Displays

DISPLAYS ARTICLES



4Kx2K LCD TV panel shipments expected to reach 2.5M in 2013

03/14/2013 

TFT LCD panel suppliers are forecast to ship 2.6 million 4K×2K LCD TV panels (also known as Ultra HD) worldwide in 2013, up more than 40-fold from 63 thousand in 2012, according to the latest NPD DisplaySearch Quarterly Large Area TFT Panel Shipment Report.

Arizona State and PARC produce world’s largest flexible X-ray detector

03/13/2013 

The Flexible Electronics and Display Center (FEDC) at Arizona State University and PARC, a Xerox company, today announced that they successfully manufactured the world's largest flexible X-ray detector prototype using advanced thin film transistors (TFTs).

Printed electronics sector takes hard look at the flexible future

03/12/2013 

The flexible and printed electronics community reports encouraging progress in the materials and process ecosystem needed for commercial production — and an increasingly realistic focus on applications that best capitalize on the technology’s strengths. Best near-term prospects now look to be sturdy light-weight displays, smart sensor systems, and flexible and large area biomedical sensors and imagers.

ITO film market undergoing a sea of changes

03/04/2013 

Touch panel makers are seeking ways to catch both greater specifications and lower cost at the same time, amid rapidly falling touch panel prices. Displaybank analyzed and forecasted the ITO film and glass market, technologies, and industry.

Corning believes flexible displays with Willow glass are still three years out

03/01/2013 

CEO believes that the technology may be made available in simple products this year.

New Product: Engineered Material Systems introduces die attach for temperature-sensitive applications

02/26/2013 

Engineered Material Systems, a global supplier of electronic materials for circuit assembly applications, debuts its DB-1568-1 low-temperature cure die attach adhesive for attaching semiconductor die in temperature-sensitive devices.

AMOLED TV panel market to see limited shipments in coming years

02/20/2013 

Although active-matrix organic light-emitting-diode (AMOLED) televisions headlined last month’s Consumer Electronics Show (CES), shipments of these high-end panels will remain limited in the coming years, according to the Displaybank at information and analytics provider IHS (NYSE: IHS).

FlexTech Alliance elects Keith Rollins Chairman of the Board

02/20/2013 

FlexTech Alliance, a developer of the flexible and printed electronics industry supply chain, announced today that Dr. Keith Rollins has been elected chairman of the Governing Board.

Production process doubles speed and efficiency of flexible electronics

02/20/2013 

Stretched-out clothing might not be a great practice for laundry day, but in the case of microprocessor manufacture, stretching out the atomic structure of the silicon in the critical components of a device can be a good way to increase a processor's performance.

ISSCC 2013: Imagers, MEMS, medical and displays

02/11/2013 

Roland Thomas, subcommittee chair of ISSCC, writes of the substantial growth and future in key areas of technology.

ISSCC 2013: Large-area flexible electronics

02/11/2013 

Hoi-Jun Yoo, subcommittee chair of ISSCC 2013, writes on the focus of technology directions in the field of large-area and low-temperature electronics.

Patent analysis: Flexible roll-to-roll processing

02/05/2013 

A new report from IHS Displaybank examined a total of 483 patents on roll-to-roll processing technologies, focusing on 32 that were flexible, OLED-related.

Touch panel market projected for 34% growth in 2013

01/30/2013 

The touch panel market size in 2012 was 1.3 billion units, a 39.4% growth over 2011. The market is projected to grow 34% in 2013, growing to more than 1.8 billion units, according to a new research report from Displaybank.

Keys to success: Testing in the New Mobile World

01/24/2013  The semiconductor industry is moving from a PC-centric, digital era to a communication and mobile world.

Key market and technology trends in the sub-20nm era

01/24/2013  Keeping up with Moore’s Law has always required significant investment and ingenuity, and this era brings additional challenges in device structures, materials and methodologies.

Can we keep on benefiting from Moore’s Law?

01/24/2013  For almost five decades, performance improvements and cost reduction of ICs have been cornerstones of the growth of the semiconductor industry.

Innovation and collaboration key in 2014

01/24/2013  As far as the outlook goes for 2014-2015, investments coming from the semiconductor and microelectronics industries are going to be pretty robust.

The shift to materials-enabled 3D

01/24/2013  Innovations in mobile computing and communications will continue to be a driving factor for the semiconductor equipment industry.

Coming year promises increased capital spending and continued need for effective industry collaboration

01/24/2013  For most of the past 15 years, the industry has displayed a fairly predictable pattern of fab equipment spending, characterized generally by two years of decline followed by two years of positive growth.

Outlook for semiconductors and the value chain in 2014

01/24/2013  We approach 2014 with a combination of positive policy, financial, and economic forces that will push world growth up to a +3% range.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts