12/28/2012 

Researchers in Japan have devised a MEMS fabrication technology using lower-cost production methods of printing and injection molding, enabling MEMS devices to be applied for fields such as lighting -- and producable by firms outside the semiconductor sector.

12/18/2012 

Canon U.S.A., Inc. recently launched the FPA-3030i5+ i-line stepper, designed for the manufacturing of LEDs, MEMS and power semiconductors.

12/12/2012 

Taiwan makers of light-emitting diode (LED) products are unlikely to support a recovery in 2013 LED equipment spending due to an alarming cash crunch individually and sector-wide, warns one industry analyst.

12/11/2012 

In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.

12/06/2012 

KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.

11/28/2012 

EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.

11/27/2012 

Technology improvements and supportive legislation are gathering momentum to help push LED adoption for residential buildings -- the largest lighting application sector.

11/23/2012 

Growth in the industrial electronics semiconductor market is set to fall short of previous expectations in 2012 as the business is buffeted by weakening global economic conditions, with the LED market the sole bright spot, says IHS iSuppli.

11/19/2012 

Researchers from Rice U. say they have developed a micron-scale spatial light modulator (SLM) built on SOI that runs orders-of-magnitude faster than its siblings used in sensing and imaging devices.

11/16/2012 

The latest monthly numbers for semiconductor manufacturing equipment demand aren't pretty: lows in both orders and sales not seen since the last major downcycle three years ago, and the short-term comparisons continue to widen.

11/15/2012 

Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.

11/12/2012 

Wide bandgap semiconductor materials can significantly outperform traditional silicon-based devices in power electronics and light-emitting diodes (LEDs), but they're vastly more expensive. So where's the midpoint where GaN's capabilities and extra costs align to make it the preferred technology for each application?

11/08/2012 

Fujitsu Semiconductor says it has built a server power-supply unit with 2.5kW of output power using gallium nitride (GaN)-based power devices, and will ramp volume production of the power devices in late 2013.

11/02/2012 

There's a new battleground slowly emerging for OLEDs in lighting applications where the technology could offer some advantages in design and efficiency -- if panel makers are willing to make some sacrifices.

10/17/2012 

FlexTech Alliance announced the completion of a development project with Etched in Time, Inc. (EITI), for a plasma etch system that is compatible with a wide array of roll-to-roll equipment.

10/15/2012 

Researchers at the National Institute of Advanced Industrial Science say they have devised a way to selectively and nondestructively evaluate molecules within a sealed organic light-emitting diode (OLED) in operation, in hopes to further understand and eventually minimize performance degradation.

10/12/2012 

Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.

10/11/2012 

Soitec and Shin-Etsu Handotai (SEH) have extended their cooperation in Soitec's Smart Cut technology with an extended 10-year licensing agreement, including a new level of joint technology cooperation, to facilitate development and wafer supply of silicon-on-insulator (SOI) wafers.

10/10/2012 

Azzurro and Epistar say they have achieved GaN-on-Si based high-brightness LEDs on 150mm GaN-on-Si substrates, billed as "one step further towards implementation in mass production."

10/08/2012 

Solvay Specialty Polymers USA LLC has extended its line of high-performance polyester compounds with a new version targeting light-emitting diode (LED) TVs with higher heat and light stability.