Device Architecture

DEVICE ARCHITECTURE ARTICLES



Nanomaterial devices will be made using existig chips technology

11/20/2003  NOV. 20--NORWALK, Conn.--According to a soon-to-be-released updated report from Business Communications Company, Inc. (www.bccresearch.com), nanomaterial-based devices using RGB-286 will make it to market first and can be fabricated using current chip manufacturing processes and integrated with CMOS technology.

Biosensor gets funding for war on terror

11/13/2003  NOV. 13--PORTLAND, Ore.--A handheld device that can detect bio- and chemical agents in the event of a terrorist attack has received the thumbs-up from the National Science Foundation.

World's fastest transistor just got faster

11/07/2003  (November 7, 2003) Champaign, Ill.—Researchers at the University of Illinois at Urbana-Champaign have broken their own record for what is believed to be the world's fastest transistor. Their latest device, with a frequency of 509 gigahertz, is 57 gigahertz faster than their previous record holder and could find use in applications such as high-speed communications products, consumer electronics and electronic combat systems.

INDUSTRY NEWS

11/06/2003  WSTS forecasts market growth
(November 6, 2003) Brussels, Belgium—The World Semiconductor Trade Statistics (WSTS) recently released its Fall 2003 forecast, which says market indicators are pointing to growth from 2003 through 2005.

NEW PRODUCT HIGHLIGHTS

10/31/2003  Amkor's power SiP addresses thermal challenges
(February 3, 2004) Chandler, Ariz.—Amkor Technology Inc. is using its system-in-package (SiP) technology to solve the challenges of thermally demanding DC/DC power-conversion applications.

REPORT: Fab construction in three quarters of 2003 higher than all of 2002

10/28/2003  OCT. 28--SANTA CRUZ, Calif.--The most recent edition of The Quarterly Spot Report on Semiconductor Fab Projects, released by Strategic Marketing Associates (SMA), shows that the improving economy and growth in chip sales are boosting wafer fab construction activity.

Nantero, ASML link on nanotube chips

10/28/2003  Oct. 28, 2003 - Nantero Inc. has teamed up with the Netherlands-based ASML Holding NV to prove compatibility between Nantero's carbon nanotube materials and ASML's semiconductor equipment, according to a news release.

Hynix revenues up, loss reduced

10/24/2003  October 23, 2003 - Korea's Hynix Semiconductor reported 3Q03 revenues (not including overseas subsidiaries) of $832 million, up 27% from 2Q03, due in part to a 20% jump in DRAM ASPs.

Five major chipmakers join IMEC's sub-45nm research platform

10/20/2003  IMEC, the independent microelectronic research center based in Leuven, Belgium, announced at its annual research review meeting on Oct. 13 that five major chipmakers have joined the center's sub-45nm research platform.

Samsung reports rising profits

10/20/2003  October 17, 2003 - Korea's Samsung Electronics Co. Ltd. wowed investors with a 3Q03 profit up 6.6% from last year, due to record sales of flash memory chips used in digital cameras and mobile devices.

Atmel opens foundry service

10/16/2003  October 9, 2003 - Atmel Corp., Heilbronn, Germany, has opened a foundry service for its SMARTIS BCD-on-SOI technology, which combines bipolar, CMOS, and DMOS technology.

ProMOS post 3Q profit

10/16/2003  October 14, 2003 - ProMOS Technologies, Taiwan's third-largest memory chip manufacturer, posted its first quarterly profit of the year in 3Q, reporting a net income of $25.8 million on revenue of $218 million.

Nanya posts 3Q loss

10/16/2003  October 13, 2003 - Taiwan's Nanya Technology Corp. posted a $5 million net loss in 3Q03, compared with a $17.million profit in 3Q02. The company reported a $57 million loss in 1H03.

Samsung to boost chip sales

10/16/2003  October 10, 2003 - South Korea's Samsung electronics Co. Ltd. says it will boost memory chip sales to $10 billion next year, largely on the back of its NAND flash memory chips.

Micron launches high-speed Flash

10/16/2003  October 7, 2003 - Micron Technology Inc., Boise, ID, has unveiled a newFlash memory technology offering the highest throughput available for 2.5G and entry-level 3G handsets.

Transmeta picks Fujitsu for foundry

10/16/2003  October 7, 2003 - Fujitsu has signed a deal with mobile chipmaker Transmeta to be the foundry for Transmeta's 2GHz Efficeon processors.

In topsy-turvy nano, 'crackpots' seem downright respectable

10/13/2003  So, what's a nice nanotech entrepreneur like James Clements doing in a place like this? The founder of Nanosciences Inc., a man with impeccable business credentials, has apparently fallen in with a bad crowd, hanging out here with a bunch of "crackpot" scientists at last weekend's 11th Foresight Conference on Molecular Nanotechnology.

Samsung unveils NAND, DRAM advancements

10/03/2003  October 1, 2003 - South Korea's Samsung Electronics Co. Ltd. has developed 4Gbit NAND Flash memory using 70nm process technology, and a 512Mbit DRAM device using 80nm processes.

SIA: August chip sales continue to climb

10/03/2003  Worldwide semiconductor sales totaled $13.42 billion in August, representing one of the strongest monthly increases in August in a decade, according to data from the Semiconductor Industry Association (SIA).

Stain-resistant pants are so ‘last week’; try the odor-free socks

10/03/2003  One of the hottest trends in the fashion industry today is invisible to the naked eye. Nanoscale enhancements to classic materials like cotton and novel nanoengineering of synthetic fibers are leading to the high-tech couture of tomorrow. But wash, wear, and wipe duds are just the first swatches of nano-tech to make it onto garment racks.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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