Device Architecture

DEVICE ARCHITECTURE ARTICLES



TI boosts demand with supply deals

01/08/2004  January 8, 2004 - Texas Instruments has signed deals with South Korean firm DongbuAnam and Amkor Technology Inc. to increase production of its digital light processing (DLP) chips.

Infineon places bets on flash market

01/07/2004  January 7, 2004 - Infineon Technologies, Munich, Germany, has entered the flash market with the introduction of a NAND-compatible 512Mbit flash chip based in its TwinFlash technology.

SIA: Chip sales on track for double-digit gains

01/06/2004  January 6, 2004 - Worldwide semiconductor sales continued to report solid gains in November 2003, posting growth for the ninth consecutive month and a solid double-digit increase from a year ago, according to data from the Semiconductor Industry Association (SIA).

Korean trade deficit shoots up

01/05/2004  January 5, 2004 - South Korea's imports of semiconductor products in 2003 grew 22.1% to $20.77 billion, outpacing a 16.7% increase in exports to $18.82 billion.

Intel expanding chip plans in India

12/29/2003  December 23, 2003 - For its new 32-bit processor which will replace its Xeon processor trend, Intel Corp.'s development center in Bangalore is doing end-to-end development, not just design -- a trend that's gaining momentum in India.

Renesas boosts flash investment

12/26/2003  December 26, 2003 - Renesas, the JV of Hitachi and Mitsubishi Electric, plans to invest another 33 billion yen ($307.7 million) to help boost monthly production capacity of AG-AND flash memory.

STMicro buys wireless chip developer

12/19/2003  December 19, 2003 - STMicroelectronics has acquired Synad Technologies Ltd., a UK startup developing wireless LAN technologies.

Cree stakes new GaN claim

12/15/2003  December 15, 2003 - Cree Inc., Durham, NC, says it has developed new gallium nitride power transistors with much higher power densities than previously achieved.

Inotera boosting capex through 2006

12/15/2003  December 15, 2003 - Inotera Memories Inc., a JV between Taiwan's Nanya Technology Corp. and Germany's Infineon Technologies AG, plans to invest $2.2 billion over the next three years to build up its 300mm wafer plant, used primarily for DRAM chips.

FASL boosting Flash capacity

12/10/2003  December 10, 2003 - -- FASL LLC, Sunnyvale, CA, plans to ramp manufacturing capacity for Spansion Flash memory products in 2004 to meet demand from AMD and Fujitsu for wireless products.

IMEC, Sematech, TI join high-k club

12/10/2003  December 10, 2003 - The past week has been busy for high-k materials, with three separate announcements from companies and organizations detailing the progress of their research.

TI, Swiss institute envision hybrid chip

12/10/2003  Texas Instruments Inc. is working with the Swiss Federal Institute of Technology at Lausanne on a chip combining standard semiconductor and single-electron transistors (SET) that could shrink the size and power consumption of computing devices, according to a news release.

IBM's directed self-assembly one facet in broad nanotech program

12/09/2003  Chuck Black and Kathryn Guarini demonstrated their nanotech breakthrough with strands of pipe-cleaner wire. In a preview of today's announcement, the two IBM researchers explained how they coaxed two different polymers – stringy molecules they represented with different-colored pipe cleaners – to assemble themselves into a honeycombed template of 20-nanometer holes.

Toshiba, SanDisk to build NAND plant

12/04/2003  December 4, 2003 - Toshiba Corp. and SanDisk reportedly plan to build a facility for producing NAND flash memory chips by 2005

Toshiba to boost memory line

12/04/2003  November 26, 2003 - Toshiba Corp. reportedly plans to invest up to 12 billion yen to boost output at its facilities in Oita, Japan.

AMD offers 4Q guidance, stakes 300mm territory

12/04/2003  November 17, 2003 - At its annual analyst meeting, AMD, Sunnyvale, CA, said it expects to report higher 4Q sales for both chips and flash memory, thanks to increased consumer and corporate spending.

SIA: Monthly, quarterly chip sales heat up

12/04/2003  Worldwide semiconductor sales rose 6.5% in September to $14.4 billion, up 5.9% from $13.56 billion in August -- the seventh consecutive monthly increase and the biggest monthly percentage change in over a decade, according to data from the Semiconductor Industry Association (SIA).

Intel announces high-k/metal gate breakthrough

12/04/2003  Intel Corp. has presented results of its high-k/metal gate transistor development aimed at reducing current leakage as device dimensions shrink and transistor gate dielectrics become thinner.

Korea chip trade deficit shrinks

12/04/2003  South Korea's semiconductor trade deficit was slashed by 93% in the third quarter thanks to rising DRAM ASPs and a general global IT recovery, according to industry sources.

Toshiba raises capex to expand memory production in Japan

11/25/2003  (November 25, 2003) Tokyo, Japan—Toshiba Corp. today announced a boost in its semiconductor business capital expenditure that will expand memory production at Oita Operations in Kyushu.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts