LEDs

LEDS ARTICLES



Cree licenses remote phosphor patents to LED lighting makers

12/22/2011 

Cree Inc. (Nasdaq:CREE) granted 5 LED lighting manufacturers licenses to select Cree patents through its remote phosphor licensing program. Cree's licensing program facilitates the development of LED lights combining remote phosphor optical elements with blue LEDs.

Present at Strategies in Light Europe 2012

12/19/2011 

Strategies in Light Europe 2012, September 18-20 in Munich, Germany, is accepting abstracts through February 17. Strategies in Light Europe covers the rapidly growing LED lighting industry.

Novaled wins Deutscher Zukunftspreis for OLEDs

12/16/2011 

Organic light-emitting diode (OLED) company Novaled AG founders Professor Karl Leo, Dr. Jan Blochwitz-Nimoth, and Dr. Martin Pheiffer received the Deutscher Zukunftspreis from German Federal President Christian Wulff.

Cree LED simulation and testing options speed time-to-market

12/14/2011 

Cree Inc. added 2 Cree TEMPO offerings to its design and evaluation services: TEMPO (Thermal Electrical Mechanical Photometric Optical) thermal simulation and photometric testing.

LED inspection unit launches Altatech Semiconductor's LEDs line

12/14/2011 

Altatech Semiconductor S.A. launched its first LED inspection system, the non-contact AltaSight LEDMax, for detecting, classifying and characterizing defects on wafers used in manufacturing LEDs.

inTEST to acquire Thermonics division of Test Enterprises

12/13/2011 

inTEST will acquire the assets and certain liabilities of Thermonics from Test Enerprises. inTEST's Temptronic Corporation, of the Thermal Solutions Group, will integrate the company.

SEMICON West 2012: Submit an abstract today

12/12/2011 

SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.

Mentor Graphics integrates T3Ster and FloTHERM for power device thermal management

12/12/2011 

Mentor Graphics Corporation (NASDAQ:MENT) has combined technologies for thermal characterization and simulation with T3Ster hardware test products and its FloTHERM software, enabling better heat management in power semiconductor packages, such as LEDs.

KLIC appoints Director from telecom industry

12/09/2011 

Kulicke & Soffa Industries Inc. (NASDAQ:KLIC or K&S) named Chin Hu Lim to its Board of Directors, also serving on KLIC's Management Development & Compensation Committee.

Printed Electronics 2011: Chips, inks, tissue boxes, and apps in between

12/08/2011 

Techcet's Michael A. Fury spent a day at the recent Printed Electronics/Photovoltaics event, where discussions ranged from past, present, and future applications -- from e-readers, organic LEDs, TFTs, and printed ICs to tissue-box displays, explosive ink, and airplane wing sensors.

First LEDs fabricated on amorphous glass substrates

12/07/2011 

Researchers at the Samsung Advanced Institute of Technology and Seoul National University have demonstrated the first LEDs to be fabricated on amorphous glass substrates.

LED PSS etch station speeds throughput with higher temps

11/30/2011 

MicroTech has developed a wet process station to etch patterned sapphire substrate (PSS) wafers in a way that increases LEDs' light output and efficiency while increasing manufacturing throughput.

OSRAM envelops LED chip in reflective package

11/29/2011 

OSRAM Opto Semiconductors introduced the Oslon Square LED for lighting applications, packaged enclosed in a reflective layer to boost light output.

Applied Materials' 2011 supplier awards

11/15/2011 

Applied Materials Inc. (Nasdaq:AMAT) presented five companies with awards for helping Applied meet its strategic business goals in 2011.

LED maker shrinks heatsinks with air holes

11/10/2011 

LED lighting maker Gem Hsin Electronics reduced the size of heatsinks in its LED products by drilling miniscule holes beneath LEDs. The holes allow heated air to escape the LED package.

Thin-film chip boosts LED optical output without changing footprint

11/10/2011 

OSRAM Opto Semiconductors increased its IR Power Topled with lens optical output by 80% over the standard version by integrating a thin-film chip. The IR LED maintains the same surface area and drive current.

Philips Lumileds deploys MES from Camstar globally

11/10/2011 

Philips Lumileds, solid state lighting (LED) maker, deployed Camstar Systems Inc.'s Manufacturing Execution System (MES) at all global sites in less than 12 months.

LEDs and a MOCVD bubble: We've only just begun

11/09/2011 

Scanning the latest reports from a quartet of Wall Street analysts, a number of key themes emerge explaining what's driving a MOCVD slump in 2011-2012 (and maybe beyond), and how and when the situation might improve.

China lights up LED roadmap; Taiwan leaders seek similar support

11/07/2011 

China lays out its five-year plan to phase out old bulbs and spur LED demand; and Taiwan leaders invoke painful memories of DRAM and LCD market squeezes to urge more support for their own LED industry.

DuPont AMOLED fab tech draws TV display maker's interest

11/03/2011 

DuPont has signed a technology licensing agreement allowing an Asian display maker to use DuPont process technology to make large AMOLED television displays at significantly lower cost than alternative technologies.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts