07/05/2012 

Xilinx will invest $50 million to expand its electronics engineering operations, located at the company

07/04/2012 

The Semiconductor Industry Association (SIA) presented its 2012 University Researcher Awards to Stanford University professors Krishna Saraswat and Bruce Wooley as well as its 2012 Congressional Leadership Awards to Sen. Carl Levin, Sen. John McCain, Rep. Kevin Brady and Rep. Wally Herger.

07/04/2012 

“The upward trend of global semiconductor sales is encouraging,” said Brian Toohey, SIA. “Recent sales totals are in line with industry projections of modest growth for the remainder of 2012, but a sluggish global economy continues to provide substantial headwinds, limiting more robust growth.”

07/03/2012 

Semiconductor foundry United Microelectronics Corporation (NYSE:UMC; TWSE:2303) has licensed IBM technology to expedite the development of its 20nm CMOS process with FinFET 3D transistors.

07/03/2012 

Wireless technology company Qualcomm will change its corporate structure, moving substantially all of its R&D activities, its QCT semiconductor business, and other product and services businesses into a new wholly owned subsidiary, Qualcomm Technologies Inc.

07/02/2012 

Cypress entered into a 5-year senior secured revolving credit facility with a group of lenders led by Morgan Stanley Senior Funding. The facility enables the company to borrow up to $430 million on a revolving basis.

07/02/2012 

Micron Technology Inc. (Nasdaq:MU) will acquire and support bankrupt DRAM maker Elpida Memory Inc.’s assets, paying approximately US$2.5 billion total consideration, less certain reorganization proceeding expenses.

06/29/2012 

Silicon carbide (SiC) semiconductors will see 38% CAGR through 2022 thanks to power and efficiency advantages over silicon devices, according to MarketResearch.com.

06/29/2012 

Microelectronics industry standards developer JEDEC Solid State Technology Association published key updates to its Universal Flash Storage (UFS) standard, specifically tailored for mobile applications and computing systems requiring high performance and low power consumption.

06/28/2012 

Semiconductor manufacturers identified key factory productivity challenges that need to be addressed and shared effective solutions they will need to stay leading-edge and competitive amid turbulent industry transitions during the recent ISMI Manufacturing Week.

06/28/2012 

Applied Materials introduced a new dielectric etch system called the Centura Avatar, which can etch holes and trenches in complex film stacks with depth to width aspect ratios of up to 80:1. It is designed to meet new requirements in creating 3D memory architectures.

06/27/2012 

In a 3-year research collaboration, research organization imec and semiconductor provider Murata Manufacturing Co. Ltd. will work on reconfigurable radio IC design.

06/26/2012 

Solid State Technology is hosting 3D and 2.5D Integration: A Status Report, sponsored by EVG and ALLVIA, and is free for all attendees. This preview shares a sneak peek at

06/26/2012 

Solid State Technology is hosting a free webcast, 3D and 2.5D Integration: A Status Report. A fourth presenter has just been announced, Brent Przybus, Senior Director, Product Line Marketing, Xilinx Inc.

06/25/2012 

Solid State Technology will present 3D and 2.5D Integration: A Status Report on June 27, free for all attendees. William Chen, ASE, will join speakers David McCann, GLOBALFOUNDRIES and E. Jan Vardaman, TechSearch International.

06/22/2012 

The Global Semiconductor Alliance (GSA) shows more than 100% increase in semiconductor company investment Y/Y in May, in the Global Semiconductor Funding, IPO and M&A Update.

06/22/2012 

A multidisciplinary research team at MIT and the Universidad Autónoma de Madrid developed a new mathematical approach to simulating the electronic behavior of noncrystalline materials, with applications in OLEDs, flexible printable organic electronic circuits, and solar cells.

06/20/2012 

The 2012 TechConnect World Summit, Expo & Showcase opened Tuesday, June 19, 2012 at the Santa Clara Convention Center. The event serves as host to the National Innovation Showcase, whose mission is to accelerate the commercialization of “the world’s top innovations.”

06/20/2012 

In a webcast scheduled for June 27^th at 1:00 Eastern, 11:00 Pacific, David McCann of GLOBALFOUNDRIES will provide a status report on advanced packaging and 3D integration. McCann is responsible for Packaging R&D and back-end strategy and implementation at GLOBALFOUNDRIES.

06/19/2012 

Barclays Capital analysts say DRAM benefits from a supply discipline that was bolstered by oligopoly/DRAM consolidation and the Elpida bankruptcy; robust demand growth from non-PC applications (server/mobile DRAM bit demand to exceed PC for the first time in 2013E); and potential for additional positives related to Elpida (Hiroshima/Rexchip converted to non-DRAM).