A Few SEMICON Superlatives
The semiconductor processing industry is filled with superlatives — which company has got the best stepper, the most efficient pumps, the largest market share, etc. This year, WaferNews, a sister publication of Advanced Packaging, took the opportunity at the biggest show, SEMICON West, to explore the “best” in a few other categories.
Category Archives: Semicon West
Partnering with SEMICON West 2001, envelope seals announcing the winners of the first annual competition will be broken at an invitation-only evening affair in San Jose on Wednesday, July 18.
The 2000 Back-End Process: Step-by-Step
As a quick reference tool for Web site visitors, here’s a compilation of articles from The Back-End Process Series: Step by Step from 2000. To read recent updates of this ever-popular series, click on our most recent issue of Advanced Packaging magazine.
Of course, this issue will also incorporate the in-depth technical articles, features, technology news and columns that Advanced Packaging regularly provides. To be part of this special issue, we invite SEMICON West exhibitors to submit press releases of new products that will be showcased at SEMICON West.
Award Entries Surpass Expectations
In just a few short months, the industry will have a few more stars among them. The 2001 Advanced Packaging Awards program recently closed its nomination period for products launched between January 1, 2000, and March 31, 2001. Aimed to recognize outstanding product innovations, the competition received more entries than anticipated, and judges from highly esteemed university programs and consortiums are in the process of determining the winners. Each entry is being evaluated on its innovativeness, cost-effectiveness, speed/throughput improvements, quality contribution, ease of use, maintainability/reparability and environmental responsibility.
C4 Makes Way for Electroplated Bumps
In the July issue of Advanced Packaging magazine, we will publish an extensive SEMICON West Product Roundup. This issue will allow our readers an insider’s preview of new and emerging technologies to be presented at the SEMICON West show.
Partnering with SEMICON West 2001, we will announce the winners of The Advanced Packaging Awards in San Jose at a no-holds-barred evening affair after the show on July 18, 2001. Individuals who are immersed in the industry, including many from highly esteemed university programs and consortiums, have already signed on to sit on our experienced and unbiased judging panel.
Packaging: The Next Step
The editors of Solid State Technology and Advanced Packaging magazines joined forces to create a special supplement for our readers. From electroplating to flip chip to the basics, we’re certain you’ll learn something in this must-read issue. Click on the articles below and enjoy!
SAN MATEO, Calif.—Aug. 21, 2000—In just 11 months Semicon West will return to the Bay Area, and once again attendees will be fighting to land pricey hotel rooms, and potential exhibitors will be turned away from Moscone Center. Despite these travails, the conference will remain where it is—at least for a few more years. But in the shadows lurks Las Vegas, with its cavernous convention halls and surplus of reasonably priced hotel rooms.
By Lisa Nadile
SEMICON West '00—July 20, 2000—For a first-time visitor to SEMICON, held last week in San Francisco, Calif., the convention was an assault to the senses. It was not unlike the Las Vegas strip, except without the slot machines; although most companies were gambling that their industry's optimism would open their customers' wallets.
By pennNET Staff
TEMPE, Ariz.—July 20, 2000—Amtech Systems Inc. has released two new products for automating semiconductor diffusion furnaces after demonstrating them at the recent SEMICON West 2000 tradeshow in San Francisco.
By Jason Rothman
SEMICON West '00—July 17, 2000—At the conference last week, Electroglas Inc. introduced EG Advantage, an upgrade program for owners of 2000, 3000, and 4000 Series Electroglas probers. The program offers customers a discount of up to $50 thousand when they upgrade to a new, state-of-the-art, 4090(µ) prober.
By Stephanie J. Levy
SEMICON West '00—July 17, 2000—Last week KLA-Tencor Corp. unveiled three new defect inspection solutions that the company says upgrades the throughput and detection sensitivity for 0.13 and 0.10 µm production. The eS20XP, the 2350, and the AIT III are designed to identify the critical defects associated with the new 300mm processes and materials.
By pennNET Staff