisclosed funds.

The model DB-6100 stand-alone break processor speeds up sapphire wafer separation. Increasing quantities and continuous price pressure, resulting in cost reduction programs, is driving the die size of photonics components, especially LEDs, further down. Efficient die separation with very small compound semiconductor devices is becoming therefore more of an issue. The advanced design of this break module can break dies as small as 200 x 200µm, even if relatively thick in relation to their size. To extend this capability to laser pre-scribed sapphire wafers of high bright LEDs, the break module has been substantially enhanced in force and cycle time to break the stronger material and to increase the throughput. The new semi-automated breaker model DB-6100 will also be available as a fully automated solution, including cassette-to-cassette wafer handling. DynTest Technologies GmbH, Grassau, Germany; www.dyntest.de.

The SST Editorial Staff recaps SEMI’s recent Industry Strategy Symposium (ISS), and the Strategic Materials Conference (SMC) that followed, with this special report series available only on our website.

Analyst warns of “stealth inflation,” debt growth
One analyst presented a somber view of the world financial system and cautioned assembled executives about a shake-out he believes is inevitable. By Bob Haavind

A recession may be coming, but not to worry, ISS hears
The “R” word is spiking in the media, and even in blogs, speakers told concerned execs. But 2008 is far from 2001, they were reassured by Nariman Behravesh, chief economist and EVP for Global Insights, a forecasting firm with some 350 economists. By Bob Haavind

ISS panelists: Growth for 2008, “collision course” leads to stronger industry
Analysts in a midday panel discussion generally agreed that chip sales will stay in positive territory in 2008, after scraping out of 2007 with slim single-digit growth. One analyst cautioned we’re on a “collision course” that could make things temporarily rocky for equipment suppliers, but will help strengthen the chip industry long term. By James Montgomery

Wall Street wary of equipment stocks, but there are some bright spots
An insightful analysis of what chipmakers need to do to thrive in a period of “profitless prosperity” by Steve Newberry, president and CEO of Lam Research, set the stage for a spirited Wall Street panel. By Bob Haavind

Solid growth, clean financials, and alternate markets key to stock evaluations
What makes a process tool or material stock attractive to investors? Will private funds take over some equipment companies? How will the chip industry deal with exponentially rising design costs? By Bob Haavind

SMC highlights PV, LED, packaging materials
SMC showed amazing perspective on new electronic materials markets of gigantic scales like photovoltaics, high-efficiency lighting, and 3D and WLP packages. By Ed Korczynski

Designer’s choice


March 1, 2008

What’s new in small-tech components, including devices and materials

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Nextreme Thermal Solutions says it developed its new Ultra-High Packing Fraction (UPF) OptoCooler in response to market demand for microscale cooling solutions that improve the performance of electronics without sacrificing efficiency. The module addresses the latest cooling and temperature control requirements for optoelectronics, electronics, medical, military, and aerospace applications, and it’s been optimized for laser diode, LED, and advanced sensor products.

With Nextreme’s thin-film thermal bump technology at its core, the OptoCooler can be integrated directly into electronic and optoelectronic packaging to deliver more than 45°C of cooling for a wide variety of thermal management applications.
www.smalltimes.com/articles/318037

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Microvision has signed a development agreement with a Tier-1 European supplier of automotive and industrial technologies to deliver prototype samples of its PicoP technology for evaluation in a variety of automotive display applications, including heads-up displays. Microvision has pioneered the development of ultra-miniature laser projection based on proprietary MEMS scanning micromirror technology. The solution promises important advantages over flat panel technologies: resolution, contrast, color, smaller packaging, and less power consumption.
www.smalltimes.com/articles/314668

During the Consumer Electronics Show in January, Microvision unveiled an advanced prototype of the first handheld, battery-powered, “plug-and-play” application of this technology. The PDA-sized unit connects directly to mobile devices to project large, high-resolution images and video onto any surface. According to Microvision, the images are “always in focus.” The production version of the device is expected to offer approximately 2.5 hours of continuous battery life.
www.smalltimes.com/articles/315935

Nanophase’s new line of nanoengineered dispersions is optimized for water-based formulations. The company says its nanoengineered dispersions enable an applied coating to resist scratching and marring and retain high gloss by up to 80% and produce improvements in scratch resistance by 300% to 400% compared to other commercially available water-based coatings.

“Nanophase has built commercial capabilities to manufacture nanocrystalline metal oxides, surface engineer nanoparticles, and disperse the nanoparticles into application-specific fluids,” says Dr. Richard Brotzman, Nanophase’s CTO. “We believe our capability to surface engineer nanoparticles and provide stable dispersions is novel in the field. We are now taking the next step and applying our application expertise to optimize nanoparticle dispersions for specific customer formulations.”
www.smalltimes.com/articles/314113

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STMicroelectronics’ latest extension of its ultra-compact low-g linear accelero-meter line is a three-axis analog-output sensor. The LIS344AL estimates acceleration values at a very low noise level with minimal power consumption, which is critical in battery-operated portable systems. Designed for space-constrained portable devices, LIS344AL is a cost-sensitive MEMS solution, the company says. It is housed in an inexpensive 4 x 4 x 1.5mm plastic package to fit in a variety of space-constrained applications, and it provides shock survivability up to 10,000g.
www.smalltimes.com/articles/315803

Keyun’s presentation is titled “The Development of the Semiconductor Packaging and Testing Industry in China.” He will cover the rapid development of the Chinese semiconductor industry, which has experienced an average increase of 33.6% between 2001

February 29, 2008 — Adnavance Technologies Inc., a developer of microarray-based direct detection molecular diagnostic tests for medical applications, has completed a Series B financing totaling $3.8 million.

The proceeds will fund continued development and expansion of the company’s proprietary metallized-DNA (M-DNA) technology. The company also announced that veteran industry executive V. Randy White joined as chief executive officer.

The financing was led by Working Opportunity Fund, managed by GrowthWorks Capital Ltd, JovInvestment Management, and Business Development Bank of Canada (BDC).

“We expect that our patented direct detection molecular diagnostic technology will serve to decentralize the worldwide molecular testing market by enabling hospitals and smaller independent laboratories to conduct their own testing, reducing health care costs and enabling patients to be evaluated and treated at their point of care,” said White. “Our technology is sensitive enough to directly detect DNA targets in human samples using a small, fully automated desktop device.”

Adnavance is initially developing an M-DNA molecular diagnostic kit targeting MRSA (Methicillin Resistant Staph Aureus).

M-DNA is based on the conducting properties of hybridized DNA. Under strict reaction conditions, certain metal ions can enter the central core of hybridized DNA and displace the hydrogen bonds forming the equivalent of a metal wire in the center of the DNA and making the DNA highly conductive.

The company uses a microarray of 10-micron electrodes to detect the M-DNA and the inherent ultra-sensitivity arises from the differential change in conductivity between hybridized DNA and metalized DNA. This change in conductivity is so large that it may obviate the need for target amplification used in current molecular-based tests.

February 28, 2008 — /BELLEVUE, WA/ — Pharmacy OneSource, creator of the Simplifi 797 quality assurance web application, is pleased to announce that industry expert Eric S. Kastango, MBA, RPh, FASHP, CEO of Clinical IQ, has updated the included policies and procedures reference section in Simplifi 797 to match USP’s revised chapteron pharmaceutical compounding, “Sterile Preparations.”

The revised chapter was finalized in December 2007 and tightened standards and conditions for sterile compounding over the previous version of Chapter 797. These revisions will become official on June 1, 2008.

“Policies and procedures are the foundation for a robust compounding quality system,” says Kastango. “I’m very excited that Simplifi 797 has these updated policies and procedures to complement the outstanding software that provides pharmacists and technicians the tools to be successful.”

Simplifi 797 is a web-based application that automates, integrates, and streamlines the quality activities and documentation required to meet USP Chapter 797. Simplifi 797 manages task scheduling and monitoring, and automates the reporting of exceptions and compliances.

About Pharmacy OneSource

Pharmacy OneSource is pharmacies’ number 1 software-as-a-service provider. Its 50 innovative team members provide best-in-class SaaS solutions to current and future challenges within health-system pharmacies worldwide. Its SaaS solutions contribute to high performance pharmacies through better outcomes, lower costs, and system-wide results. More than 1,000 healthcare organizations worldwide utilize the company’s HIPAA compliant web-based services, including Accupedia,Amplifi, Quantifi,ScheduleRx, Sentri7, Simplifi 797, and UnitStock.

Visit www.pharmacyonesource.com

About Clinical IQ

Clinical IQ, LLC is a privately held consulting company based in Florham Park, NJ. It is led by Eric Kastango, MBA, RPh, FASHP, President and CEO, who is seen as an expert in many areas of the pharmacy industry, but particularly in USP Chapter processes. Clinical IQ, LLC aims to serve as the trusted source for pharmacy information services and product solutions for all its customers who range from local start-up operations to established national companies in the hospital, home care, and specialty compounding industries. With this aim, Clinical IQ creates software, classroom training, web based training, audit tools, and many other informational products to make sterile compounding and related areas of pharmacy safer.

www.clinicaliq.com

Feb. 26, 2008 – Carl Zeiss and SEMATECH say they have completed final design for a next-generation photomask registration and overlay metrology system, dubbed “Prove,” that will enable production of advanced photomasks “with substantially improved image placement accuracy,” eyeing in particular the tighter placement control required for double-patterning technology.

The new system ascertains the accuracy of mask pattern alignment, and registration for 32nm half-pitch and beyond photomasks, they say in a statement. The metrology technology also forms part of the critical infrastructure of EUV. SEMATECH indicated the work has led to completion of design for quantifying image placement errors as small as 2.4nm. The tool itself is expected to be in production in 2009, targeting primarily mask manufacturers.

A key component of the system, the companies indicated, is a diffraction-limited, high-resolution imaging optics operating at 193nm corresponding to at-wavelength metrology for the majority of current and futures photomask applications. They also point to a “reasonable working distance” that allows through-pellicle measurements. Two illumination paths offer measurements both in transmission and reflection (e.g. for EUV), providing flexible illumination for maximum contrast imaging. The photomask resides on an ultra-precision stage, being the only movable part in the imaging path.

“Future lithographic scaling places a high reliance on very tight overlay control of the various device levels, and the photomask is a key component of the overlay error budget,” stated Michael Lercel, SEMATECH director of lithography and chairman of the ITRS Litho Working Group. “This new system will get us past several previously ‘no known solution’ challenges.”

Feb. 26, 2008 – Synova says it has joined a research alliance led by the Fraunhofer Institute for Solar Energy Systems to explore how its water jet-guided laser technology could be used as a manufacturing method to speed processing and improve performance of solar cells.

The technology could be a “superior” alternative to conventional lasers, chemical processes, diamond blade saws, and multiwire slurry saws, the company notes, because the wet approach eliminates heat and silicon surface damage, as well as debris contamination improving cell integrity and ultimately better cell efficiency and lower costs. The researchers are looking to combine the technology with chemicals to address a host of PV wafering and microstructuring techniques, including grooving, cutting, slicing, doping, etching, isolation and via drilling.

“We’re excited by the prospect of exploring new opportunities to extend Laser MicroJet’s capability beyond the progress it has already brought to solar-cell production,” said Synova CEO Bernold Richerzhagen, in a statement.

The research alliance is partly a continuation of a July 2007 study on solar-cell edge isolation, following initial collaborative work in 2002. Another LMJ machine is slated to be shipped next month (March); research is expected to continue through 1Q09.

Last year Synova also made other PV inroads through a development deal with Manz Automation, creating a hybrid tool with an inline laser edge isolation system for photovoltaic manufacturing of mono- and multi-crystalline solar cells. Orders for the tool will be taken starting in June of this year.