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Solid State Technology
Adhesive Interconnect Flip Chip Assembly
The search for lead solder alternatives is stimulating interest in isotropic conductive adhesive assembly for flip chip interconnection.
Packaging Trends for the Next 10 Years
Having been involved in the iNEMI roadmaps, recent workshops organized by the NNI, SRC and NSF, and discussions with semiconductor and packaging folk, it’s apparent that the semiconductor folks have figured out what’s going to happen in the next 10 years.
SEMICON China 2005 Product Preview
Influence of Design on Package Assembly
Substrate design is largely driven by the performance requirements of a package and the fabrication limits of the supply chain.
In the News
Making It Practical
There are dreamers and schemers, but rarely are both qualities so evident as in the world of advanced packaging.
The Back End Process
The Art & Science of Wafer Dicing
Understanding The Comple
Understanding the Complexities of Solder Ball Pull Testing on BGAs
BALL TESTING ALTERNATIVES
The Challenges Of Qualif
The Challenges of Qualifying ‘Green’ Packages
NEW MATERIALS AND FAILURE ANALYSIS
Choosing the Right Thermal Interface Material
In the thermal management of microelectronics, the interface material layer between a chip and heat spreader presents the single largest barrier to heat flow in the packaging of high-power dissipation devices.