02/10/2004  Molecular Imprints Inc., an Austin, Texas, developer of nanolithography tools, sold its Imprio 100 tool to South Korea’s National Nanofab Center at the Korea Institute of Science and Technology, as well as to a northern California-based electronics company, according to a news release.

02/09/2004  February 9, 2004 - Charles Kau, executive VP at Nanya Technology Corp., has been named president of Inotera Memories Inc. effective March 1.

02/06/2004  Feb. 6, 2004--DRESDEN, Germany--Infineon Technologies will expand the Memory Development Center at its location here with the aim of further strengthening its DRAM and flash products.

02/03/2004  February 3, 2004 - A new report from market research firm Strategic Marketing Associates anoints Japan as the new king of semiconductor-equipment capital spending.

02/03/2004  February 3, 2004 - Hynix Semiconductor Inc. said it is planning to roll out 512Mbit NAND flash memory chips using 120nm technology in February, its first foray into flash memory.

02/02/2004  February 2, 2004 - Sony Group is investing $325 million in IBM's 300mm fab in East Fishkill, NY, to spur production of 65nm chips to be used for Sony's new "Cell" chips.

02/01/2004  As 2.5G and 3G smartphones shrink in size, yet offer increased functionality and a PC-like graphical user interface (GUI), original equipment manufacturers (OEMS) are reducing the number and size of onboard components.

01/29/2004  January 29, 2004 - Infineon Technologies AG, Munich, Germany; Genus Inc., Sunnyvale, CA; and the U. of Albany Center of Excellence in Nanoelectronics are partnering to develop next-generation memory chip devices.

01/28/2004  Chances are, consumers will never see IBM’s nanocrystal flash memory on the marketplace. But the self-assembly technique used for making the nanocrystals could become a cornerstone in Big Blue’s future miniaturized components. IBM uses a technique that allows polymers to self-assemble into a honeycomb pattern with holes as small as 20 nanometers.

01/27/2004  January 27, 2004 - FormFactor Inc., Livermore, CA, has introduced a new frequency probe card for testing DRAM die on-wafer.

01/23/2004  January 23, 2004 - Toshiba Corp. said it has developed a multi-chip package that can stack nine layers, with 70-micron chip thickness and an overall thickness of 1.4mm -- the same as the company's 6-layer, 85-micron chip stack.

01/21/2004  January 21, 2004 - The Semiconductor Industry Association (ITRS) has released the 2003 edition of the International Technology Roadmap for Semiconductors (ITRS), which provides detailed technical guidance and milestones for semiconductor manufacturing for the next 15 years.

01/21/2004  January 21, 2004 - Litigation brought by International Rectifier Corp. against Hitachi Ltd. and Renesas Technology Corp., Hitachi's JV with Mitsubishi Electric, has been settled, with all parties reaching patent cross-licensing agreement.

01/20/2004  January 20, 2004 - Praxair Inc., Danbury, CT, has signed agreements to supply various gases including nitrogen, helium, and hydrogen for two of Samsung Electronics' production facilities in Korea.

01/20/2004 

01/19/2004  January 19, 2004 - Renesas Technology Corp., the JV between Hitachi and Mitsubishi Electric, has reportedly signed Goldman Sachs and Daiwa SMBC to manage its initial public offering later this year.

01/15/2004  January 15, 2004 - Korea chipmaker Samsung Electronics Co. Ltd. reported record 4Q03 sales of $10.85 billion with a net income of $1.57 billion, short of analyst expectations but up 24% from a year ago.

01/14/2004  January 14, 2004 - Singapore's Chartered Semiconductor Manufacturing has signed a deal to manufacture 90nm silicon-on-insulator products for IBM, East Fishkill, NY.

01/13/2004  January 13, 2004 - A recent report from IDC predicts 18% growth in 2004 for the semiconductor industry, driven by double-digit growth in shipments of personal computers and mobile phones, and increasing contributions from the Asia-Pacific region.

01/13/2004  January 13, 2004 - Samsung Electronics Co. said it will spend $1 billion on a production line to boost its output of DRAM chips, part of an overall 2004 capex budget of $4.4 billion.