10/20/2014  IBM and GLOBALFOUNDRIES today announced that GLOBALFOUNDRIES will acquire IBM's global commercial semiconductor technology business.

10/17/2014  The 2nd annual SEMI Vietnam Semiconductor Strategy Summit, co-organized with the Saigon Hi-Tech Park and with FabMax as the premier sponsor, was held September 16-17, 2014 in Ho Chi Minh City.

10/16/2014  Intermolecular, Inc. announced this week that Dr. Bruce McWilliams has been appointed president and chief executive officer.

10/16/2014  The development of increasingly sophisticated and energy-efficient CMOS technology for mobile, client and cloud computing depends on a continuing stream of advances in the process technologies with which the complex integrated circuits are built.

10/15/2014  Specifications of reed relays, which are used for current switching in ATE and other applications are explained, including carry current, lifetime, minimum switch capacity, hot switching, operating speed and thermoelectric switching.

10/15/2014  IRLYNX and CEA-Leti today announced they have launched a technology-development partnership for a new CMOS-based infrared technology that will allow a new type of smart and connected detectors in buildings and cities.

10/13/2014  A novel metal gate integration scheme to achieve precise threshold voltage (VT) control for multiple VTs is described.

10/13/2014  Scientists at EPFL, working with Université Paris-Sud and Paul Scherrer Institut, have discovered that a common insulating material behaves as a perfect spintronic conductor because it is not affected by background electron charge.

10/09/2014  The wafer foundry market experienced a wavy development, jumping by 39.4 percent in 2010 following a 7.9 percent decline in 2009.

10/08/2014  The Semiconductor Industry Association announced that John P. Daane, President, CEO, and Chairman of the Board of Altera, has been named the 2014 recipient of SIA's highest honor, the Robert N. Noyce Award.

10/08/2014  Albert Theuwissen, CEO of Harvest Imaging and professor at Delft University of Technology, is the recipient of the European SEMI Award 2014.

10/07/2014  Samsung Electronics announced plans on Monday to invest $14.7 billion (15.6 trillion Korean won) in a new semiconductor fabrication facility in Pyeongtaek, South Korea.

10/07/2014  SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2014-?2016.

10/06/2014  Global capital spending on semiconductor equipment is projected to grow 21.1 percent in 2014 and 21.0 percent in 2015.

10/03/2014  Two-dimensional carbon 'paper' can form stretchable supercapacitors to power flexible electronic devices.

10/02/2014  ARM and TSMC today announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10FinFET process technology.

10/02/2014  Dow Corning, a developer of silicon and wide-bandgap semiconductor technology, announced that it now offers 150mm diameter silicon carbide (SiC) wafers under its Prime Grade portfolio.

10/01/2014  Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name.

10/01/2014  Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths.

09/30/2014  Electrical engineers at the Technische Universität München (TUM) have demonstrated a new kind of building block for digital integrated circuits.