01/23/2015  Scientists from ICFO, MIT, CNRS, CNISM and Graphenea have now demonstrated active, in-situ electrical control of the energy flow from erbium ions into photons and plasmons.

01/23/2015  With its high electrical conductivity and optical transparency, indium tin oxide is one of the most widely used materials for touchscreens, plasma displays, and flexible electronics. But its rapidly escalating price has forced the electronics industry to search for other alternatives.

01/20/2015  Leading industry experts provide their perspectives on what to expect in 2015. 3D devices and 3D integration, rising process complexity and “big data” are among the hot topics.

01/20/2015  DRAM shifts out of a slump, but sector still faces obstacles.

01/16/2015  University of Wisconsin-Madison materials engineers have made a significant leap toward creating higher-performance electronics with improved battery life -- and the ability to flex and stretch.

01/16/2015  Princeton University researchers have built a rice grain-sized laser powered by single electrons tunneling through artificial atoms known as quantum dots.

01/15/2015  Samsung Electronics Co., Ltd. announced today that it has begun mass producing the industry’s first 8 gigabit (Gb) GDDR5 DRAM, based on the company’s leading-edge 20-nanometer (nm) process technology.

01/15/2015  UC Berkeley Extension announces three online integrated circuit (IC) semiconductor technology programs to meet the training needs of the surging worldwide semiconductor industry; the industry is predicted to reach $345 billion in sales this year.

01/14/2015  JEOL USA and the University of California's Irvine Materials Research Institute (IMRI) have entered into a strategic partnership to create a premier electron microscopy and materials science research facility.

01/13/2015  New research helps pave the way toward highly energy-efficient zinc oxide-based micro energy harvesting devices with applications in portable communications, healthcare and environmental monitoring, and more.

01/12/2015  Graphene combined with the insulting power of boron nitride enables light control in tiny circuits with dramatically reduced energy loss.

01/12/2015  SEMI today announced details from the SEMI World Fab Forecast Report illuminating the state of the semiconductor manufacturing industry, coincident with convening SEMI’s Industry Strategy Symposium (ISS) in Half Moon Bay, Calif.

01/06/2015  ON Semiconductor has successfully characterized and demonstrated its first fully-functional stacked CMOS imaging sensor featuring a smaller die footprint, higher pixel performance and better power consumption compared to traditional monolithic non-stacked designs.

01/06/2015  A Northwestern University-led team recently found the answer to a mysterious question that has puzzled the materials science community for years--and it came in the form of some surprisingly basic chemistry.

01/06/2015  SEMI Europe will ring in the New Year by holding the first major, international 3D TSV event of 2015. On January 19-21, members of the 3D TSV industry will convene in Grenoble, France for the 3rd edition of the European 3D TSV Summit.

12/23/2014  The future of the semiconductor industry continues to shine brightly.

12/23/2014  Worldwide semiconductor market revenue is on track to achieve a 9.4 percent expansion this year, with broad-based growth across multiple chip segments driving the best industry performance since 2010.

12/19/2014  Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical.

12/18/2014  Defects that aren’t detected inline cost fabs the most.

12/18/2014  Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling.