LED Packaging and Testing

LED PACKAGING AND TESTING ARTICLES



Seoul Semiconductor files patent litigation for infringement of 12 Acrich patents

09/19/2017  Seoul Semiconductor Co., Ltd. announced on Sept. 19, 2017 that it has filed a patent infringement lawsuit, together with its affiliate, Seoul Viosys Co., Ltd., against Archipelago Lighting, Inc. in the U.S. District Court for the Central District of California.

Samsung’s new Q-series LED linear modules offer superior efficacy to improve premium indoor lighting

08/24/2017  Samsung Electronics Co., Ltd. today announced the launch of the “Q-series,” a new line-up of LED linear modules for use in premium indoor luminaire applications where an exceptionally high level of light efficacy* is required.

ROHM's new ultra-compact low profile 2-color chip LEDs

08/24/2017  Industry-small form factor contributes to thinner, more vibrant displays in industrial and consumer devices.

Infrared laser: At the heart of the industry in coming years

08/23/2017  In a depressed visible LED industry, manufacturers are looking at new opportunities to increase their revenues and margins. In this context, the IR LED market is perceived as a potential new ‘blue ocean’ with attractive opportunities for those players.

Seoul Semiconductor achieves continuous revenue growth

08/01/2017  The year over year rise in automotive lighting sales proved highly profitable for the company.

TrendForce reports 'micro LED-like' products will be available in 2018

07/21/2017  Breakthroughs in mass transfer have yet to materialize.

Harnessing hopping hydrogens for high-efficiency OLEDs

07/10/2017  Researchers at Kyushu University's Center for Organic Photonics and Electronics Research (OPERA) demonstrated that a molecule that slightly changes its chemical structure before and after emission can achieve a high efficiency in organic light-emitting diodes (OLEDs).

Pixelligent Technologies awarded $2.15M in grant funding from U.S. Departments of Energy, Defense

07/10/2017  Pixelligent Technologies, a nanocomposite advanced materials manufacturer, announced today that it has been awarded grant funding from the Department of Energy SBIR program and the Department of Defense STTR program, that totals a combined $2.15 million

Umicore inaugurates new production facility in Germany

06/29/2017  Umicore’s business unit Precious Metals Chemistry today inaugurated its production unit for advanced metal organic precursor technologies used in the semiconductor and LED markets.

Pixelligent Technologies named 2017 Manufacturer of the Year by Frost & Sullivan

06/19/2017  It won this award in the small/midsize company category for companies with revenues under $1B, for its PixClearProcess that is revolutionizing chemical composite technology.

Samsung achieves 220 lumens per watt with new mid-power LED package

06/15/2017  Samsung Electronics Co., Ltd. today announced that it has begun mass producing a new mid-power LED package, the LM301B, which features the industry's highest luminous efficacy of 220 lumens per watt.

Osram's next-generation of LEDs set new standards in miniaturization

06/14/2017  Osram Opto Semiconductors today presented the latest generation of surface-mountable LED, the Topled E1608, with a package smaller than its predecessor models by a factor of 20.

Dow Corning CL-1000 optical silicone binder extends thermal and optical performance for chip-scale LED package designs

06/09/2017  Dow Corning today introduced Dow Corning CL-1000 Optical Silicone Binder, a new, more thermally stable, high refractive index (RI) material available only in China that is formulated to expand design options for high-power chip-scale LED packaging (CSP).

2017FLEX Korea: First flexible hybrid electronics conference in Korea

05/10/2017  Today FlexTech, A SEMI Strategic Association Partner, announced the full agenda for the inaugural flexible hybrid electronics (FHE) conference coming up on May 31-June 1 in Seoul at COEX Exhibition Center.

SEMICON Southeast Asia 2017: Disruption and the value of digital transformation in manufacturing

04/17/2017  At SEMICON Southeast Asia 2017, Dr. Chen Fusen, CEO of Kulicke & Soffa Pte Ltd, Singapore, will give a keynote on digital transformation in the manufacturing sector.

LG Innotek launches UV LED module for sterilizing water purifier faucets

04/12/2017  LG Innotek succeeded in mass-producing ultraviolet (UV) LED module that sterilizes the inside of water purifier faucet aerators.

Seoul Semiconductor files patent infringement lawsuit in Germany asserting infringement of its high-power LED technology

04/12/2017  On March 31, 2017, Seoul Semiconductor Co., Ltd (Seoul) filed a patent infringement lawsuit in Germany in the District Court of Düsseldorf against Mouser Electronics Inc. (Mouser), a global electronic components distributor, asserting infringement of an LED patent.

LED Taiwan opens tomorrow in Taipei

04/11/2017  With a combined 500 booths, the exhibitions and conferences of LED Taiwan, opening tomorrow in Taipei, will attract over 12,000 visitors.

Optoelectronics, sensors/actuators, and discretes move toward normal growth rates

04/05/2017  Weakness in high-brightness LEDs lowered optoelectronics in 2016 while sensors/actuators got a needed boost from improved pricing.

Cree launches the industry’s brightest and most efficient royal blue LED

03/31/2017  Cree, Inc. announces the new XLamp XP-G3 Royal Blue LED, the industry’s highest performing Royal Blue LED.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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