Device Architecture

DEVICE ARCHITECTURE ARTICLES



Cadence unveils Virtuoso Advanced Node for 20nm design

01/29/2013 

Cadence Design Systems, Inc. announced the availability of Virtuoso® Advanced Node, a new set of custom/analog capabilities designed for the advanced technology nodes of 20nm and below.

Samsung, Apple swap spots as top chip consumers, while total market lags

01/25/2013 

Given the ascension of smartphones, it's no surprise that Samsung and Apple remain far and away the biggest end-users of semiconductors, and are widening their lead on the rest of the field, according to the latest Gartner rankings.

MEMS microphones surge, thanks to Apple

01/23/2013 

The market for MEMS microphones has nearly quintupled in just the past three years, topping a projected 2 billion shipments in 2012, thanks mainly for capabilities the technology enables in high-end smartphones, according to IHS iSuppli.

Novati to use Ziptronix bonding tech for 3D assembly

01/18/2013 

Novati Technologies Inc. has licensed Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), to offer 3D stacking services and test to customers.

LED manufacturing investment declines as industry contemplates future directions

01/18/2013 

Spending on LED fab manufacturing equipment will decline 9.2% in 2013 as the industry faces weak long-term demand and consolidates manufacturing capacity.

Samsung grabs No.3 foundry spot on smartphone dominance

01/17/2013 

In the ranks of top foundries, there's a new Number Three in town: Samsung, which climbed up the ranks again in 2012 thanks to its ubiquity in smart phone technology, according to updated rankings by IC Insights.

SRC, DARPA unveil university research center network

01/17/2013 

Semiconductor Research Corporation (SRC) and the Defense Advanced Research Projects Agency (DARPA) announced that $194 million will be dedicated during the next five years to STARnet, which encompasses six new university microelectronics research centers.

ISS 2013: Semiconductor leaders see massive industry transformation

01/15/2013 

The rise in mobile computing, changes to the fabless-foundry model, uncertainties in technical innovation, and global macroeconomic trends are becoming the dominant forces in 2013 and beyond, according to industry leaders speaking at this week's SEMI Industry Strategy Symposium (ISS).

CES: Phablets and table PCs break the PC mold

01/11/2013 

Among the usual confluences of useful and cool gadgets (not to mention bizarre) at this week's annual Consumer Electronics Show in Las Vegas, two types of devices with new formfactors aimed to rethink the PC model.

GlobalFoundries adding R&D facility to NY fab campus

01/11/2013 

GlobalFoundries says it plans to build a $2 billion "Technology Development Center" R&D facility at its Fab 8 campus in Saratoga County, NY, for semiconductor technology development and manufacturing:  EUV lithography photomasks to new interconnect and packaging technologies enabling 3D chip stacking, "and everything in between."

By the numbers: The rise of fabless IC sales, 1999-2010 and beyond

01/10/2013 

Fabless IC suppliers saw sales rise 6% in 2012, again outperforming IDMs and the total IC market, and by 2017 fabless ICs will make up a full third of the overall market, says IC Insights.

SEMI approves first HB-LED standards

01/09/2013 

SEMI's HB-LED Standards Committee has approved its first standard, specifying sapphire wafers used in making high-brightness light-emitting diode (HB-LED) devices.

Cymer hires AMAT roadmap exec to lead EUV development

01/08/2013 

Klaus Schuegraf, former exec at Applied Materials responsible for the company's semiconductor products technology roadmap, will now lead Cymer's EUV engineering and development programs.

Look for 4K LCDs, OLEDs at CES

01/07/2013 

As the annual Consumer Electronics Show and hordes of techie enthusiasts descends over Las Vegas this week, NPD DisplaySearch revisits the battle between two display technologies -- 4K × 2K vs. OLEDs.

2013: Advanced chemistry moves center stage

01/04/2013 

We are in an age where chemistry is center stage in the race to advance Moore’s Law and More Than Moore.

IDC: Semiconductor revenues will grow 4.9% in 2013

01/04/2013 

The International Data Corporation is forecasting that semiconductor revenues worldwide will improve by 4.9% to $319 billion in 2013 and log a compound annual growth rate (CAGR) of 4.1% from 2011-2016.

SIA: November chip sales best of the year

01/04/2013 

Global semiconductor sales in November 2012 were the largest monthly tally of the entire year,according to the SIA -- and growth was especially sparkling in the North America region.

2013: Healthy revenue growth, but capex likely flat

01/04/2013 

Based on current indications, capital spending would seem to be flat in 2013.  However, Semico predicts healthy revenue growth this year, which may encourage more spending, particularly in the second half of the year.  This may bring total capex for 2013 into the positive range.

SK Hynix licensing Tessera, Invensas patents

01/03/2013 

Korean DRAM maker SK Hynix has entered into new eight-year patent licensing agreements with Tessera Inc. and Invensas.

2013: An economic outlook for the global IC market

01/03/2013 

Predictions for 2013 show several notable trends: overall silicon area growth for 2013 should average approximately 6%; the first quarter and the second half are likely to show slower growth than the second quarter; and the modest growth forecast for 2013 is predominantly demand driven.




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Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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