LEDs

LEDS ARTICLES



LED balance of system trends: Patents in the remote phosphor technology space

07/16/2012 

Lily Li, patent strategist at IP Checkups, examines remote phosphors for LED bulbs, in "Patents compete for priority in the remote-phosphor LED technology space," LEDs Magazine, July/August issue.

LED bulb cost halved by 2020

07/16/2012 

The price of a LED bulb will fall by about half by 2020, hitting $11.06, according to Lux Research. With the LED chip package seeing 70%+ cost reduction, technology innovation will shift to the surrounding elements: thermal management, drivers and optics.

Oxford Instruments increases throughput on plasma etch and deposition tool

07/16/2012 

Oxford Instruments launched the PlasmaPro 100 etch and deposition tool for manufacturing MEMS, HB-LED, semiconductors, and other applications.

Terry Brewer chats about SEMI and semiconductors at SEMICON West

07/13/2012 

Terry Brewer, one of the newest members of SEMI's North American advisory board, talks about semiconductor industry consolidation, as well as new technologies and materials in the industry. He shares how SEMI is reacting to this evolution.

LED fab equipment capex to brighten in H2 2012

07/13/2012 

SEMICON West confirmed for Barclays that Q2 2012 orders for MOCVD tools remained flattish with the trough-like Q1 numbers, and LED makers are expected to order more tools in H2 2012.

Semiconductor fab tool capex trends gleaned @ SEMICON West

07/12/2012 

After meeting with various semiconductor manufacturing tool suppliers -- Applied Materials, KLA-Tencor, Lam Research, Tokyo Electron, Teradyne and Cymer -- at SEMICON West, Citi analysts share impressions on foundry spending plans and tool choices.

LED insights from SEMICON West 2012

07/11/2012 

Citi analysts surveyed the LED manufacturing market and LED demand at SEMICON West in San Francisco, CA, including a slight uptick in MOCVD orders, and some backlash against Cree's downstream ambitions.

SUSS coating/developing platform suits MEMS, packaging, LED fab, more

07/10/2012 

SUSS MicroTec uncrated the third generation of the ACS200 Coating and Developing Platform, developed from the company’s ACS200Plus and Gamma platforms for a compact, highly precise MEMS, LED, and related fab tool.

Soitec claims lower-cost GaN template wafers for LED fab with HVPE, partners with Silian

07/10/2012 

Soitec partnered with Silian to jointly develop GaN template wafers using hydride vapor phase epitaxy (HVPE). The resulting GaN template wafers will reduce the cost of manufacturing LEDs.

AMOLED manufacturing improvements to enable TV market share grab

07/09/2012 

AMOLED is entrenched in the small- and medium-sized displays market. For the technology to capture significant market share in the large-size, TV-bound display market, manufacturers will need to invest in better, higher throughput processing, shares Displaybank.

Top conference reports from H1 2012

07/06/2012 

We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.

Brighter LEDs with ARC Energy's sapphire technology

07/05/2012 

Sapphire grown in ARC Energy’s proprietary CHES yields 5% brighter LEDs than the industry standard, according to the company’s study.

Picosecond laser enables new high-tech devices

07/05/2012 

Industrially proven and robust, picosecond lasers are proving their worth in cutting and patterning of delicate materials for a wide variety of industrial applications.

SEMICON West preview: OLED displays and lighting adopt printing processes, flexible substrates

07/03/2012 

Technology for making circuits with organic materials, non-vacuum processes, and flexible substrates has made striking progress, but it’s been a challenge to find applications where the new technologies offer must-have advantages. Paula Doe, SEMI, reports on flexible and large-area OLED displays and lighting.

Cree, SemiLEDs end LED patent litigation with settlement

07/03/2012 

LED makers Cree Inc. (NASDAQ:CREE) and SemiLEDs Corporation (NASDAQ:LEDS) have agreed to end their respective patent infringement litigation against each other.

Vertical LED + metal alloy substrate = higher thermal endurance

07/02/2012 

SemiLEDs Corporation (NASDAQ:LEDS) combined its vertical LED chip architecture with a proprietary metal alloy substrate to create the Enhanced Vertical (EV) LED product line.

Samsung Mobile Display sources OLED materials from Novaled

07/02/2012 

Samsung Mobile Display (SMD) wiill purchase dopant materials used in the transport layers of its AMOLED display modules from Novaled. Novaled will also provide its proprietary PIN OLED technology to SMD for use in the production of SMD’s AMOLED display modules.

OLED thin-film encapsulation technology key to new applications

06/29/2012 

OLED thin film encapsulation technology is the one of technologies emerging as the core technology of flexible OLED, and technology development and patent securing competition between world’s leading OLED companies will increase accordingly, shows Displaybank.

SiC's advantages over silicon push more SiC semiconductors over 10 years

06/29/2012 

Silicon carbide (SiC) semiconductors will see 38% CAGR through 2022 thanks to power and efficiency advantages over silicon devices, according to MarketResearch.com.

ALD partnership enables surface functionalization of powders

06/29/2012 

Cambridge NanoTech entered a licensing agreement with Ghent University in Belgium to commercialize an ALD particle coating technology that uses thermal and plasma processes.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts