LED Manufacturing

LED MANUFACTURING ARTICLES


AIXTRON wins repeat MOCVD order from LED maker

05/07/2012 

AIXTRON SE’s long-time customer Formosa Epitaxy Inc. (FOREPI) ordered several MOCVD systems: 4 CRIUS II-XL systems in a 19 x 4” wafer configuration and 2 G5 HT reactors in a 14 x 4” wafer configuration.
LED makers qualify c-axis sapphire wafers from ARC Energy, Trinity Material

05/04/2012 

Sapphire wafers grown using ARC Energy’s Controlled Heat Extraction System furnaces for Trinity Material was certified for high-quality LED chip production at two leading LED chip companies.
Toyoda Gosei, Showa Denko form GaN LED JV

05/01/2012 

Showa Denko KK will transfer 70% of its gallium-nitride (GaN)-based blue light emitting diode (LED) chip business into a new company, TS Opto Co. Ltd, with Toyoda Gosei Co. Ltd.
LED manufacturer Lumichip expands in Finland, opens development center

04/27/2012 

Lumichip Limited, an LED manufacturer, expanded its commercial operations in Finland and opened a new development center in Espoo, Finland.
MEI semiconductor wet process tools built to prevent contamination

04/27/2012 

MEI uses Vycom Flametec PVC-C for chemical rinse tanks and other wafer-contacting elements of its process tools, reducing tool-based contamination and protecting fab workers. Bill McGinty, MEI operations manager, discusses the benefits the new-generation plastic for semiconductor fab tools.
LED maker orders multiple fab tools from OEM Group

04/26/2012 

OEM Group began shipping a multi-tool order to a major LED manufacturer, including Spray Ozone Tool and Spray Acid Tool semi-automated batch surface preparation systems.
Round LEDs released by Luminus Devices

04/23/2012 

Luminus Devices Inc. unveiled its round LED architecture, meeting the circular aperture designs of many optical devices.
Nichia sued over LED fab IP by Everlight

04/23/2012 

Everlight Electronics Co. Ltd. filed a patent infringement lawsuit against Nichia Corp., seeking enforcement of a patent covering LED metallization technology, and asked that 2 Nichia patents on LED phosphor technology be rendered invalid.
MOCVD and MBE epitaxy trends for compound semiconductors

04/20/2012 

The corresponding combined revenue opportunity for MBE and MOCVD is estimated to be around US $6.1 billion for the 2012-2020 periods, shows Yole Développement.
As LEDs ramp, GaAs wafers shift from SI to SC type

04/19/2012 

Boosted by LEDs, semiconducting (SC) GaAs substrates will lead growth of the GaAs market. In 2011, semi-inductive (SI) GaAs substrates held ~56% (M$) of the overall GaAs substrate market (SC GaAs held ~44%), a trend that is likely to reverse in the short term.
EPIC names new director general, promises closer ties with EU

04/19/2012 

EPIC, the European Photonics Industry Consortium, announced at its annual general meeting that Carlos Lee has been appointed as director general, succeeding Thomas Pearsall, who has led the association since its founding in 2003.
Veeco to invest in Korea’s LED industry

04/17/2012 

Veeco Instruments Inc. recently participated in an investment signing ceremony at the 2012 Korea Investment Forum in New York City to commemorate the Company’s substantial investment in a new R&D facility in Seoul, Korea to advance high brightness light emitting diode (LED) technology.
MOCVD suppliers await H2 payoff for H1 LED gains

04/16/2012 

Positives for LED makers -- improved utilization rates in Taiwan, growing LED lighting demand -- will not immediately equal more orders for MOCVD tool suppliers, reports Barclays Capital. The analysts expect 525 MOCVD tool orders in 2012, most in the second half of the year.

Veeco ion beam deposition tool matches PVD speed

04/16/2012 

Veeco Instruments Inc. debuted the SPECTOR-HT ion beam deposition tool for thin-film deposition in optical products, such as lasers, telecommunications chips, and more.
LED researchers install VECO MOCVD in Korea

04/13/2012 

LED-IT Fusion Technology Research Center of Korea tapped Veeco for a TurboDisc K465i GaN MOCVD system for research and development of LEDs, including green LEDs and UV versions.
Cree LED achieves 254 lumen/watt on SiC, optimized chip/packaging tech

04/13/2012 

Cree Inc. (Nasdaq:CREE) achieved 254 lumen/watt on a white-light, power LED in research. The correlated color temperature is 4408 K.
Vacuum pumps improve throughput by 90% with new rotary design

04/10/2012 

Edwards Limited uncrated the STP-iXR1606 series magnetically-levitated turbo-molecular pumps (TMP) with fully integrated onboard controllers. Its new rotary design improves throughput by about 40% at high gas flow rates; nearly 90% percent in maximum gas flow.
Power electronics grow on SiC and GaN innovation

04/05/2012 

Power electronics will grow to $15 billion in sales of discrete components in 2020, says Lux Research. New materials -- SiC and GaN -- are taking a 22% market share for $3.3B in sales. Expect this year to set a record for funding to power electronics companies.
SEMICON West heralds 22nm, EUVL, 450mm, mobile electronics speakers

04/02/2012 

Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.
LED fab JV forms between Viper Networks and acquisition target

04/02/2012 

An LED manufacturing joint venture is the “final due diligence” Viper Networks Inc. will execute with its targeted acquisition: a profitable LED manufacturing company in the US.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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