LED Packaging and Testing

LED PACKAGING AND TESTING ARTICLES



Dr. Jonathan Rich appointed as Lumileds CEO

03/01/2019  Lumileds today announced the appointment of Dr. Jonathan Rich as Chief Executive Officer. Dr. Rich most recently served as Chairman and CEO of Berry Global, Inc., a Fortune 500 specialty materials and consumer packaging company, from 2010 to 2018.

New approach improving stability and optical properties of perovskite films

02/13/2019  Enabling perovskite LEDs longer lifetime.

200mm fabs to add 700,000 wafers through 2022, SEMI reports

02/12/2019  Robust demand for more content for mobile, Internet of Things (IoT), automotive and industrial applications will drive production of 700,000 200mm wafers from 2019 to 2022, a 14 percent increase, reports SEMI.

CEA-Leti combines integrated optics and holography in novel, lens-free augmented reality technology

02/06/2019  Leti, an institute of CEA-Tech, has developed a novel retinal-projection concept for augmented reality (AR) uses based on a combination of integrated optics and holography.

Physicists take big step in nanolaser design

02/06/2019  Nanolasers have recently emerged as a new class of light sources that have a size of only a few millionths of a meter and unique properties remarkably different from those of macroscopic lasers.

More stable light comes from intentionally 'squashed' quantum dots

01/11/2019  Exploiting new 'strain engineering' approach produces highly stable, narrow linewidth light from individual quantum dots.

Samsung unveils future of displays with groundbreaking modular microLED technology at CES

01/07/2019  Samsung Electronics Co., Ltd. today introduced its latest innovations in modular MicroLED display technology during its annual First Look CES event at the Aria Resort & Casino in Las Vegas.

Technique allows integration of single-crystal hybrid perovskites into electronics

12/18/2018  An international team of researchers has developed a technique that, for the first time, allows single-crystal hybrid perovskite materials to be integrated into electronics.

Seoul Semiconductor wins patent litigation against Everlight in Germany

12/12/2018  Seoul Semiconductor Co., Ltd. announced that it won a patent litigation against Everlight Electronics Co., Ltd. in Germany.

Colloidal quantum dots make LEDs shine bright in the infrared

12/05/2018  A group of ICFO researchers report on the development of a colloidal quantum-dot light emitting diode with unprecedented quantum and power conversion efficiencies in the infrared range. The study, published in Nature Nanotechnology, has proven that these devices can also be integrated in inorganic solar cells and may lead to even higher efficiencies.

Seoul Semiconductor expands patent infringement litigation against LED TV distributor

11/27/2018  Seoul Semiconductor Co., Ltd., a global innovator of LED products and technology, announced that it has expanded its patent infringement litigation against Fry's Electronics, Inc.

MiniLED technologies: An adoption, first driven by high-end LCD displays

11/27/2018  The excitement about microLEDs has grown exponentially since Apple acquired technology startup Luxvue in 2014.

EV Group partners with Plessey to drive GaN-on-Silicon monolithic microLED technology for AR applications

11/15/2018  Plessey, a developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass market.

Veeco and ALLOS technical collaboration accelerates the pace for 200mm GaN-on-Silicon microLED applications

11/08/2018  Veeco Instruments Inc. and ALLOS Semiconductors GmbH announced today the completion of another phase of their mutual effort to provide the industry with leading GaN-on-Silicon epiwafer technology for microLED production.

New efficiency record set for perovskite LEDs

11/05/2018  Researchers have set a new efficiency record for LEDs based on perovskite semiconductors, rivalling that of the best organic LEDs (OLEDs).

Exploring the structure and properties of new graphene-like polymers

11/02/2018  A team of scientists from Siberian Federal University (SibFU) together with foreign colleagues described the structural and physical properties of a group of two-dimensional materials based on polycyclic molecules called circulenes.

Seoul Semiconductor wins multiple patent litigations for Acrich MJT and driver technology

10/12/2018  In 2017, Seoul filed the first patent infringement lawsuit against Archipelago for infringement of 12 LED patents covering various aspects of Seoul’s long-established Acrich technology.

Apple, the best positioned to bring high volume consumer microLEDs to market

10/09/2018  MicroLED displays could potentially match or exceed OLED performance in all critical attributes.

Plessey chooses AIX G5+ C MOCVD tool for GaN-on-Silicon monolithic microLEDs display innovation

09/20/2018  Plessey, a developer of award-winning optoelectronic technology solutions, announces it has placed an order for its next reactor from AIXTRON SE.

MicroLEDs: Technology advancements pave the way for cost reduction

09/14/2018  MicroLEDs technologies are improving rapidly and new technology paths emerging at a rapid pace. According to Yole Developpement's analysts, technology solutions should start converging by the end of 2019.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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