04/09/2012 

Coventor launched SEMulator3D 2012, featuring improved predictive process modeling tools with increased capacity, speed, and automation for leading-edge process technology nodes.

04/09/2012 

Since Elpida Memory filed for bankruptcy protection, reported bidders have included Micron, Hynix, and Toshiba, and now private equity firms TPG Capital and Hony Capital. CJ Muse of Barclay Capital shares the likely and unlikely scenarios for Elpida, and how these will affect DRAM overall.

04/09/2012 

Analog Devices Inc. (NASDAQ:ADI) honored 14 companies with the 11th Annual “Supplier Excellence Awards,” selected from among the more than 2,000 companies that contribute to ADI’s global semiconductor manufacturing operations.

04/09/2012 

Worldwide HDD unit shipments experienced a year-over-year decline of 4.5% in 2011. Efforts to clean and repair flooded HDD factory buildings and equipment will take most of H1 2012. HDD and HDD component production should return to pre-flood output levels in H2, reports IDC.

04/05/2012 

The top 10 and top 25 semiconductor suppliers registered 7% and 4% growth, respectively. However, 15 of the top 25 semiconductor sales leaders posted negative results in 2011. Only 9 of the top 25 suppliers outperformed the total worldwide semiconductor industry 2011/2010 growth rate.

04/05/2012 

Flow processor developer Netronome extended its strategic relationship with Intel Corp., manufacturing its next-generation Netronome flow processors (NFP) using Intel’s 22nm tri-gate transistor architecture.

04/05/2012 

Power electronics will grow to $15 billion in sales of discrete components in 2020, says Lux Research. New materials -- SiC and GaN -- are taking a 22% market share for $3.3B in sales. Expect this year to set a record for funding to power electronics companies.

04/05/2012 

The top-5 most commonly counterfeit components (based on reported cases) are analog ICs, microprocessors, memory ICs, programmable logic devices, and transistors, shows IHS.

04/05/2012 

MOSAID Technologies Inc. is sampling a 16-die stack NAND Flash device operating on a single high-performance channel, the 5126Gb HLNAND.

04/03/2012 

Combining sensors with analog technology to enable sensor fusion will create intelligent devices for automotive, consumer, and industrial markets, said Vijay Ullal at Maxim Integrated Products (MXIM).

04/03/2012 

Semiconductor lead times decreased at the end of February 2012, reports analyst firm Gartner Inc. Although Gartner still expects the semiconductor industry to grow in 2012, Q1 showed some signs of softness.

04/03/2012 

Spansion Inc. (NYSE:CODE) and SK Hynix formed an alliance to deliver Spansion SLC NAND Flash products at the 4x, 3x, and 2x nodes to the embedded market. Spansion is known as a NOR Flash memory provider.

04/03/2012 

The Semiconductor Industry Association (SIA) measured worldwide semiconductor sales at $22.9 billion in February 2012, down 1.3% from January’s $23.2 billion and 7.3% from February 2011.

04/02/2012 

Sterne Agee analyzes top analog semiconductor companies and the analog sector as a whole. Demand is stable (industrial, automotive) to improving (computing), and distributor inventories are low.

04/02/2012 

Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.

03/30/2012 

Qualcomm Incorporated (NASDAQ:QCOM) will establish an integrated circuit (IC) design and engineering R&D center in Singapore.

03/29/2012 

Kopin Corporation achieved record 1290cm²/V.s electron mobility and 240ohms/square sheet resistance results from GaN-based high electron mobility transistor (HEMT) materials.

03/29/2012 

Rice University is developing transparent, flexible memory devices based on silicon oxide, enabling future consumer applications with flexible touchscreens, transparent batteries, see-through ICs, and more.

03/29/2012 

ODIS has developed an optical interface chip that is the first step in achieving a single device capable of interconnecting multiple processors by waveguide and/or fiber to transport ultra-high speed signals.

03/28/2012 

In its report, "RF filters, PAs, Antenna Switches & Tunability for Cellular Handsets," Yole Développement notes that new technologies are changing the power amplifier sector. PAs are strategic RF components in cell phones.