LED Packaging and Testing

LED PACKAGING AND TESTING ARTICLES



Present at ESTC 2012 in Amsterdam

02/21/2012 

Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.

IRPS set for April in Anaheim

02/21/2012 

The IEEE International Reliability Physics Symposium (IRPS) is set for April 15, 2012 – April 19, 2012, in Anaheim, CA.

Verticle takes hexagonal LED chips to mass production

02/20/2012 

Verticle began mass production of its hexagonal-shaped LED chip Honeycomb, developed with a proprietary copper substrate and chemical chip separation technology.

Present at Strategies in Light Europe

02/20/2012 

Strategies in Light Europe, September in Munich, is accepting presentation abstracts through February 29. Submit a paper on LED technology, LED manufacturing and the supply chain, markets, LED applications, or a related topic.

Shin-Etsu Chemical releases low-RI LED encapsulants

02/17/2012 

Shin-Etsu Chemical Co. Ltd.'s new KER-7000 Series silicone encapsulating materials offer a low (1.38) refractive index (RI) for HB-LED packaging with lower gas permeability and higher transparency.

LEDs, power semiconductors packaged with high-thermal-conductivity die attach adhesives

02/15/2012 

Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for LEDs and small power semiconductor die packaging.

Lithography, direct-attach LEDs, packaging trends at Strategies in Light Day 3

02/10/2012 

Day 3 of the 2012 Strategies in Light conference continued the LED Manufacturing session. Presenters covered LED manufacture, advanced packaging, metrology and testing, high-performance materials, and other topics, such as dimming. Blogger Michael A. Fury, Techcet Group, reports.

LED cost reduction to come from manufacturing: Strategies in Light

02/10/2012 

The manufacturing conference at Strategies in Light focused on methods for reducing cost through the manufacturing supply chain. Presenters discussed various methods of reducing manufacturing costs, from improved automation and standards implementation, automation to new packaging technologies. Laura Peters, LEDs Magazine, reports.

LED manufacturing highlights from Strategies in Light Day 2

02/09/2012 

Blogger Michael A. Fury, Techcet Group, reports from Day 2 of Strategies in Light: immersing himself in the LEDs manufacturing track of the conference.

Seoul Semiconductor keynote at Strategies in Light: Highlights

02/08/2012 

Chung Hoon Lee, CEO of LED manufacturer Seoul Semiconductor keynoted at Strategies in Light today. Lee’s keynote, "A View from Seoul," marked the first time a Korean LED maker has spoken at the conference. Following are highlights from his talk.

Top 10 LED manufacturers in 2011, and shifting regional dominance

02/08/2012 

The global HB-LED market grew from $11.3 billion in 2010 to $12.5 billion in 2011, surging 9.8%, according to Strategies Unlimited. 10 companies accounted for more than 68% of the global LED supply.

Strategies in Light: Day 1, LED Lighting Report, New Start-ups

02/08/2012 

The 2012 Strategies in Light conference kicked off today at the Santa Clara Convention Center with a series of five workshops, two tutorials and one all-day investor forum.

LED lighting increases power electronics complexity, drives new power supply market

02/03/2012 

"Opportunities for Power Components in LED Lighting" from IMS Research reveals that rapid uptake of LED lighting, driven by legislation and rising costs of electricity, will result in a potential market of 4 billion power supply units by 2016, worth $10 billion.

Hanwha moves to manufacture ElectriPlast moldable conductive plastic

02/03/2012 

Hanwha L&C of Korea signed a letter of intent to obtain manufacturing and distribution rights to ElectriPlast from Integral Technologies Inc, hybrid conductive plastics maker. The LOI is applicable for various parts of Asia.

Heraeus thick film division renames insulated aluminum materials system Celcion

01/31/2012 

The Thick Film Division of Heraeus announced a new name, Celcion, for its Insulated Aluminum Materials System. Celcion allows LED circuits to run cooler than MCPCBs.

Gamma Scientific uncrates LED tester

01/30/2012 

Gamma Scientific introduced a low-cost spectrometer for quick and accurate testing for LEDs. The RadOMA Lite linear CCD array spectrometer tests LED intensity and total flux. 

MOCVD cools down, LED downstream processing heats up

01/30/2012 

Requirements for LED processing equipment are changing from cost driven to more technology driven decisions, a clear trend to more complex and more efficient manufacturing, according to Thomas Uhrmann and Thorsten Matthias of EV Group.

Seoul Semiconductor LED patents top 10K mark

01/20/2012 

Seoul Semiconductor Co. Ltd. has applied, registered, and secured more than 10,000 patents for light emitting diodes (LEDs) globally. The company invests 10-20% of its annual revenue in R&D.

Cheaper LED backlights require LED, plate materials changes

01/18/2012 

Consumers are adopting LED-backlit LCD TVs more slowly than expected, prompting TV makers to design lower-power, lower-cost LED backlights using fewer LEDs per TV set, shows the NPD DisplaySearch Quarterly LED Backlight Report.

GaN LED market growth starts in 2012

01/17/2012 

The gallium nitride (GaN) LED market declined in 2011, but 2012 marks the beginning of a growth curve, with double-digit growth in 2013 and 2014, says IMS Research. Lighting revenues will overtake TV revenues for GaN LEDs a year earlier than expected.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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