04/11/2006  April 11, 2006 - Silicon Valley startup SiTime Corp. is readying engineering samples of its first MEMS-based oscillator product lines, based on 200mm standard CMOS manufacturing processes.

04/11/2006  April 11, 2006 - Micron Technology posted mixed results in its fiscal 2Q06, helped by a big payment from flash memory partner Intel, and has raised its capex budget for the year.

04/10/2006  April 10, 2006 - Facing increasing pressure particularly from Asian competition, Altis Semiconductor, the chipmaking JV of Infineon Technologies and IBM, said it will lay off 323 workers (about 15% of total workforce) in an effort to reduce its "oversized" operation.

04/06/2006  April 6, 2006 - Sematech's Advanced Technology Development Facility (ATDF) R&D subsidiary has agreed to produce wafers with nonclassical CMOS transistors using implants and FinFET designs for Japan's Elpida Memory.

04/06/2006  April 6, 2006 - Improving conditions in the DRAM segment will translate to a better performance for the semiconductor industry in 2006, according to iSuppli Corp.

04/05/2006  April 5, 2006 - After months of speculation, Toshiba Corp. and SanDisk have announced plans to build another 300mm NAND flash fab at Toshiba's operations in Yokkaichi, Japan.

04/04/2006  April 4, 2006 - Samsung Electronics Co. Ltd. has ramped to mass production of 1Gbit OneNAND flash memory devices, using 70nm process technology that achieve 70% greater efficiency than the 90nm process.

04/04/2006  April 4, 2006 - Intel Corp. said it is the first company to offer NOR multilevel cell (MLC) flash memory chips at 1Gbit density using 65nm process technology, with samples available to customers by June.

04/04/2006  April 4, 2006 - Toshiba America Electronic Components Inc. has merged its ASSP and embedded processor SoC business units into a single operation.

04/03/2006 

04/03/2006  Lumera Corp., a nanotechnology company, announced that it had received an order from Optoelectronics Industry Development Association.

04/01/2006  A method was developed that allows a socket to be soldered in place of the package within the same footprint.

03/31/2006  March 31, 2006 - Cypress Semiconductor Corp. and Simtek Corp. have expanded their yearlong licensing and development agreement, which involved creating a 0.13-micron SONOS-based CMOS nonvolatile static random-access memory (nvSRAM) process.

03/31/2006  March 31, 2006 - Infineon Technologies AG has officially announced the spinoff of its memory chip unit as a separate entity by May 1, two months ahead of schedule.

03/30/2006  March 30, 2006 - For the first time ever, the optoelectronics market is expected to surpass the discrete semiconductor segment this year to become the second largest market segment in the semiconductor industry behind ICs, according to a new report from IC Insights Inc., Scottsdale, AZ.

03/30/2006  March 30, 2006 - SEMATECH says it has identified metal electrode materials for use with nMOS transistors with high-k dielectric, a big step on the way toward fabricating working CMOS devices using metal gate and high-k dielectric stacks.

03/29/2006  March 29, 2006 - For the first time in memory, foundry segment revenue growth lagged behind that of the overall semiconductor industry in 2005, according to preliminary data from Gartner Dataquest.

03/29/2006  March 28, 2006 - Revenue from Taiwan's IC industry rose 1.7% in 2005 to NT$1.12 trillion (US $34.34 billion), well below the total global industry's ~7% growth for the year, but is seen rebouding to 16% growth in 2006.

03/28/2006  March 28, 2006 - New forecast data from iSuppli Corp. indicates concerns over NAND flash memory demand, but continued optimism for DRAM sales and the memory market overall.

03/27/2006  March 27, 2006 - A Japanese court reportedly has ruled in favor of Toshiba Corp. in its NAND flash patent infringement suit against South Korean competitor Hynix Semiconductor Inc.