LEDs

LEDS ARTICLES


Ultratech brings former member back to Board

04/19/2012 

Ultratech, lithography and laser-processing system supplier to semiconductor manufacturers and packaging providers, added Michael C. Child to its Board of Directors. Child served on Ultratech
Veeco to invest in Korea’s LED industry

04/17/2012 

Veeco Instruments Inc. recently participated in an investment signing ceremony at the 2012 Korea Investment Forum in New York City to commemorate the Company’s substantial investment in a new R&D facility in Seoul, Korea to advance high brightness light emitting diode (LED) technology.
MOCVD suppliers await H2 payoff for H1 LED gains

04/16/2012 

Positives for LED makers -- improved utilization rates in Taiwan, growing LED lighting demand -- will not immediately equal more orders for MOCVD tool suppliers, reports Barclays Capital. The analysts expect 525 MOCVD tool orders in 2012, most in the second half of the year.

Veeco ion beam deposition tool matches PVD speed

04/16/2012 

Veeco Instruments Inc. debuted the SPECTOR-HT ion beam deposition tool for thin-film deposition in optical products, such as lasers, telecommunications chips, and more.
Intematix remote phosphor targets high-lumen small-size LED lights

04/16/2012 

Intematix released ChromaLit XT remote phosphor technology for high-lumen LEDs in small form factors, enabling blue LED packages instead of binned white LEDs.
LED researchers install VECO MOCVD in Korea

04/13/2012 

LED-IT Fusion Technology Research Center of Korea tapped Veeco for a TurboDisc K465i GaN MOCVD system for research and development of LEDs, including green LEDs and UV versions.
Cree LED achieves 254 lumen/watt on SiC, optimized chip/packaging tech

04/13/2012 

Cree Inc. (Nasdaq:CREE) achieved 254 lumen/watt on a white-light, power LED in research. The correlated color temperature is 4408 K.
AMOLED use in small/medium displays prompts more suppliers, more adopters

04/12/2012 

Active matrix organic light-emitting diodes (AMOLEDs) are moving from small-quantity development into higher volumes, with shipments destined for smartphones driving growth in the small- and medium-sized display market in February, said IHS.
Vacuum pumps improve throughput by 90% with new rotary design

04/10/2012 

Edwards Limited uncrated the STP-iXR1606 series magnetically-levitated turbo-molecular pumps (TMP) with fully integrated onboard controllers. Its new rotary design improves throughput by about 40% at high gas flow rates; nearly 90% percent in maximum gas flow.
Power electronics grow on SiC and GaN innovation

04/05/2012 

Power electronics will grow to $15 billion in sales of discrete components in 2020, says Lux Research. New materials -- SiC and GaN -- are taking a 22% market share for $3.3B in sales. Expect this year to set a record for funding to power electronics companies.
OLED adhesive cures at low temperatures to rubber-like consistency

04/05/2012 

Engineered Conductive Materials LLC uncrated a low-temperature curing conductive adhesive, DB-1541-LTC, for OLED assembly.
SABIC LED resins offer improved color under heat exposure

04/04/2012 

SABIC’s Innovative Plastics business released 3 Lexan LUX resin grades for LED applications such as light guides and lenses. They are transparent and use a new formulation to improve initial color, color stability, and light transmission during heat aging.
AMOLED display gives Samsung Galaxy Tab 7.7 the edge on weight, thickness, battery life

04/02/2012 

Samsung Electronics' Galaxy Tab 7.7 uses an AMOLED display, gaining benefits in the weight, thickness, and battery life, but at a higher material cost, says research firm Displaybank, part of IHS.
SEMICON West heralds 22nm, EUVL, 450mm, mobile electronics speakers

04/02/2012 

Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.
LED fab JV forms between Viper Networks and acquisition target

04/02/2012 

An LED manufacturing joint venture is the “final due diligence” Viper Networks Inc. will execute with its targeted acquisition: a profitable LED manufacturing company in the US.
As LED patents run out, supply chain value will shift downstream

03/30/2012 

Barclays Capital finds that LED manufacturing and materials patents will soon run out, potentially draining value from material/chip/package suppliers and turning LEDs into commodities.
SUSS buys Tamarack for lithography, laser structuring lines

03/30/2012 

SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.
MOCVD advances, InGaN enable record HEMT material from Kopin

03/29/2012 

Kopin Corporation achieved record 1290cm2/V.s electron mobility and 240ohms/square sheet resistance results from GaN-based high electron mobility transistor (HEMT) materials.
LED replacement lamp market to shift from developed to developing countries

03/29/2012 

LED replacement lamps for legacy lighting sources will see 30% unit growth 2012-2016, says Strategies Unlimited. But ASPs will fall 14%/year in that time.
LED manufacturing tool orders to dip in 2012 between LED demand waves

03/29/2012 

LED revenues are slowing down in 2012, after two years of remarkable growth, according to Strategy Analytics. LED fab equipment spending and epitaxial substrate demand in the LED sector will decline in 2012.



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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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