LEDs

LEDS ARTICLES


Innovation and collaboration key in 2014

01/24/2013  As far as the outlook goes for 2014-2015, investments coming from the semiconductor and microelectronics industries are going to be pretty robust.
The shift to materials-enabled 3D

01/24/2013  Innovations in mobile computing and communications will continue to be a driving factor for the semiconductor equipment industry.

Coming year promises increased capital spending and continued need for effective industry collaboration

01/24/2013  For most of the past 15 years, the industry has displayed a fairly predictable pattern of fab equipment spending, characterized generally by two years of decline followed by two years of positive growth.

Outlook for semiconductors and the value chain in 2014

01/24/2013  We approach 2014 with a combination of positive policy, financial, and economic forces that will push world growth up to a +3% range.

Cyclical upturn continues in 2014: Positive yet cautious expectations persist

01/24/2013  In 2013, the IC industry emerged from a difficult 5-year period of minimal growth and started on its next cyclical upturn, a welcome piece of news.
Fraunhofer IAP opens pilot line for organic electronics

01/22/2013 

The Fraunhofer Institute for Applied Polymer Research (IAP) in Potsdam-Golm and fab/cleanroom developer MBRAUN have commissioned a new "near industrial-scale" pilot line for organic light-emitting diodes (OLEDs) and organic solar cells.
LED manufacturing investment declines as industry contemplates future directions

01/18/2013 

Spending on LED fab manufacturing equipment will decline 9.2% in 2013 as the industry faces weak long-term demand and consolidates manufacturing capacity.
SEMI approves first HB-LED standards

01/09/2013 

SEMI's HB-LED Standards Committee has approved its first standard, specifying sapphire wafers used in making high-brightness light-emitting diode (HB-LED) devices.
The gleam of well-polished sapphire

01/08/2013 

Is it time for high-brightness LED manufacturing to get serious about process control?  If so, what lessons can be learned from traditional, silicon-based integrated circuit manufacturing?
Look for 4K LCDs, OLEDs at CES

01/07/2013 

As the annual Consumer Electronics Show and hordes of techie enthusiasts descends over Las Vegas this week, NPD DisplaySearch revisits the battle between two display technologies -- 4K × 2K vs. OLEDs.
2013: Outlook for secondary equipment

01/03/2013 

The multibillion-dollar secondary or used semiconductor equipment market has gone through significant changes over the past five years and has become increasingly sophisticated in its approach.
2013: Fab Equipment Spending Shrinks Back to Flat

01/02/2013 

The SEMI Consensus Forecast and the SEMI World Fab Forecast, with data collected from two different methodologies, point to the same conclusion: 0% growth for 2013.

Low-cost MEMS fabrication using injection molding

12/28/2012 

Researchers in Japan have devised a MEMS fabrication technology using lower-cost production methods of printing and injection molding, enabling MEMS devices to be applied for fields such as lighting -- and producable by firms outside the semiconductor sector.
Canon stepper targets LED, MEMS, power device manufacturing

12/18/2012 

Canon U.S.A., Inc. recently launched the FPA-3030i5+ i-line stepper, designed for the manufacturing of LEDs, MEMS and power semiconductors.
Why Taiwan LED equipment vendors can't support a 2013 rebound

12/12/2012 

Taiwan makers of light-emitting diode (LED) products are unlikely to support a recovery in 2013 LED equipment spending due to an alarming cash crunch individually and sector-wide, warns one industry analyst.
#11: Fastest Ge p-MOSFET

12/11/2012 

#10: Visualizing CBRAM Filaments

12/11/2012 

#9: Record Silicon Nanowire MOSFETs

12/11/2012 

#8: 300mm wafer-scale Ge FinFET

12/11/2012 

#7: Hybrid Nanowire/CMOS Biosensor

12/11/2012 




WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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