Device Architecture

DEVICE ARCHITECTURE ARTICLES



Intel: 2Q in line, no big news to share

07/14/2004  July 14, 2004 - Intel Corp. boosted sales and earnings in 2Q04 in line with estimates, but indicated no changes in its plans for second-half capital spending, and quietly hinted at a slightly cloudy outlook later this year.

Mattson wins orders from Hynix Semiconductor for DRAM production

07/14/2004  July 14, 2004 - Mattson Technology Inc. has won multiproduct system orders from Hynix Semiconductor Inc. for the production of DRAM devices in its new T1 300mm wafer fabrication plant in Ichon, South Korea.

IMEC launches eRAM program

07/13/2004  July 13, 2004 - IMEC has launched a new three-pronged research program on embedded RAM concepts for second and higher levels of onchip cache memory for the 45nm node and below.

Micron stakes claim with NAND flash

07/05/2004  July 5, 2004 - Micron Technology Inc., Boise, ID, said it plans to move into NAND flash memory in order to become a top-three supplier of the technology.

Inotera opens doors at 300mm plant

07/01/2004  July 1, 2004 - Inotera Memories Inc., the 50-50 venture between Infineon Technologies and Nanya Technology Corp., has inaugurated its $2.2 billion 300mm DRAM production facility in HwaYa Technology Park in Taoyuan, Taiwan, 18 months after the JV was set up.

Cypress acquires CMOS sensor firm

06/22/2004  June 22, 2004 - Cypress Semiconductor Corp., San Jose, CA, has agreed to acquire FillFactory NV, a Belgium-based developer of active-pixel CMOS image sensor technology, for $100 million in cash.

Renesas to restructure frontend ops

06/17/2004  June 17, 2004 - Renesas Technology Corp., the chipmaking JV between Hitachi and Mitsubishi Electric, said it plans to restructure its frontend manufacturing business, resulting in the closure of Renesas Semiconductor Europe, the company's frontend facility in Alsdorf, Germany, by the end of this year.

Elpida wants Japan to tax Hynix chips

06/16/2004  June 16, 2004 - Memory firm Elpida Memory Inc. and the Japanese business of Micron Technology Inc. have petitioned the Japanese government to impose countervailing duties on imports of DRAM chips from Hynix.

Lithography, 3D interconnects top SEMATECH 2005 to-do list

06/10/2004  June 10, 2004 - International SEMATECH has released its top technical challenges for 2005, choosing to emphasize R&D on advanced gate stacks, 193nm immersion and EUV lithography, low-k dielectrics, and 3D interconnects.

Elpida to build mammoth DRAM fab

06/09/2004  June 9, 2004 -- Elpida Memory Inc. plans to invest up to 500 billion yen over three years to construct what would be the world's largest DRAM facility.

Cavendish announces memory technology

06/08/2004  Cavendish Kinetics, a Holland-based semiconductor company working to integrate MEMS devices into standard CMOS processes, announced its Nanomech technology for creating submicron structures for use as computer memories.

Elpida, Rambus extend memory pact

06/07/2004  June 7, 2004 - Elpida Memory Inc. has extended the terms and duration of its licenses to SDRAM and DDR DRAM patents from Rambus Inc., Los Altos, CA.

Nantero teaming with LSI Logic on carbon nanotube project

06/07/2004  June 7, 2004 -- Nantero Inc., Woburn, MA, says that it is teaming with LSI Logic Corp., Milpitas, CA, to develop semiconductor process technology, expediting the effective utilization of carbon nanotubes in CMOS fabrication.

Intel narrows 2Q outlook

06/04/2004  June 4, 2004 - In its mid-quarter update on Thursday, Intel tightened its outlook for 2Q04 revenue to $8.0-$8.2 billion, at the higher end of previous predictions of $7.6-$8.2 billion, due to increasing strength in its flash memory business.

SIA: Another month, another record for chip sales

06/03/2004  June 2, 2004 - April proved true to its historical roots as a strong month for the industry, as worldwide chip sales continued to venture into territory not seen in four years, according to the latest data from the Semiconductor Industry Association (SIA).

STMicroelectronics, CEA-Leti, and AIXTRON develop ultra-thin gate-insulation process

05/26/2004  May 26, 2004 -- STMicroelectronics today announced that ST, CEA-Leti, and AIXTRON have developed an advanced process technology for the creation of ultra-thin transistor-gate-insulation layers for low-power applications at the 65nm and 45nm CMOS transistor technology nodes.

Infineon shuffles memory execs

05/20/2004  May 19, 2004 -- Harald Eggers, the CEO of Infineon AG's memory products business group, will step down "of his own request" effective June 1, the company said. Thomas Seifert, head of the company's wireline communications business group, will assume the role.

Researchers close in on MRAM

05/14/2004  May 14, 2004 - Scientists from Japan have succeeded in running magnetoresistive random access memory (MRAM) with one-hundredth of the amount of current needed for current prototype MRAMS, seen as a key step toward commercializing the technology.

Taiwan capital spending to top $15 billion

05/12/2004  May 11, 2004 - Capital spending in Taiwan's semiconductor and TFT-LCD industries is expected to top $15.02 billion this year, according to the China Economic News Service. Three domestic sectors -- IC foundries, IC packaging/testing, and large-sized TFT-LCD panels -- are predicted to take the world's no. 1 positions, respectively.

Philips proves first silicon for 90nm CMOS

05/12/2004  May 11, 2004 - Royal Philips Electronics has achieved "right-first-time" silicon in its 90nm CMOS production line, both at the Crolles2 wafer fab in France and TSMC's fab in Taiwan. The lead silicon uses an ARM processor core with SRAM, ROM, and analog signal circuitry, designed for wireless applications.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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