02/23/2011 

As gold becomes more expensive, copper wire bonding becomes more appealing for chip packaging. Reverse bonding, fine-pitch bonding, looping, second bonds, and other technologies are ramping on roadmaps, according to Kulicke & Soffa (K&S).

09/03/2010 

Palomar Technologies introduced the fully automated 3800 Ultra Flexible Die Bonder for eutectic die attach, laser diode packaging and high-power LED packaging.

05/19/2009  Flip Chips and Flashlights by George A. Riley, Contributing Editor
With the industry's attention riveted on the next-generation of TSV- enhanced stacked - everything 3D marvels, we sometimes forget how microelectronics are changing everyday products in our world.

03/03/2008  By SST Editorial Staff

The SST Editorial Staff recaps SEMI's recent Industry Strategy Symposium (ISS), and the Strategic Materials Conference (SMC) that followed, with this special report series available only on our website.

01/23/2008  Last week hundreds of microelectronics industry executives gathered at ISS and SMC, absorbing the conventional forecasts for semiconductor manufacturing equipment and materials. But on the technology side, SMC showed truly amazing perspective on new electronic materials markets of gigantic scales like photovoltaics, high-efficiency lighting, and advanced 3D and WLP packages.

12/17/2007  ;Amtech Systems Inc., a global supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and silicon wafers, today announced that its subsidiary, Tempress Systems Inc., has received an additional $8.9 million in orders for diffusion processing systems from the solar cell industry.

11/15/2007  ; Two companies have recently launched new LED packaging products. Philips Lumileds has launched its new cool-white LUXEON K2 with TFFC LED that is designed, binned and tested for standard operation at 1000 mA and can be driven at 1500 mA. In addition, LedEngin Inc. has announced its 10W, multiwavelength RGBA emitter, the LZ4-00MA10, which contains individually addressable dies in an 7mm square power LED package.

11/15/2007  ; Accelerometers — devices that sense motion — have been with us for a long time, but only recently have they have been miniaturized as silicon-based devices. Consumer electronics makers who saw their hidden potential and built new products such as Nintendo's Wii, Apple's iPhone, and Activision's "Guitar Hero" game around them have achieved huge market success by revolutionizing the user-interface.

05/10/2007  TT electronics OPTEK Technology opened an in-house visible LED laboratory with resources to assess LED packages on junction temperature variation, optical performance, and other parameters. The lab aids in design, manufacturing, and test.

05/10/2007  Intel Capital, the venture capital branch of Intel Corporation, invested in six new companies, totaling $31 million. In the semiconductor space, Intel invested in China-based Phoenix Microelectronics.

11/13/2006  UTEK Corp., a specialty finance company focused on technology transfer, and Cyberlux Corp., a provider of LED lighting solutions, announced that Cyberlux has acquired SPE Technologies Inc., a wholly owned subsidiary of UTEK Corp., in a restricted stock transaction.

11/03/2005  November 4, 2005 - Officials from the US, Europe, Japan, South Korea, and Taiwan have agreed to eliminate duties on multichip packages (MCP) beginning in January 2006, praised by industry associations as a gesture of support for fast-growing technology areas.