Device Architecture

DEVICE ARCHITECTURE ARTICLES



Europe to unite research efforts in Silicon Europe cluster alliance

10/08/2012 

Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”

GaN power chip startup Transphorm raises $35M, led by Japanese backers

10/05/2012 

GaN power device developer Transphorm Inc. has secured a $35M Series E financing round led by the Japanese government-backed Innovation Network Corporation of Japan (INCJ), and Nihon Inter electronic Company with whom it has signed a second-source manufacturing deal.

ON Semiconductor joins imec’s GaN-on-Si research program

10/05/2012 

ON Semiconductor has joined imec to collaborate on the development of next-generation GaN-on-Si power devices. ON Semiconductor is presently building a GaN processing line in its Oudenaarde facility in Belgium Oudenaarde, and it is expected to employ GaN-on-Si technology.

Industrial magnetic sensors get a boost from green energy

10/05/2012 

The market for semiconductor magnetic sensors used in industrial and medical applications expanded by 6% in 2011 to $118.2 million, with green energy initiatives acting as a major growth driver, according to IHS iSuppli.

Analyst: Fab spending softness 2012 extending into 2013

10/04/2012 

Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.

SIA: Chip sales essentially flat in August

10/03/2012 

Macroeconomic malaise continues to weigh down global semiconductor sales, although there's a possible ray of hope for a boost by year's end thanks to introduction of much-desired electronics devices (hello iPhone 5).

GlobalFoundries to fab Sand 9's MEMS timing products

10/02/2012 

Sand 9 is partnering with GlobalFoundries for high-volume manufacturing of its microelectromechanical systems (MEMS) timing technology, which incorporates silicon-on-insulator (SOI) and through-silicon vias (TSV).

Intermolecular, GlobalFoundries, IBM stepping to 10nm node

10/02/2012 

Intermolecular says that it is working with both GlobalFoundries and IBM to speed development of manufacturing technologies down to the 10nm node, using its High Productivity Combinatorial (HPC) technology.

ST pairs with Samsung for 32/28nm HKMG

10/01/2012 

STMicroelectronics says it is using Samsung Electronics' foundry services for 32nm/28nm high-k/metal gate (HKMG) process technology, and have taped out a dozen system-on-chip devices.

Tezzaron takes over SVTC's Austin fab amid layoff reports

10/01/2012 

Tezzaron Semiconductor is taking over SVTC Technologies' wafer fab in Austin, TX, amid reports that the semiconductor/MEMS development organization is cutting back activities in Austin and in California.

Foundries, leading-edge nodes, and profits: Narrowing the field in a two-man race

09/28/2012 

Want another snapshot of who's leading the pack among pure-play foundries, and who's falling off the curve? Look more closely at <45nm offerings, as framed by a recent analysis from IC Insights.

Japanese public/private partnership mulling Renesas rescue

09/27/2012 

A Japanese state-backed domestic partnership has been forged to mull taking over ownership of struggling domestic chipmaker Renesas, in response to a rumored acquisition bid by US-based investment firm KKR.

KIT develops "photonic wire bond" for optical chip connections

09/27/2012 

Researchers at the Karlsruhe Institute of Technology (KIT) say they have developed a novel optical connection process for semiconductors using "photonic wire bonding" that achieves data transmission rates of several Tbit/sec.

NanoYield: new design for yield software released

09/27/2012 

ProPlus Design Solutions, Inc. unveiled NanoYield, yield prediction and optimization software for memory, logic, analog and digital circuit design.

Micro-rheometer, microdevice adsorbtion get nods in Sandia student MEMS design contest

09/27/2012 

A device that measures very thin quantities of liquid, such as the synovial fluid in knee joints, and a device that measures change in mass when a microdevice adsorbs small amounts of material, earned top honors in Sandia National Labs' annual student MEMS design contest.

EV Group sells first ZoneBOND tech for compound semi work

09/26/2012 

EV Group says it has received an order for its EVG850 temporary bonding/debonding systems from a leading maker of compound semiconductor-based components, what it says is the first use of its ZoneBOND technology in this area.

X-Fab investing $50M in MEMS business, eyes top-three ranking

09/26/2012 

X-Fab Silicon Foundries says it will invest more than $50M over the next three years in its microelectromechanical systems (MEMS) operations, aiming to grow the business to become among the top MEMS foundries worldwide.

TSMC's schedule for 450mm mass production -- and lithography is the key

09/26/2012 

During sessions at this month's SEMICON Taiwan, execs from TEL, Lam Research, Applied Materials and KLA-Tencor revealed the latest developments in 450mm technology.

GlobalFoundries tips 14nm FinFETs with 20nm underpinnings

09/25/2012 

GlobalFoundries announced it has developed a 14nm process technology built off its 20nm planar (LPM) process, which it says will offer improved battery life and higher performance vs. other 20nm 2D planar transistors.

Linde adds China N2O plant, expands display gases reach in Asia

09/25/2012 

Linde Electronics has added a new high-purity nitrous oxide (N2O) plant in China's Jiangsu Province to support increased adoption of metal oxide transistors by display manufacturers.




WEBCASTS



Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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