LEDs

LEDS ARTICLES

HB-LED grade aluminum nitride meets thermal needs of today's LEDs

02/24/2012

In this series, CMC Laboratories describes a new LED-grade AlN and what it accomplishes as a ceramic substrate. The AlN offers better heat dissipation for LED packages than alumina, at a lower cost than previous formulations.

LED packaging report reveals costs, reliability impact of package

02/24/2012

With thermal issues accounting for half of all lighting failures, and costs prohibitive to widespread adoption, assembly and packaging are keys to improving LEDs. TechSearch International tracks LED packaging materials and methods, as well as reliability and package efficiency.

SEMICON China: Challenges and opportunities for semiconductors, emerging techs

02/23/2012

SEMICON China takes place March 20-22 in Shanghai. Check out the special pavillions and events, and keynote speakers scheduled.

Present at coolingZONE LED 2012 in Berlin

02/23/2012

coolingZONE LED, May 29-31 in Berlin, is soliciting technical presentations on LED energy consumption, LED packaging, heat and air-flow simulations of LED products, and related topics.

MIT's nanowire growth control method could optimize LEDs, other semiconductors

02/22/2012

MIT researchers used gases to precisely control nanowires' width and composition as they grow, which could yield complex structures optimally designed for particular applications, like LED substrates or solar panels.

Chip substrate factory begins producing thermal-control substrates in Russia

02/22/2012

MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.

Present at ESTC 2012 in Amsterdam

02/21/2012

Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.

IRPS set for April in Anaheim

02/21/2012

The IEEE International Reliability Physics Symposium (IRPS) is set for April 15, 2012 April 19, 2012, in Anaheim, CA.

Verticle takes hexagonal LED chips to mass production

02/20/2012

Verticle began mass production of its hexagonal-shaped LED chip Honeycomb, developed with a proprietary copper substrate and chemical chip separation technology.

Samsung approves LED business absorption

02/20/2012

Samsung Electronics' Board of Directors approved a merger with Samsung LED, Ltd. The BOD also decided to request Samsung Mobile Display to pay infrastructure construction costs.

Present at Strategies in Light Europe

02/20/2012

Strategies in Light Europe, September in Munich, is accepting presentation abstracts through February 29. Submit a paper on LED technology, LED manufacturing and the supply chain, markets, LED applications, or a related topic.

Will Samsung reorganize LCD and AMOLED display units?

02/20/2012

Samsung Electronics is under rumors about spinning off its LCD manufacturing division, which could lead into a displays business restructuring involving Samsung Mobile Display and Samsung LCD. NPD DisplaySearch shares the root motivation for changes, and how Samsung's potential moves will affect the industry.

Shin-Etsu Chemical releases low-RI LED encapsulants

02/17/2012

Shin-Etsu Chemical Co. Ltd.'s new KER-7000 Series silicone encapsulating materials offer a low (1.38) refractive index (RI) for HB-LED packaging with lower gas permeability and higher transparency.

LED oversupply shrinks in 2012 on consumer demand uptick

02/16/2012

LED supply exceeded demand by 30% in 2011, thanks to poor LED TV sales and slow growth in lighting. Look for the industry to start close this gap in 2012, shows NPD DisplaySearch.

Iljin Materials and LED maker ILJIN Semiconductor plan merger

02/16/2012

Iljin Materials Co. Ltd., a developer and producer of elecfoils for use in the electronic components, has signed a statutory merger agreement with LED manufacturer ILJIN Semiconductor Co. Ltd.

LEDs, power semiconductors packaged with high-thermal-conductivity die attach adhesives

02/15/2012

Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for LEDs and small power semiconductor die packaging.

FPD manufacturers face 2012 crunch before 2013 rebound

02/14/2012

While the FPD industry faces severe challenges, long-term supply demand models show a positive future. DisplaySearch tracks the near- and long-term outlook for FPDs, with input from Barclays Capital and IHS.

Konica Minolta moves to MEMS for OLED-printing inkjet head

02/14/2012

In the company's first use of MEMS technology, Konica Minolta developed the KM128SNG-MB high-precision inkjet printhead for manufacturing printed electronics.

European microelectronics fab database tracks major changes over past 5 years

02/13/2012

Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.

Strategies in Light takeaways: LED expectations for the short- and long-term

02/13/2012

Jefferies' and Barclays' analysts attended the Strategy in Light conference in Long Beach, CA, and report on a challenging LED market with near-term positive boosts.

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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