Device Architecture

DEVICE ARCHITECTURE ARTICLES



Chip inventories contract, reversing 7 quarter trend

01/04/2012 

Chip inventories held by semiconductor suppliers declined in the third quarter of 2011, putting a halt to the steady expansion of the previous seven quarters, as the industry cut production in order to reduce oversupply, shows IHS iSuppli research.

Semiconductor sales tip downward in November

01/03/2012 

The Semiconductor Industry Association (SIA) reports worldwide sales of semiconductors were $25.1 billion for the month of November 2011. The semiconductor industry closed 2011 with growth and looks towards 2012 for further improvement.

22nm node semiconductors: Technical forecasts

01/03/2012 

Solid State Technology asked top analysts and technologists to provide insights on the transition to 22nm semiconductor devices. Read through the whole 10-forecast series, or check out the individual articles as you have time to see perspectives on lithography, device architecture, and more.

Graphene FET enables high-frequency mixer circuits

01/03/2012 

Chalmers University of Technology researchers created a graphene FET (G-FET) that is compatible with silicon devices and offers space and high-frequency benefits over traditional mixer transistors.

Will 22nm need a mid-node?

01/02/2012 

Art Zafiropoulo of Ultratech shares predictions for 22nm: that everyone will be using gate-last fabrication, that there may be a mid-node at 20nm, and that TSVs and 450mm wafers will play an important role at the new node.

Chinese foundries Hua Hong, Grace merge (finally)

12/30/2011 

Fulfilling a long-anticipated consolidation in China's foundry sector, Hua Hong NEC and Grace Semiconductor say they have officially merged, a move that creates a business that just might be knocking outside the Big Four's foundry doors.

Strained silicon and HKMG take the stage at 22nm

12/30/2011 

Mohith Verghese, ASM America, covers the gate stack changes expected when 22nm semiconductors ramp in volume production. Topics include high-k gate dielectrics, strained silicon including nMOS strain, and the importance of conformal deposition wafer processing technology.

22nm requires foundry-to-packaging-house cooperation

12/30/2011 

At the 22nm node, die fragility and challenging interconnect materials will necessitate foundry collaborations with packaging houses, co-designing silicon and package, asserts E. Jan Vardaman, TechSearch International.

At 22nm, the focus is first order effects

12/29/2011 

Regardless of transistor architecture, the impact of process variability on device and circuit performance has emerged as a significant concern at 22nm. Effects that until recently were negligible or could be mitigated with improved wafer manufacturing control are now first-order effects, says Howard Ko, Synopsys, who outlines the main culprits.

At 22nm, leave chip layout to the experts

12/28/2011 

The transition to 22nm silicon will have a major impact on the design community, most notably in process variation: timing and power. Because of this, we are seeing a dramatic increase in the 22nm process design rules, says Gary Smith. More and more design teams will decide to leave the IC layout portion of the design to the experts.

Semiconductor IPOs and M&As in November 2011

12/28/2011 

The Global Semiconductor Alliance (GSA) released its Global Semiconductor Funding, IPO and M&A Update, showing that initial public offerings surged in November, with 3 companies entering the stock market.

Semiconductor process technology challenges at 22nm

12/28/2011 

2012 promises much for the semiconductor industry, and the world. Gartner's Dean Freeman analyzes the roles of semiconductor fab tool makers for 22nm NAND and logic device manufacturing, and the role of chip makers adopting the new node.

Docomo establishes fabless semiconductor JV with NEC, Panasonic, Samsung, Fujitsu and Fujitsu Semiconductor

12/27/2011 

The fabless JV will develop feature-rich, small-size, low-power-consumption semiconductor products equipped with modem functionality. It will be focused on LTE and LTE-Advanced mobile communication standards products, sold globally.

Intel sees Atom chip sales decline, maintains microprocessor lead in Q3

12/27/2011 

Intel's Atom chips saw plunging sales as the netbook market was swallowed by smartphones, media tablets, and like devices, but the company expanded its microprocessor leadership in Q3 2011, shows IHS iSuppli.

SEMATECH, Dainippon Screen partner on semiconductor doping tech

12/23/2011 

SEMATECH and Screen will focus on monolayer doping and activation methods compatible with ultra-shallow junctions for planar and non-planar device technologies in silicon and non-silicon high-mobility materials.

Microcapsules give a new take on "self-healing" chips

12/22/2011 

A group from the U. of Illinois has devised a way to identify and patch flaws in semiconductors within seconds, saving much analysis and manual fixing and sparing otherwise functioning chips from the trash heap.

Analysis: Smart meters are a growth area for ICs

12/22/2011 

Rapid adoption of smart meters to save energy and improve grid efficiency means an opportunity for a broad range of semiconductor suppliers.

Panasonic, Samsung, SanDisk, Sony, Toshiba join for secury memory

12/22/2011 

Panasonic, Samsung Electronics, SanDisk, Sony, and Toshiba are in the early stages of a plan to collaborate on new content protection technology for flash memory cards.

Power semiconductors to see modest growth in 2012

12/21/2011 

The global power semiconductor market will grow 5.0% in 2012 to $32 billion, says IMS Research. The modest increase is due to global economic uncertainties and inventory being flushed from the supply chain. 2013 will see a return to double-digit growth.

LRCX-NVLS blockbuster combo: Why everyone's so positive

12/16/2011 

We scan the industry-watcher landscape to gauge reactions to the proposed Lam Research-Novellus combination: technology and customer synergies, valuation questions, and possible M&A aftershocks.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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