08/30/2004  August 30, 2004 - Last week, Intel presented highlights of its 65nm process technology, which the company has demonstrated on fully functional 70Mbit SRAM chips containing more than 0.5 billion transistors (each cell contains six transistors). The news comes only nine months after the company's disclosure of its first 0.57 sq. micron SRAM logic cell at 65nm.

08/26/2004  August 26, 2004 - Albany Nanotech, the nanotechnology center located at the U. of Albany/State U. of New York, said that its College for Nanoscale Science and Engineering (CSNE) has installed and begun qualifying for 300mm wafers using a 193nm preproduction immersion lithography system.

08/25/2004  August 25, 2004 - EV Group today announced that a major Canadian research organization has joined its nanoimprint lithography (NIL) consortium formed to commercialize this technology.

08/23/2004  Applying a precision technique known as ion sputtering, Sterling, Va.-based 4Wave produces atomically thin films used for making next-generation optical chips. The 4Wave chips integrate four distinct optical filters and a reflective mirror on a flat glass surface.

08/18/2004  August 18, 2004 - Taiwanese foundry United Microelectronics Corp. (UMC) has made available its 0.18-micron embedded high-voltage technology process, used with portable LCD products to power transistors for applications such as cell phone displays.

08/17/2004 

08/16/2004  August 16--BERKELEY, Ca.--Ion Systems, a leading supplier of electrostatics management solutions for high technology and industrial applications, has announced the appointment of Conor O'Mahony as vice president of sales and services. Mr. O'Mahony will be responsible for worldwide sales and support of Ion technology products.

08/09/2004  August 9, 2004 - Tokyo Electron Ltd. (TEL) and European research organization CEA Leti have agreed to jointly research and develop front-end-of-line CMOS process technology, focusing on new materials for CMOS gate stacks.

08/02/2004  August 2, 2004 - Intel Corp. said it has finished installation of the world's first pilot line for extreme-ultraviolet (EUV) lithography at its 300mm Hillsboro, OR, facility, in an effort to move the technology out of R&D and on track for 32nm IC production by 2009.

08/02/2004  In every sense of the phrase, LumArray Inc. wants to rip the mask off the world of photolithography. Launched only this summer, the latest startup from MIT has a new technology to fire beams of light through a mosaic of micro-machined lenses onto a substrate.

07/22/2004  (BUSINESS WIRE, July 22, 2004) Petaluma, Calif.—Tegal Corporation has been granted United States Patents Nos. 6,689,220 and 6,756,318, which enable nano layer deposition (NLD) of conformal thin films for barrier, copper seed and high-K dielectric applications in advanced microprocessor and memory device production.

07/09/2004  June 9, 2004 - While SEMATECH turns its attention to 193nm immersion lithography development, Tokyo Electron Ltd. and European research consortium IMEC have expanded their collaboration on lithography technology to include 193nm immersion.

07/08/2004  June 8, 2004 - Applied Materials, Santa Clara, CA, has unveiled what it calls a "breakthrough" in chemical-vapor deposition technology: a CVD system that meets requirements for 65nm and below.

07/08/2004  July 8, 2004 - International SEMATECH, Austin, TX, has created an independent subsidiary of its R&D wafer fab and associated analytical laboratories, to offer a range of services including custom development and prototyping, wafer-processing, and analytical and electrical testing.

07/07/2004  July 7, 2004 - Fresh from shuttering its 157nm immersion lithography efforts, International SEMATECH has formed a 193nm Immersion Technology Center (iTC) to support development of the technology, and an initial project to focus on development of the world's first ultrahigh-NA (NA=1.3) 193nm wavelength immersion lithography tool.

06/22/2004  (June 22, 2004) Herndon, Va.—The National Electronics Manufacturing Initiative's (NEMI's) Component and Board Marking Project recently made recommendations for the identification of electronic components and board assemblies that have been modified for use in lead-free assembly processes.

06/21/2004  June 21, 2004 - The first tools should be arriving shortly at Photronics Inc.'s Austin, TX, facility, the company said today, as it outlined its plans and timing for the installation of advanced reticle manufacturing and process technology necessary to support semiconductor manufacturers building ICs with feature sizes for the 65nm node.

06/10/2004  The German city of Dresden is one of the country's shining stars with its plans to create a nanotech research center focusing on advanced chip development are successful. The government announced this week that it is in advanced talks in hopes of creating the center.

06/09/2004  June 9, 2004 -International SEMATECH has selected German lithography firm Carl Zeiss SMT to develop a defect review tool for 193nm immersion lithography photomasks.

06/08/2004  June 8, 2004 -- Cadence Design Systems Inc. and ASML MaskTools have agreed to a multi-year, multimillion dollar software licensing and joint development agreement for advanced RET software solutions.