10/30/2012 

This year is shaping up to be a historically lousy year for makers of flat-panel display (FPD) manufacturing equipment, but expectations are looking up that demand will catch up to supply in 2013 and balance the market, according to NPD DisplaySearch projections.

10/23/2012 

ProTek Devices says it is now offering individual unpackaged die for LEDs in wafer form, available as unidirectional and bidirectional electrostatic discharge (ESD) protection diodes.

10/17/2012 

FlexTech Alliance announced the completion of a development project with Etched in Time, Inc. (EITI), for a plasma etch system that is compatible with a wide array of roll-to-roll equipment.

10/15/2012 

Researchers at the National Institute of Advanced Industrial Science say they have devised a way to selectively and nondestructively evaluate molecules within a sealed organic light-emitting diode (OLED) in operation, in hopes to further understand and eventually minimize performance degradation.

10/12/2012 

Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.

10/11/2012 

Soitec and Shin-Etsu Handotai (SEH) have extended their cooperation in Soitec's Smart Cut technology with an extended 10-year licensing agreement, including a new level of joint technology cooperation, to facilitate development and wafer supply of silicon-on-insulator (SOI) wafers.

10/10/2012 

Azzurro and Epistar say they have achieved GaN-on-Si based high-brightness LEDs on 150mm GaN-on-Si substrates, billed as "one step further towards implementation in mass production."

10/08/2012 

Solvay Specialty Polymers USA LLC has extended its line of high-performance polyester compounds with a new version targeting light-emitting diode (LED) TVs with higher heat and light stability.

10/05/2012 

ON Semiconductor has joined imec to collaborate on the development of next-generation GaN-on-Si power devices. ON Semiconductor is presently building a GaN processing line in its Oudenaarde facility in Belgium Oudenaarde, and it is expected to employ GaN-on-Si technology.

10/04/2012 

Responding to consumer demand, TV suppliers are expanding their lineups of low-brightness LED backlight TVs with technology options that actually compete against each other more than traditional CCFL, according to DisplaySearch.

10/03/2012 

Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy,  the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.

10/02/2012 

Driven by market demand, the semiconductor industry is progressing toward consensus on building-block standards for automating LED production on 6-in wafers, explains Paula Doe in an article for SST sister magazine LEDs Magazine.

09/26/2012 

Sumitomo Chemical has joined the Holst Center's shared research program on printed organic lighting and signage, to contribute to research into multilayer solution processes for high-efficiency organic light-emitting diodes (OLEDs).

09/14/2012 

DAS Environmental Expert says it has a new system that offers a more environmentally friendly way to clean waste process gases produced in LED manufacturing.

09/12/2012 

Researchers at the Norwegian University of Science and Technology in Trondheim (NTNU)  have patented and are commercializing GaAs nanowires grown on graphene.

09/12/2012 

Stakeholders in LED manufacturing have met with US Department of Energy officials to plead their case for increased support in solid-state lighting (SSL) R&D and manufacturing, asserting that the technology's energy conservation benefits and ROI surpasses those of renewable energy technologies that get much more backing.

09/06/2012 

GaAs epitaxial substrate production rose just 3% in 2011 as handset power amplifiers offset a shift away from GaAs for handset switches, but inside that slowing slope are two key market drivers, according to Strategy Analytics.

08/31/2012 

Three leaders in their respective fields have formed a technology alliance to bring a new glass cutting technology to market. InnoLas Systems GmbH licensed process technology developed by FiLaser LLC and will use ultra-short pulse lasers produced exclusively for InnoLas by LUMERA LASER GmbH.

08/31/2012 

Cree announced the availability of high quality, low micropipe 150mm 4H n-type silicon carbide (SiC) epitaxial wafers. 150mm epitaxial wafers with highly uniform epitaxial layers as thick as 100µm are available for immediate purchase

08/23/2012 

MIT researchers are building various electronic components out of a 2D form of molybdenum disulfide (MoS₂). This is the start of a “new realm” of research into 2D materials for electronic materials and devices, according to one researcher.