LED Manufacturing

LED MANUFACTURING ARTICLES



As LED patents run out, supply chain value will shift downstream

03/30/2012 

Barclays Capital finds that LED manufacturing and materials patents will soon run out, potentially draining value from material/chip/package suppliers and turning LEDs into commodities.

MOCVD advances, InGaN enable record HEMT material from Kopin

03/29/2012 

Kopin Corporation achieved record 1290cm2/V.s electron mobility and 240ohms/square sheet resistance results from GaN-based high electron mobility transistor (HEMT) materials.

LED replacement lamp market to shift from developed to developing countries

03/29/2012 

LED replacement lamps for legacy lighting sources will see 30% unit growth 2012-2016, says Strategies Unlimited. But ASPs will fall 14%/year in that time.

LED manufacturing tool orders to dip in 2012 between LED demand waves

03/29/2012 

LED revenues are slowing down in 2012, after two years of remarkable growth, according to Strategy Analytics. LED fab equipment spending and epitaxial substrate demand in the LED sector will decline in 2012.

Optoelectronics, sensors, and discretes saw record year in 2011, beat IC growth

03/28/2012 

Strong demand for MEMS sensors, CMOS image sensors, LEDs, fiber-optic laser transmitters, and power transistors enabled the OSD semiconductors market to grow by 8% in 2011, hitting a new record revenue and beating out the overall IC market, according to IC Insights.

MOCVD sales halved from 2011 to 2012

03/23/2012 

342 MOCVD tools for LED manufacture will ship in 2012, compared to 654 last year, IMS Research reports in its most recent GaN LED Quarterly Supply and Demand report. Without China, the market would be nearly still.

SEMICON Europa 2012 seeks presenters

03/23/2012 

SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.

Kaistar to fab LEDs with ultra-high-purity ammonia from LLH China

03/22/2012 

Linde LienHwa (LLH) China will be the exclusive gas supplier to Kaistar, delivering bulk gases and high-purity ammonia (NH3) to Kaistar’s new LED production facility in Xiamen, China.

SUSS combines resist coat and develop platforms

03/19/2012 

SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.

CVD Equipment doubles manufacturing space with new NY facility

03/19/2012 

CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.

Silicon Genesis wafering tool designed for solar, LED, packaging sectors

03/19/2012 

SiGen developed its second-generation production system for fabricating thin-silicon solar wafers, as well as HB-LED, and 3D semiconductor packaging wafers. The system tailored for silicon, GaAs, germanium, SiC, GaN and sapphire materials.

AIXTRON wins MOCVD customer making LEDs in China

03/16/2012 

AIXTRON SE sold 5 multi-wafer MOCVD systems to a new customer, Huaian Aucksun Optoelectronics Technology Ltd., China. The tools will grow materials for HB-LEDs.

AIXTRON opens MOCVD training center in China

03/16/2012 

AIXTRON's training and demonstration center in Suzhou, China, will focus on improving MOCVD in advanced semiconductor and LED manufacturing operations around China, as well as on employee and environmental safety in electronics production environments.

SAFC Hitech expands LED precursor production in Taiwan

03/15/2012 

SAFC Hitech opened a multi-million dollar 270000sq.ft. expansion at its facility in Kaohsiung, Taiwan, increasing capacity for high-quality LED precursor production.

MATHESON incorporates RFID, pressure monitoring in compressed gas control system

03/14/2012 

MATHESON debuted the Lasso System, a customer-centric supply chain and inventory management system that can monitor the location and operating status of gas products and other assets in the REAL-Time Gas and Asset Management System.

Silicon wafers sliced to 10% conventional bulk with Hyperion 3

03/14/2012 

Twin Creeks Technologies, semiconductor and solar cell manufacturing equipment supplier, debuted its first commercial silicon wafer production system that reduces solar module and semiconductor device wafers by up to 90%.

LED phosphor provider Intematix raises $16.2M from investors

03/13/2012 

Intematix, phosphor and phosphor component maker for high-quality LEDs, received $16.2 million in funding from Draper Fisher Jurvetson and Crosslink Capital, as well as a new financial investor.

Media tablets join top 5 semiconductor end-markets in 2012

03/09/2012 

Media tablets, experiencing "remarkably rapid ascension," will become the 4th largest application for semiconductors by 2014, up from 35th in 2010, according to IHS.

China-based LED maker orders 3 AIXTRON MOCVD tools

03/08/2012 

AIXTRON received a new MOCVD systems order from existing customer Quantum Wafer Inc., China. The 3 additional MOCVD units will process HB-LED wafers based on GaN materials.

Nitrogen-rich indium nitride wafers debut from Meaglow

03/07/2012 

Meaglow Ltd., MOCVD and epitaxy supplier, launched a range of nitrogen-rich indium nitride (InN) wafers for research and industry development around the compound semiconductor material.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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