Device Architecture

DEVICE ARCHITECTURE ARTICLES



UltraSoC announces support for Western Digital RISC-V SweRV Core and OmniXtend cache-coherent interconnect

02/21/2019  UltraSoC today announced full support within its embedded analytics architecture for Western Digital's RISC-V SweRV Core and associated OmniXtend cache-coherent interconnect.

pSemi announces Sumit Tomar will be transitioning to CEO

02/20/2019  pSemi Corporation today announced that its parent company and executive leadership has approved the recommendation of Chairman and Chief Executive Officer Jim Cable for an evolution of the company's senior leadership structure.

Rice U. researchers unveil Internet of Things security feature

02/20/2019  'Physically unclonable function' is 10 times more reliable than previous methods.

CEA-Leti and Stanford target edge-AI apps with breakthrough NVM memory cell

02/20/2019  Researchers at CEA-Leti and Stanford University have developed the world’s first circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM.

GLOBALFOUNDRIES crosses billion-dollar design win threshold with 8SW RF SOI technology

02/20/2019  Mobile market continues to favor RF SOI, with 8SW proving to be the industry's leading platform for power-optimized chips.

Soitec and Simgui announce enhanced partnership and increased production capacity of 200mm SOI wafers in China

02/19/2019  Soitec, a designer and manufacturer of innovative semiconductor materials, and Shanghai Simgui Technology Co., Ltd., a Chinese silicon-based semiconductor materials company, jointly announced today an enhanced partnership and an increase in annual production capacity of 200mm silicon-on-insulator (SOI) wafers

A ride on the business cycle

02/19/2019  World electronic industry growth moderated (or contracted) in many sectors in late 2018.

UltraSoC extends on-chip analytics architecture for the age of machine learning, artificial intelligence and parallel computing

02/15/2019  Addresses complex multicore systems for automotive, storage, at-scale computing.

eSilicon builds momentum as a strong tier one FinFET ASIC supplier

02/15/2019  eSilicon, a provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the achievement of multiple milestones related to the company's growth in the tier one FinFET ASIC market, serving high-bandwidth networking, high-performance computing, AI and 5G infrastructure.

Samsung SDS and IBM collaborate to strengthen open source hyperledger fabric and blockchain ecosystems

02/15/2019  During IBM THINK 2019, IBM’s annual conference focused on technology and business, Samsung SDS announced it is continuing its collaboration with IBM in support of advancing Hyperledger Fabric, an open source cross-industry blockchain technology, with recent code contributions, research and a new white paper.

Taiwan maintains largest share of global IC wafer fab capacity

02/14/2019  China shows biggest increase, nearly matching North America with 12.5% share in 2018.

Soitec becomes strategic partner of Silicon Catalyst start-up incubator

02/14/2019  Silicon Catalyst, the world's only incubator focused exclusively on accelerating solutions in silicon, today announced Soitec, a designer and manufacturer of semiconductor materials, as its first European Strategic Partner.

Who is leading the RF GaN IP landscape?

02/13/2019  The RF GaN industry is showing an impressive growth with a 23% CAGR between 2017 and 2023, driven by telecom and defense applications. By the end of 2017, the total RF GaN market was close to US$380 million and 2023 should reach more than US$1.3 billion with an evolving industrial landscape.

SEMICON Southeast Asia 2019 to showcase smart manufacturing, IoT, and workforce development

02/13/2019  Registration opens for Southeast Asia's premier electronics manufacturing supply chain event.

Penn engineers develop room temperature, two-dimensional platform for quantum technology

02/12/2019  Researchers at the University of Pennsylvania's School of Engineering and Applied Science have now demonstrated a new hardware platform based on isolated electron spins in a two-dimensional material.

200mm fabs to add 700,000 wafers through 2022, SEMI reports

02/12/2019  Robust demand for more content for mobile, Internet of Things (IoT), automotive and industrial applications will drive production of 700,000 200mm wafers from 2019 to 2022, a 14 percent increase, reports SEMI.

Maryam Cope joins Semiconductor Industry Association as Government Affairs Director

02/11/2019  The Semiconductor Industry Association (SIA) announced Maryam Cope has joined the association as government affairs director.

Four Chinese OEMs were among the top 10 global semiconductor customers in 2018

02/11/2019  Samsung Electronics and Apple remained the top two semiconductor chip buyers in 2018, representing 17.9 percent of the total worldwide market, according to Gartner, Inc.

Quantum strangeness gives rise to new electronics

02/11/2019  Noting the startling advances in semiconductor technology, Intel co-founder Gordon Moore proposed that the number of transistors on a chip will double each year, an observation that has been born out since he made the claim in 1965. Still, it's unlikely Moore could have foreseen the extent of the electronics revolution currently underway.

Record revenues for critical subsystems suppliers in 2018 despite collapse in orders

02/08/2019  Critical subsystems for the IC equipment market continued to grow to a new record of $11 billion in 2018. While 2019 is expected to be a downturn year, the long-term outlook remains unchanged with an average growth rate of 3 percent.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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